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Número de pieza | BAS116 | |
Descripción | SURFACE MOUNT LOW LEAKAGE DIODE | |
Fabricantes | Diodes Incorporated | |
Logotipo | ||
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No Preview Available ! BAS116
SURFACE MOUNT LOW LEAKAGE DIODE
Features
Mechanical Data
• Surface Mount Package Ideally Suited for Automated Insertion
• Very Low Leakage Current
• Lead Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 3 and 4)
• Case: SOT-23
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Connections: Solderable per MIL-STD-202, Method
208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: See Diagram
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.008 grams (approximate)
SOT-23
TOP VIEW
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Repetitive Peak Forward Current
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0ms
@ t = 1.0s
TOP VIEW
Internal Schematic
Symbol
VRRM
VRWM
VR
VR(RMS)
IFM
IFRM
IFSM
Value
85
60
215
500
4.0
1.0
0.5
Unit
V
V
mA
mA
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 1) @TA = 25°C
Thermal Resistance Junction to Ambient Air (Note 1) @TA = 25°C
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Value
250
500
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Leakage Current (Note 2)
Total Capacitance
Reverse Recovery Time
Symbol Min Typ Max Unit
Test Condition
V(BR)R
85
⎯
⎯
V IR = 100μA
0.90
IF = 1.0mA
VF
⎯
⎯
1.0
1.1
V IF = 10mA
IF = 50mA
1.25
IF = 150mA
IR
⎯
⎯
5.0
80
nA VR = 75V
nA VR = 75V, Tj = 150°C
CT ⎯ 2 ⎯ pF VR = 0, f = 1.0MHz
trr
⎯
⎯
3.0
μs
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Notes:
1. Part mounted on FR-4 PC board with pad layout as shown on page 3.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAS116
Document number: DS30233 Rev. 9 - 2
1 of 3
www.diodes.com
May 2008
© Diodes Incorporated
1 page |
Páginas | Total 3 Páginas | |
PDF Descargar | [ Datasheet BAS116.PDF ] |
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