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PDF BFP405 Data sheet ( Hoja de datos )

Número de pieza BFP405
Descripción NPN Silicon RF Transistor (For low current applications For oscillators up to 12 GHz)
Fabricantes Siemens Semiconductor Group 
Logotipo Siemens Semiconductor Group Logotipo



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No Preview Available ! BFP405 Hoja de datos, Descripción, Manual

NPN Silicon RF Transistor
For low current applications
For oscillators up to 12 GHz
Noise figure F = 1.15 dB at 1.8 GHz
outstanding Gms = 22 dB at 1.8 GHz
Transition frequency fT = 25 GHz
Gold metalization for high reliability
SIEGET ® 25 - Line
Siemens Grounded Emitter Transistor
25 GHz fT - Line
SIEGET®25 BFP 405
3
4
2
1 VPS05605
ESD: Electrostatic discharge sensitive device, observe handling precaution!
Type
Marking Ordering Code
BFP 405 ALs
Q62702-F1592
Pin Configuration
1=B 2=E 3=C 4=E
Maximum Ratings
Parameter
Collector-emitter voltage
Collector-base voltage
Emitter-base voltage
Collector current
Base current
Total power dissipation, TS 120 °C
Junction temperature
Ambient temperature
Storage temperature
Thermal Resistance
Junction - soldering point 1)
Symbol
VCEO
VCBO
VEBO
IC
IB
Ptot
Tj
TA
Tstg
RthJS
Value
4.5
15
1.5
12
1
55
150
-65 ...+150
-65 ...+150
530
Package
SOT-343
Unit
V
mA
mW
°C
K/W
1) TS is measured on the collector lead at the soldering point to the pcb
SSeemmicioconndduuctcotor rGGrorouupp
11
Sep-109998-1-1919-081

1 page




BFP405 pdf
BFP 405
For non-linear simulation:
Use transistor chip parameters in Berkeley SPICE 2G.6 syntax for all simulators.
If you need simulation of thereverse characteristics, add the diode with the
C’-E’- diode data between collector and emitter.
Simulation of package is not necessary for frequenties < 100MHz.
For higher frequencies add the wiring of package equivalent circuit around the
non-linear transistor and diode model.
Note:
This transistor is constructed in a common emitter configuration. This feature causes
an additional reverse biased diode between emitter and collector, which does not
effect normal operation.
C
B
EE
EHA07307
Transistor Schematic Diagram
The common emitter configuration shows the following advantages:
Higher gain because of lower emitter inductance.
Power is dissipated via the grounded emitter leads, because the chip is mounted
on copper emitter leadframe.
Please note, that the broadest lead is the emitter lead.
The AC characteristics are verified by random sampling.
SSeemmicioconndduuctcotor rGGrorouupp
55
Sep-109998-1-1919-081

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