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PDF BLV859 Data sheet ( Hoja de datos )
| Número de pieza | BLV859 | |
| Descripción | UHF linear push-pull power transistor | |
| Fabricantes | NXP Semiconductors | |
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DISCRETE SEMICONDUCTORS
DATA SHEET
BLV859
UHF linear push-pull power
transistor
Product specification
Supersedes data of 1995 Oct 04
1996 Jul 26
1 page  
Philips Semiconductors
UHF linear push-pull power transistor
Product specification
BLV859
APPLICATION INFORMATION
RF performance at Th = 25 °C in a common emitter push-pull class-A test circuit.
MODE OF OPERATION
CW class-A
CW class-A
f
(MHz)
860
860
VCE
ICQ Po sync
(V) (A) (W)
25
2 × 2.25
≥20(1)
25
2 × 2.25
≥20(2)
Gp
(dB)
≥10(1)
≥10(2)
dim
(dB)
≤−54(1)
≤−51(2)
Notes
1. Three-tone test method (vision carrier −8 dB, sound carrier −10 dB, sideband signal −16 dB), 0 dB corresponds to
peak sync level.
2. Three-tone test method (vision carrier −8 dB, sound carrier −7 dB, sideband signal −16 dB), 0 dB corresponds to
peak sync level.
Ruggedness in class-A operation
The BLV859 is capable of withstanding a load mismatch corresponding to VSWR = 50 : 1 through all phases under the
conditions: VCE = 25 V; ICQ = 2 × 2.25 A; f = 860 MHz; Th = 25 °C; Po sync = 20 W.
80
handbook, halfpage
Po sync
(W)
60
40
20
MGD543
(1) (2)
14
handbook, halfpage
Gp
(dB)
(1)
(2)
10
6
MGD544
0
02 4 6 8
Pi sync (W)
VCE = 25 V; ICQ = 2 × 2.25 A; f = 860 MHz; (3-tone; −8/−16/−10 dB).
(1) Th = 25 °C.
(2) Th = 70 °C.
Fig.5 Output power as a function of input power;
typical values.
2
0 20 40 60 80
Po sync (W)
VCE = 25 V; ICQ = 2 × 2.25 A; f = 860 MHz; (3-tone; −8/−16/−10 dB).
(1) Th = 25 °C.
(2) Th = 70 °C.
Fig.6 Power gain as a function of output power;
typical values.
1996 Jul 26
5
5 Page 
Philips Semiconductors
UHF linear push-pull power transistor
PACKAGE OUTLINE
Product specification
BLV859
handbook, full pagewidth
2.47
2.20
0.13
2.54
10.4
max
21.85
8.51
8.25
(4x)
12
3
11.05
27.94
34.3 max
4
5.4
max
1.65
seating plane
0.25 M
3.3
3.0
9.8
15.6
max
5
MSA453
Dimensions in mm.
Torque on screw: min. 0.6 Nm; max. 0.75 Nm.
Recommended screw: cheese-head 4-40 UNC/2A.
Heatsink compound must be applied sparingly and evenly distributed.
Fig.15 SOT262B.
1996 Jul 26
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet BLV859.PDF ] | |
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