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PDF BLF404 Data sheet ( Hoja de datos )
| Número de pieza | BLF404 | |
| Descripción | UHF power MOS transistor | |
| Fabricantes | NXP Semiconductors | |
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DISCRETE SEMICONDUCTORS
DATA SHEET
M3D175
BLF404
UHF power MOS transistor
Product specification
Supersedes data of 1997 Oct 28
1998 Jan 29
1 page  
Philips Semiconductors
UHF power MOS transistor
Product specification
BLF404
handbook, h5alfpage
RDSon
(Ω)
4
MRA253
3
2
1
0
0 50 100 Tj (oC) 150
ID = 0.7 A; VGS = 15 V.
Fig.5 Drain-source on-state resistance as a
function of junction temperature;
typical values.
handbook, 5h0alfpage
C
(pF)
40
30
Cos
20
Cis
10
00 4 8
MRA246
12 16
VDS (V)
VGS = 0; f = 1 MHz; Tj = 25 °C.
Fig.6 Input and output capacitance as functions
of drain-source voltage; typical values.
handbook, 1h0alfpage
Crs
(pF)
8
6
4
2
0
04
MRA256
8 12 16
VDS (V)
VGS = 0; f = 1 MHz; Tj = 25 °C.
Fig.7 Feedback capacitance as a function of
drain-source voltage; typical values.
1998 Jan 29
5
5 Page 
Philips Semiconductors
UHF power MOS transistor
Product specification
BLF404
MOUNTING RECOMMENDATIONS
Both the metallized groundplate and leads contribute to the heatflow. It is recommended that the transistor is mounted
on a grounded metallized area of a maximum thickness of 0.8 mm on the printed-circuit board, equipped with at least 12
(0.5 mm diameter) through metallized holes filled with solder.
A thermal resistance Rth(mb-h) of 5 K/W can be achieved if heatsink compound is applied when the transistor is mounted
on the printed-circuit board.
full pagewidth
7.38 3.60
1.87 (2×)
0.60 (4×)
0.80 (2×)
0.50 (12×)
1.00 (8×)
Dimensions in mm.
1.00 (9×)
4.60
MGK390
Fig.15 Reflow soldering footprint for SOT409A.
1998 Jan 29
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet BLF404.PDF ] | |
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