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Número de pieza | BGY122B | |
Descripción | UHF amplifier modules | |
Fabricantes | NXP Semiconductors | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de BGY122B (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
No Preview Available ! DISCRETE SEMICONDUCTORS
DATA SHEET
M3D369
BGY122A; BGY122B
UHF amplifier modules
Product specification
Supersedes data of 1997 Dec 01
1998 May 11
1 page Philips Semiconductors
UHF amplifier modules
Product specification
BGY122A; BGY122B
handbook2, .h0alfpage
PL
(W)
1.6
1.2
0.8
MDA148
824 MHz
849 MHz
0.4
0
0 1234
VC (V)
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.
Fig.3 Load power as a function of control voltage;
BGY122A; typical values.
handbook,8h0alfpage
η
(%)
60
40
849 MHz
824 MHz
MDA149
20
0
0 0.4 0.8 1.2 1.6 2.0
PL (W)
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; Tmb = 25 °C.
Fig.4 Efficiency as a function of load power;
BGY122A; typical values.
2.0
handbook, halfpage
PL
(W)
1.6
1.2
0.8
MDA150
VS = 4.8 V
4V
0.4
0
820
830 840 850 860
f (MHz)
ZS = ZL = 50 Ω; PD = 2 mW; VC = 3 V; Tmb = 25 °C.
Fig.5 Load power as a function of frequency;
BGY122A; typical values.
1998 May 11
handbook2, .h0alfpage
PL
(W)
1.6
1.2
0.8
849 MHz
824 MHz
0.4
0
−40
0
40
MDA151
80 120
Tmb (oC)
ZS = ZL = 50 Ω; PD = 2 mW; VS = 4.8 V; VC = 3 V.
Fig.6 Load power as a function of mounting base
temperature; BGY122A; typical values.
5
5 Page Philips Semiconductors
UHF amplifier modules
Product specification
BGY122A; BGY122B
handbook, full pagewidth
footprint metallization
solder area
occupied area
8.75
2.9
17.7
12.5
12
6
1.8
1.37
5.08
5.08
17.9
1.7
2.54
4
6.75
12.5
1
0.57
0.7
solder area
17.1
12.4
12.1
6.4
2.7 1.1
2.45
7.55
5.55
1.67
1.37
5.08
5.08
1.5
2.54
0.5
MGM150
Dimensions in mm.
1998 May 11
Fig.20 Footprint SOT388B.
11
11 Page |
Páginas | Total 16 Páginas | |
PDF Descargar | [ Datasheet BGY122B.PDF ] |
Número de pieza | Descripción | Fabricantes |
BGY122A | UHF amplifier modules | NXP Semiconductors |
BGY122B | UHF amplifier modules | NXP Semiconductors |
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