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PDF BGA612 Data sheet ( Hoja de datos )
| Número de pieza | BGA612 | |
| Descripción | Silicon Germanium Broadband MMIC Amplifier | |
| Fabricantes | Infineon Technologies AG | |
| Logotipo |  |
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Data sheet, BGA612, Nov. 2003
BGA612
Silicon Germanium
Broadband MMIC Amplifier
MMIC
Secure Mobile Solutions
Silicon Discretes
Never stop thinking.
1 page  
BGA612
Maximum Ratings
Parameter
Device voltage
Device current
Current into pin In
Input power 1)
Total power dissipation, TS < 105°C 2)
Junction temperature
Ambient temperature range
Storage temperature range
Thermal resistance: junction-soldering point
Symbol
VD
ID
IIn
PIn
Ptot
Tj
TA
TSTG
Rth JS
Notes:
All Voltages refer to GND-Node
1) Valid for ZS=ZL=50Ω, VCC=5V, RBias=135Ω
2) TS is measured on the ground lead at the soldering point
Value
2.8
80
0.7
10
225
150
-65 ... +150
-65 ... +150
200
Unit
V
mA
mA
dBm
mW
°C
°C
°C
K/W
Electrical Characteristics at TA=25°C (measured in test circuit specified in fig. 1)
VCC=5V, RBias=135Ω, Frequency=2GHz, unless otherwise specified
Parameter
Symbol min. typ. max. Unit
Insertion power gain
f = 0.1GHz
f = 1.0GHz
f = 2.0GHz
|S21|2
- 17.5 -
- 17.0 -
- 15.8 -
dB
Noise Figure (ZS=50Ω)
f = 0.1GHz
f = 1.0GHz
f = 2.0GHz
F50Ω
- 1.95 -
dB
- 2.25 -
- 2.35 -
Output Power at 1dB Gain Compression
P-1dB
-
7
- dBm
Output Third Order Intercept Point
OIP3 - 17 - dBm
Input Return Loss
RLIn - 18 - dB
Output Return Loss
RLOut
-
21
-
dB
Total Device Current
ID - 20 - mA
Data sheet
5 2003-11-04
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet BGA612.PDF ] | |
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