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PDF N32901R1DN Data sheet ( Hoja de datos )

Número de pieza N32901R1DN
Descripción ARM926-based Media Processor
Fabricantes nuvoton 
Logotipo nuvoton Logotipo



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No Preview Available ! N32901R1DN Hoja de datos, Descripción, Manual

N3290x
Data Sheet
ARM926-based Media Processor
Nuvoton Technology Corp.
http://www.nuvoton.com/
1 Release Date: May. 2013
Rev. A5.1

1 page




N32901R1DN pdf
N3290X DATASHEET
1. GENERAL DESCRIPTION
The N3290xUxDN is built on the ARM926EJ-S CPU core and integrated with JPEG codec, CMOS sensor interface,
32-channel SPU (Sound Processing Unit), ADC, DAC, for meeting various kinds of application needs while saving the
BOM cost. The combination of ARM926 @ 200MHz, synchronous DRAM, 2D BitBLT accelerator, CMOS image
sensor interface, LCD panel interface, USB 1.1 Host & USB2.0 HS Device makes the N3290xUxDN the best choice
for LCD ELA devices.
Maximum resolution for the N3290xUxDN is XVGA (1,024x768) @ TFT LCD panel. The 2D BitBLT accelerator
accelerates the graphic compution to make the rendering smooth and off-load CPU to save power consumption.
The N3290xUxDN is well-positioned in terms of cost/performance for the applications which bitmap graphics is
extensively used or CMOS Image Sensor (CIS) interface is required.
The N3290xUxDN is for application under Linux OS and leverage the driver availability of emerging functionalities like
Wi-Fi, browser, etc. On the other hand, the open source code environment also give the product development more
flexible.
To meet the different requirement of the overall system BOM cost, the different size of DRAM is stacked with N3290x
main SoC into one package, that is, multi-chip package (MCP). The N32901U1DN is particularly designed with the
128-pin LQFP package and the 1Mbitx16 SDRAM is stacked inside the MCP. The N32903U1DN is particularly
designed with the 128-pin LQFP package and the 4Mbitx16 SDRAM is stacked inside the MCP. The 16Mbitx16
SDRAM is stacked inside the N32905UxDN MCP to ensure higher performance and minimize the system design
efforts, like EMI & noise coupling. Total BOM cost could be reduced by employing 2-layer PCB along with the
elimination of damping resistors, EMI prevention components, etc. Advantages including, but not limited to, less PCB
space, shorter lead time, and higher / reliable production yield.
1.1 Applications
ELA (Educational Learning Aid)
HMI
Security
Home Appliance
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Nuvoton Technology Corp.
http://www.nuvoton.com/
5 Release Date: May. 2013
Rev. A5.1

5 Page





N32901R1DN arduino
N3290X DATASHEET
Maximum 25MHz input clock supported
Maximum 400K/s conversion rate supported
LVR (Low Voltage Reset) supported
Power Management
Advanced power management including Power Down, Deep Standby, CPU Standby, and
Normal Operating modes
Normal Operating Mode
Core power is 1.8V and chip is in normal operation
CPU Standby Mode
Core power is 1.8V and only ARM CPU clock is turned OFF
Deep Standby Mode
Core power is 1.8V and all IP clocks are turned OFF
Power Down Mode
Only the RTC power is ON. Other 3.3V and 1.8V power are OFF
Software Support
Development Tools
Bootloader / Diagnostic Program / NAND Writer Program: ADS 1.2 or RVDS 2.x or 3.x
Linux Kernel (2.6.17.14) / System Manager: GCC 4.2
TurboWriter / Sync Tool: Microsoft VC 6.0
NAND Flash File System
FAT12, FAT16 and FAT32 with long filename are supported
Hidden disk is supported
RAM disk is supported
S/W audio Library
Decoders with ADPCM / MP3 / ACC / OGG / WMA format support
32-polyphony Wavetable MIDI synthesizer
Programmable sampling rate and target bit rate
USB Driver
MS (Mass Storage) Class
HID (Human Interface Device) Class
Operating Voltage
I/O: 3.3V
Core: 1.8V for 200MHz
Package
LQFP-128 (MCP, stacked with DDR @ 1.8V and SDR @ 1.8V)
Nuvoton Technology Corp.
http://www.nuvoton.com/
11 Release Date: May. 2013
Rev. A5.1

11 Page







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