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PDF IRF840 Data sheet ( Hoja de datos )

Número de pieza IRF840
Descripción N-Channel Power MOSFET / Transistor
Fabricantes nELL 
Logotipo nELL Logotipo

IRF840 datasheet


1. Power MOSFET, TO-220AB - Vishay






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SEMICONDUCTOR
IRF840 Series RRooHHSS
Nell High Power Products
N-Channel Power MOSFET
(8A, 500Volts)
DESCRIPTION
The Nell IRF840 are N-Channel enhancement mode silicon
gate power field effect transistors. They are designed, tested
and guaranteed to withstand a specified level of energy in the
breakdown avalanche mode of operation.
They are designed as an extremely efficient and reliable
device for use in a wide variety of applications such as
switching regulators. convertors, UPS, switching mode power
supplies and drivers for high power bipolar switching
transistors requiring high speed and low gate drive power.
These transistors can be operated directly from integrated
circuits.
FEATURES
RDS(ON) = 0.85Ω @ VGS = 10V
Ultra low gate charge(63nC Max.)
Low reverse transfer capacitance
(CRSS = 120pF typical)
Fast switching capability
100% avalanche energy specified
Improved dv/dt capability
150°C operation temperature
D
GDS
TO-220AB
(IRF840A)
D (Drain)
G
(Gate)
S (Source)
PRODUCT SUMMARY
ID (A)
VDSS (V)
RDS(ON) (Ω)
QG(nC) max.
8
500
0.85 @ VGS = 10V
63
ABSOLUTE MAXIMUM RATINGS (TC = 25°C unless otherwise specified)
SYMBOL
PARAMETER
TEST CONDITIONS
VDSS
VDGR
Drain to Source voltage(Note 1)
Drain to Gate voltage
TJ=25°C to 150°C
RGS=20KΩ
VGS Gate to Source voltage
ID Continuous Drain Current
VGS=10V, TC=25°C
VGS=10V, TC=100°C
IDM Pulsed Drain current(Note 1)
IAR Repetitive avalanche current(Note 1)
EAR Repetitive avalanche energy(Note 1)
EAS Single pulse avalanche energy(Note 2)
lAR=8A, RGS=50Ω, VGS=10V
lAS=8A, L=14mH
dv/dt
Peak diode recovery dv/dt(Note 3)
Total power dissipation
PD
Derating factor above 25°C
TC=25°C
TJ Operation junction temperature
TSTG
Storage temperature
TL Maximum soldering temperature, for 10 seconds 1.6mm from case
Mounting torque, #6-32 or M3 screw
Note: 1.Repetitive rating: pulse width limited by junction temperature.
2.VDD = 50V, L=14mH, lAS=8A, RG =25Ω, starting TJ =25°C
3.ISD ≤ 8A, di/dt ≤ 100A/µs, VDD V(BR)DSS, TJ ≤ 150°C.
www.nellsemi.com
Page 1 of 7
VALUE
UNIT
500
500 V
±20
8
5.1
A
32
8
13 mJ
510 mJ
3.5 V /ns
125 W
1 W /°C
-55 to 150
-55 to 150
ºC
300
10 (1.1)
lbf.in (N.m)

1 page




IRF840 pdf
SEMICONDUCTOR
10
IRF840 Series RRooHHSS
Nell High Power Products
Fig.10 Maximum effective transient thermal lmpedance,
Junction-to-Case
1
D ~ 0.5
0.2
0.1 0.1
0.05
0.02
0.01
10-2
10-3
10-5
Single pulse
(Thermal response)
PDM
t1
t2
10-4
10-3
10-2
0.1
Notes:
1. Duty factor, D = t1/ t2
2. Peak TJ = PDM * Rth(j-c) +TC
1 10 102
Rectangular Pulse Duration, t1 (sec)
Fig.11a. Switching time test circuit
Fig.11b. Switching time waveforms
VDS
VGS
RG
RD
D.U.T.
10V
Pulse width ≤ 1µs
Duty Factor ≤ 0.1%
+
- VDD
VDS
90%
10%
VGS
td(ON)
tR
td(OFF)
tF
Fig.12a. Unclamped lnductive test circuit
Fig.12b. Unclamped lnductive waveforms
Vary tp to obtain
required lAS
VDS
RG
10V
tP
L
D.U.T.
lAS
0.01Ω
+
- VDD
VDS
VDS
lAS
lD(t)
tp
VDD
Time
www.nellsemi.com
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