PDF 1N4148-1 Data sheet ( Hoja de datos )

Número de pieza	1N4148-1
Descripción	Glass Axial Switching Diode
Fabricantes	Microsemi
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No Preview Available ! 1N4148-1 Available on commercial versions Glass Axial Switching Diode Qualified per MIL-PRF-19500/116 DESCRIPTION This popular 1N4148-1 JEDEC registered switching/signal diode features internal metallurgical bonded construction for military grade products per MIL-PRF-19500/116. This small low capacitance diode, with very fast switching speeds, is hermetically sealed and bonded into a double-plug DO-35 package. It may be used in a variety of very high speed applications including switchers, detectors, transient OR'ing, logic arrays, blocking, as well as low-capacitance steering diodes, etc. Microsemi also offers a variety of other switching/signal diodes. Qualified Levels: JAN, JANTX, and JANTXV Important: For the latest information, visit our website http://www.microsemi.com. FEATURES • Popular JEDEC registered 1N4148 number. • Hermetically sealed glass construction. • Metallurgically bonded. • Double plug construction. • Very low capacitance. • Very fast switching speeds with minimal reverse recovery times. • JAN, JANTX, and JANTXV qualifications are available per MIL-PRF-19500/116. • MSP screening is also available in reference to MIL-PRF-19500 (JANS). (See part nomenclature for all available options.) • RoHS compliant version available (commercial grade only). APPLICATIONS / BENEFITS • High frequency data lines. • Small size for high density mounting using flexible thru-hole leads (see package illustration). • RS-232 & RS–422 interface networks. • Ethernet 10 base T. • Low capacitance steering or blocking. • LAN. • Computers. MAXIMUM RATINGS @ 25 ºC unless otherwise stated DO-35 (DO-204AH) Package Also available in: DO-213AA package (surface mount) 1N4148UR-1 UB package (surface mount) 1N4148UB UB2 package (2-Pin surface mount) 1N4148UB2 UBC package (Ceramic Lid surface mount) 1N4148UBC Parameters/Test Conditions Junction and Storage Temperature Thermal Resistance Junction-to-Lead (1) Thermal Resistance Junction-to-Ambient (2) Maximum Breakdown Voltage Working Peak Reverse Voltage Average Rectified Current @ TA = 75 ºC (3) Non-Repetitive Sinusoidal Surge Current (tp = 8.3 ms) Symbol TJ & TSTG RӨJL RӨJA V(BR) VRWM IO IFSM Value -65 to +175 250 325 100 75 200 2 Unit oC oC/W oC/W V V mA A (pk) NOTES: 1. Lead length = .375 inch (9.35 mm). See Figure 2 for thermal impedance curves. 2. TA = +75°C on printed circuit board (PCB), PCB = FR4 - .0625 inch (1.59 mm) 1-layer 1-Oz Cu, horizontal, in still air; pads for axial = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch (25.4 mm) long, lead length L ≤ 0.187 inch (≤ 4.75 mm); RӨJA with a defined PCB thermal resistance condition included, is measured at IO = 200 mA. 3. See Figure 1 for derating. MSC – Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC – Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com T4-LDS-0281, Rev. 1 (121567) ©2012 Microsemi Corporation Page 1 of 4 1 page

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