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PDF VLMTG41S2U1 Data sheet ( Hoja de datos )

Número de pieza VLMTG41S2U1
Descripción Standard SMD LED PLCC-2
Fabricantes Vishay 
Logotipo Vishay Logotipo



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VLMTG41S2U1
Vishay Semiconductors
Standard SMD LED PLCC-2
19225
DESCRIPTION
This device has been designed to meet the increasing
demand for InGaN true green SMD LED.
The package of the VLMTG41.. is the PLCC-2.
It consists of a lead frame which is embedded in a white
thermoplast. The reflector inside this package is filled with
clear epoxy.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: SMD PLCC-2
• Product series: standard
• Angle of half intensity: ± 60°
FEATURES
• High efficient InGaN technology
• EIA and ICE standard package
• Compatible with IR reflow, vapor phase and
wave solder processes according to
CECC 00802 and J-STD-020
• Available in 8 mm tape reel
• Preconditioning according to JEDEC® level 2a
• AEC-Q101 qualified
• ESD-withstand voltage: Up to 2 kV HBM
according to JESD22-A114-B
• Material categorization: For definitions of
compliance please see www.vishay.com/doc?99912
APPLICATIONS
• Automotive: Backlighting in dashboards and switches
• Telecommunication: Indicator and backlighting in
telephone and fax
• Backlighting for audio and video equipment
• Backlighting in office equipment
• Indoor and outdoor message boards
• Flat backlight for LCDs, switches, and symbols
• Illumination purposes, alternative to incandescent lamps
• General use
PARTS TABLE
PART
COLOR
LUMINOUS
INTENSITY
(mcd)
MIN. TYP. MAX.
at IF
(mA)
WAVELENGTH
(nm)
MIN. TYP. MAX.
at IF
(mA)
FORWARD
VOLTAGE
(V)
MIN. TYP. MAX.
at IF
(mA)
TECHNOLOGY
VLMTG41S2U1-GS08 True green 224 380 560 10 515 530 541 10 - 3.2 4.2 20 InGaN on Sapphire
VLMTG41S2U1-GS18 True green 224 380 560 10 515 530 541 10 - 3.2 4.2 20 InGaN on Sapphire
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
VLMTG41..
PARAMETER
TEST CONDITION
SYMBOL
DC forward current
Surge forward current
Power dissipation
Junction temperature
Storage temperature range
Operating temperature range
Thermal resistance junction/ambient
Tamb 80 °C
tp 10 μs
Mounted on PC board (pad size > 16 mm2)
IF
IFSM
PV
Tj
Tstg
Tamb
RthJA
VALUE
20
0.1
84
110
-40 to +100
-40 to +100
360
UNIT
mA
A
mW
°C
°C
°C
K/W
Rev. 1.2, 02-Oct-13
1 Document Number: 83377
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

1 page




VLMTG41S2U1 pdf
www.vishay.com
VLMTG41S2U1
Vishay Semiconductors
METHOD OF TAPING/POLARITY AND TAPE AND REEL
SMD LED (VLM.3..., VLM.4...-SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with DIN IEC 40
(CO) 564) for automatic component insertion. The blister
tape is a plastic strip with impressed component cavities,
covered by a top tape.
Adhesive tape
Blister tape
Component cavity
TAPING OF VLM.3..., VLM.4...
3.5
3.1
94 8670
2.2
2.0
5.75
5.25
3.6 8.3
3.4 7.7
4.0
3.6
1.85
1.65
1.6 4.1
1.4 3.9
4.1
3.9
0.25
2.05
1.95
94 8668
Fig. 10 - Tape Dimensions in mm for PLCC-2
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
120°
10.0
9.0
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
4.5
3.5
2.5
1.5
13.00
12.75
63.5
60.5
180 14.4 max.
178
94 8665
Fig. 11 - Reel Dimensions - GS08
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED
120°
10.4
8.4
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
4.5
3.5
2.5
1.5
13.00
12.75
62.5
60.0
321 14.4 max.
329
18857
Fig. 12 - Reel Dimensions - GS18
SOLDERING PROFILE
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
Preconditioning acc. to JEDEC level 2a
300
250
255 °C
240 °C
217 °C
200
150
100
max. 120 s
max. 260 °C
245 °C
max. 30 s
max. 100 s
50 max. ramp up 3 °C/s
max. ramp down 6 °C/s
0
0
19885
50
100 150 200 250 300
Time (s)
max. 2 cycles allowed
Fig. 13 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020)
TTW Soldering (acc. to CECC00802)
300
5s
lead temperature
250 235 °C
to 260 °C
first wave
200
second
wave full line: typical
dotted line: process limits
ca. 200 K/s
150 100 °C
to 130 °C
100
ca. 2 K/s
50
0
0
948626-1
2 K/s
forced cooling
ca. 5 K/s
50 100 150 200 250
Time (s)
Fig. 14 - Double Wave Soldering of Opto Devices (all Packages)
Rev. 1.2, 02-Oct-13
5 Document Number: 83377
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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