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PDF NSVR0230M2T5G Data sheet ( Hoja de datos )
| Número de pieza | NSVR0230M2T5G | |
| Descripción | Schottky Barrier Diode | |
| Fabricantes | ON Semiconductor | |
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NSR0230M2T5G,
NSVR0230M2T5G
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
Features
Extremely Fast Switching Speed
Extremely Low Forward Voltage 0.325 V (max) @ IF = 10 mA
Low Reverse Current
AEC Qualified and PPAP Capable
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
This is a Pb−Free Device*
MAXIMUM RATINGS
Rating
Symbol Value Unit
Reverse Voltage
Forward Current DC
Forward Current Surge Peak
(60 Hz, 1 cycle)
VR 30 Vdc
IF 200 mA
IFSM
1.0
A
ESD Rating:
Class 3B per Human Body Model
Class C per Machine Model
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board,
(Note 1)
TA = 25C
Derate above 25C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
1. FR−5 Minimum Pad.
Symbol
PD
RqJA
TJ, Tstg
Max
167
2.0
600
−55 to
+125
Unit
mW
mW/C
C/W
C
http://onsemi.com
30 V SCHOTTKY
BARRIER DIODE
SOD−723
CASE 509AA
PLASTIC
1
CATHODE
2
ANODE
MARKING DIAGRAM
7C MG
1 G2
7C = Specific Device Code
M = Month Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NSR0230M2T5G SOD−723
2 mm Pitch
(Pb−Free) 8,000/Tape & Reel
NSVR0230M2T5G SOD−723
2 mm Pitch
(Pb−Free) 8,000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 3
1
Publication Order Number:
NSR0230/D
1 page | ||
| Páginas | Total 3 Páginas | |
| PDF Descargar | [ Datasheet NSVR0230M2T5G.PDF ] | |
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