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Número de pieza MT9HTF6472AY
Descripción 512MB DDR2 SDRAM UDIMM
Fabricantes Micron 
Logotipo Micron Logotipo



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256MB, 512MB, 1GB (x72, SR, ECC) 240-Pin DDR2 UDIMM
Features
DDR2 SDRAM UDIMM
MT9HTF3272AY – 256MB
MT9HTF6472AY – 512MB
MT9HTF12872AY – 1GB
Features
240-pin, unbuffered dual in-line memory module
Fast data transfer rates: PC2-3200, PC2-4200,
PC2-5300, or PC2-6400
256MB (32 Meg x 72), 512MB (64 Meg x 72), or 1GB
(128 Meg x 72)
VDD = VDDQ 1.8V
VDDSPD = 1.7–3.6V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Single rank
Multiple internal device banks for concurrent
operation
Programmable CAS latency (CL)
Posted CAS# additive latency (AL)
WRITE latency = READ latency - 1 tCK
Programmable burst lengths (BL): 4 or 8
Adjustable data-output drive strength
64ms, 8192-cycle refresh
On-die termination (ODT)
Serial presence detect (SPD) with EEPROM
Gold edge contacts
Figure 1: 240-Pin UDIMM (MO-237 R/C A/F)
Module height 30.0mm (1.18in)
Options
Operating temperature
Commercial (0°C TA +70°C)
Industrial (–40°C TA +85°C)1
Package
240-pin DIMM (lead-free)
Frequency/CL2
2.5ns @ CL = 5 (DDR2-800)3, 4
2.5ns @ CL = 6(DDR2-800)3, 4
3.0ns @ CL = 6 (DDR2-667)
3.75ns @ CL = 5 (DDR2-53E)
5.0ns @ CL = 5 (DDR2-40E)
Marking
None
I
Y
-80E
-800
-667
-53E
-40E
Notes:
1. Contact Micron for industrial temperature
module offerings.
2. CL = CAS (READ) latency.
3. Contact Micron for product availability.
4. Not available in 256MB density.
Table 1: Key Timing Parameters
Speed
Grade
-80E
-800
-667
-53E
-40E
Industry
Nomenclature
PC2-6400
PC2-6400
PC2-5300
PC2-4200
PC2-3200
CL = 6
800
800
Data Rate (MT/s)
CL = 5
CL = 4
800 533
667 533
667 553
553
400
CL = 3
400
400
400
400
400
tRCD
(ns)
12.5
15
15
15
15
tRP
(ns)
12.5
15
15
15
15
tRC
(ns)
55
55
55
55
55
PDF: 09005aef80e8ad4d
htf9c32_64_128x72ay – Rev. F 3/10 EN
1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2003 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.

1 page




MT9HTF6472AY pdf
256MB, 512MB, 1GB (x72, SR, ECC) 240-Pin DDR2 UDIMM
Pin Descriptions
Pin Descriptions
The pin description table below is a comprehensive list of all possible pins for all DDR2
modules. All pins listed may not be supported on this module. See Pin Assignments for
information specific to this module.
Table 7: Pin Descriptions
Symbol
Ax
Type
Input
BAx
CKx,
CK#x
CKEx
DMx,
Input
Input
Input
Input
ODTx
Input
Par_In
RAS#, CAS#, WE#
RESET#
S#x
SAx
SCL
CBx
DQx
DQSx,
DQS#x
Input
Input
Input
Input
Input
Input
I/O
I/O
I/O
Description
Address inputs: Provide the row address for ACTIVE commands, and the column ad-
dress and auto precharge bit (A10) for READ/WRITE commands, to select one location
out of the memory array in the respective bank. A10 sampled during a PRECHARGE
command determines whether the PRECHARGE applies to one bank (A10 LOW, bank
selected by BAx) or all banks (A10 HIGH). The address inputs also provide the op-code
during a LOAD MODE command. See the Pin Assignments Table for density-specific
addressing information.
Bank address inputs: Define the device bank to which an ACTIVE, READ, WRITE, or
PRECHARGE command is being applied. BA define which mode register (MR0, MR1,
MR2, and MR3) is loaded during the LOAD MODE command.
Clock: Differential clock inputs. All control, command, and address input signals are
sampled on the crossing of the positive edge of CK and the negative edge of CK#.
Clock enable: Enables (registered HIGH) and disables (registered LOW) internal circui-
try and clocks on the DDR2 SDRAM.
Data mask (x8 devices only): DM is an input mask signal for write data. Input data
is masked when DM is sampled HIGH, along with that input data, during a write ac-
cess. Although DM pins are input-only, DM loading is designed to match that of the
DQ and DQS pins.
On-die termination: Enables (registered HIGH) and disables (registered LOW) termi-
nation resistance internal to the DDR2 SDRAM. When enabled in normal operation,
ODT is only applied to the following pins: DQ, DQS, DQS#, DM, and CB. The ODT input
will be ignored if disabled via the LOAD MODE command.
Parity input: Parity bit for Ax, RAS#, CAS#, and WE#.
Command inputs: RAS#, CAS#, and WE# (along with S#) define the command being
entered.
Reset: Asynchronously forces all registered outputs LOW when RESET# is LOW. This
signal can be used during power-up to ensure that CKE is LOW and DQ are High-Z.
Chip select: Enables (registered LOW) and disables (registered HIGH) the command
decoder.
Serial address inputs: Used to configure the SPD EEPROM address range on the I2C
bus.
Serial clock for SPD EEPROM: Used to synchronize communication to and from the
SPD EEPROM on the I2C bus.
Check bits. Used for system error detection and correction.
Data input/output: Bidirectional data bus.
Data strobe: Travels with the DQ and is used to capture DQ at the DRAM or the con-
troller. Output with read data; input with write data for source synchronous opera-
tion. DQS# is only used when differential data strobe mode is enabled via the LOAD
MODE command.
PDF: 09005aef80e8ad4d
htf9c32_64_128x72ay – Rev. F 3/10 EN
5 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2003 Micron Technology, Inc. All rights reserved.

5 Page





MT9HTF6472AY arduino
256MB, 512MB, 1GB (x72, SR, ECC) 240-Pin DDR2 UDIMM
Electrical Specifications
Electrical Specifications
Stresses greater than those listed may cause permanent damage to the module. This is a
stress rating only, and functional operation of the module at these or any other condi-
tions outside those indicated in the device data sheet are not implied. Exposure to
absolute maximum rating conditions for extended periods may adversely affect reliability.
Table 9: Absolute Maximum Ratings
Symbol
VDD/VDDQ
VIN, VOUT
II
IOZ
IVREF
TA
TC2
Parameter
VDD/VDDQ supply voltage relative to VSS
Voltage on any pin relative to VSS
Input leakage current; Any input 0V VIN VDD; Command/address,
VREF input 0V VIN 0.95V; (All other pins not RAS#, CAS#, WE#, S#,
under test = 0V)
CKE, ODT, BA
CK, CK#
DM
Output leakage current; 0V VOUT; DQ and ODT DQ, DQS, DQS#
are disabled
VREF leakage current; VREF = valid VREF level
Module ambient operating temperature
Commercial
Industrial
DDR2 SDRAM component operating tempera-
ture1
Commercial
Industrial
Min
–0.5
–0.5
–45
–15
–5
–5
–18
0
–40
0
–40
Max
2.3
2.3
45
Units
V
V
µA
15
5
5 µA
18 µA
70 °C
85 °C
85 °C
95 °C
Notes:
1. For further information, refer to technical note TN-00-08: "Thermal Applications," avail-
able on Micron’s Web site.
2. The refresh rate is required to double when TC exceeds 85°C.
PDF: 09005aef80e8ad4d
htf9c32_64_128x72ay – Rev. F 3/10 EN
11
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2003 Micron Technology, Inc. All rights reserved.

11 Page







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