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PDF WD3133 Datasheet ( Hoja de datos )

Número de pieza WD3133
Descripción 1.2-MHz DC-DC STEP-UP CONVERTERS
Fabricantes WillSEMI 
Logotipo WillSEMI Logotipo
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Total 12 Páginas
		
WD3133 datasheet

1 Page

WD3133 pdf
Typical Characteristics
(Ta=25oC, VIN=3.6V, VEN=VIN, CIN=10μF, COUT=10μF, L=10μH, unless otherwise noted)
100 100
WD3133
90 90
80 80
70
60
50
0
L=22uH,V =9V
OUT
VIN=3.0V
V =3.6V
IN
VIN=4.2V
V =5.0V
IN
20 40 60 80 100 120
Output Current(mA)
70
60
50
0
L=10uH,V =9V
OUT
V =3.0V
IN
V =3.6V
IN
V =4.2V
IN
V =5.0V
IN
20 40 60 80 100 120
Output Current(mA)
Efficiency vs. Output Current
Efficiency vs. Output Current
100
90
80
70
60
50
0
L=22uH,V =12V
OUT
VIN=3.0V
V =3.6V
IN
VIN=4.2V
V =5.0V
IN
20 40 60 80 100 120
Output Current(mA)
Efficiency vs. Output Current
100
90
80
70
60
50
0
L=22uH,V =15V
OUT
VIN=3.0V
V =3.6V
IN
V =4.2V
IN
VIN=5.0V
20 40 60 80 100 120
Output Current(mA)
Efficiency vs. Output Current
100
90
80
70
60
50
0
L=10uH,VOUT=12V
V =3.0V
IN
VIN=3.6V
V =4.2V
IN
V =5.0V
IN
20 40 60 80 100 120
Output Current(mA)
Efficiency vs. Output Current
100
90
80
70
60
50
0
L=10uH,V =15V
OUT
VIN=3.0V
V =3.6V
IN
VIN=4.2V
V =5.0V
IN
20 40 60 80 100 120
Output Current(mA)
Efficiency vs. Output Current
Will Semiconductor Ltd.
5 Aug, 2016 - Rev. 1.2

5 Page

WD3133 arduino
Connect the sensitive analog circuitry (such as
voltage divider components) to analog ground.
Connect the power components (such as input
and output bypass capacitors) to power ground.
Connect the two ground planes together near
the load to reduce the effects of voltage
dropped on circuit board traces.
2. Locate CIN as close to the VDD pin as possible,
and use separate input bypass capacitors for
the analog.
3. Route the high current path from CIN, through L
to the LX and PGND pins as short as possible.
4. Keep high current traces as short and as wide
as possible.
5. The output filter of the boost converter is also
critical for layout. The Diode and Output
capacitors should be placed to minimize the
area of current loop through Output PGND
LX.
6. Avoid routing high impedance traces, such as
FB, near the high current traces and
components or near the Diode node (D). If high
impedance traces are routed near high current
and/or the LX node, place a ground plane
shield between the traces.
WD3133
Will Semiconductor Ltd.
11 Aug, 2016 - Rev. 1.2

11 Page





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