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PDF SLP840C Data sheet ( Hoja de datos )
| Número de pieza | SLP840C | |
| Descripción | N-Channel MOSFET | |
| Fabricantes | Maple Semiconductor | |
| Logotipo |  |
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SLP840C / SLF840C
500V N-Channel MOSFET
General Description
This Power MOSFET is produced using Maple semi‘s
advanced planar stripe DMOS technology.
This advanced technology has been especially tailored
to minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switched mode power supplies,
active power factor correction based on half bridge topology.
Features
- 8A, 500V, RDS(on)typ. = 0.64Ω@VGS = 10 V
- Low gate charge ( typical 31.5nC)
- High ruggedness
- Fast switching
- 100% avalanche tested
- Improved dv/dt capability
D
GDS
TO-220
GDS
TO-220F
G
S
Absolute Maximum Ratings TC = 25°C unless otherwise noted
Symbol
Parameter
SLP840C
SLF840C
VDSS
ID
IDM
VGSS
EAS
IAR
EAR
dv/dt
PD
TJ, TSTG
TL
Drain-Source Voltage
Drain Current
Drain Current
- Continuous (TC = 25℃)
- Continuous (TC = 100℃)
- Pulsed
(Note 1)
Gate-Source Voltage
Single Pulsed Avalanche Energy
(Note 2)
Avalanche Current
(Note 1)
Repetitive Avalanche Energy
(Note 1)
Peak Diode Recovery dv/dt
(Note 3)
Power Dissipation (TC = 25℃)
- Derate above 25℃
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
500
8.0 8.0 *
4.8 4.8 *
32 32 *
±30
285
8
12.28
4.5
123 36
0.98 0.28
-55 to +150
300
* Drain current limited by maximum junction temperature.
Thermal Characteristics
Symbol
RθJC
RθJS
RθJA
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink Typ.
Thermal Resistance, Junction-to-Ambient
SLP840C
1.02
0.5
62.5
SLF840C
3.52
--
62.5
Units
V
A
A
A
V
mJ
A
mJ
V/ns
W
W/℃
℃
℃
Units
℃/W
℃/W
℃/W
Maple Semiconductor CO., LTD
http://www.maplesemi.com
Rev. 00 January. 2015
1 page  
Typical Characteristics (Continued)
100
D=0.5
0.2
10-1 0.1
0.05
0.02
0.01
single pulse
10-2
※ Notes :
1. Zθ JC(t) = 1.02 ℃/W Max.
2. Duty Factor, D=t1/t2
3. TJM - TC = PDM * Zθ JC(t)
PDM
t1
t2
10-5 10-4 10-3 10-2 10-1 100 101
t1, Square Wave Pulse Duration [sec]
Figure 11-1. Transient Thermal Response Curve for SLP840C
D=0.5
100
0.2
0.1
0.05
0.02
10-1 0.01
single pulse
※ Notes :
1. Zθ JC(t) = 3.52 ℃/W Max.
2. Duty Factor, D=t1/t2
3. TJM - TC = PDM * Zθ JC(t)
PDM
t1
t2
10-5 10-4 10-3 10-2 10-1 100 101
t1, Square Wave Pulse Duration [sec]
Figure 11-2. Transient Thermal Response Curve for SLF840C
Maple Semiconductor CO., LTD
http://www.maplesemi.com
Rev. 00 January. 2015
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet SLP840C.PDF ] | |
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