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PDF ACPM-7311-BLK Data sheet ( Hoja de datos )
| Número de pieza | ACPM-7311-BLK | |
| Descripción | Power Amplifier Module | |
| Fabricantes | AVAGO | |
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ACPM-7311-TR1
UMTS800 4x4 Power Amplifier
(824-849MHz)
Data Sheet
Description
The ACPM-7311, a Wide-band Code Division Multiple
Access(WCDMA) Power Amplifier (PA), is a fully matched
10-pin surface mount module developed for WCDMA
handset applications. This power amplifier module is
developed to cover 824-849MHz bandwidth. The ACPM-
7311 meets the stringent WCDMA linearity requirements
for output power of up to 28dBm. The ACPM-7311 is also
developed to meet HSDPA specs.
The ACPM-7311 is designed to enhance the efficiency at
low and medium output power range by using 3-mode
control scheme with 2 mode control pins. This provides
extended talk time.
The ACPM-7311 is self contained, incorporating 50ohm
input and output matching networks.
Order information
Part Number
ACPM-7311-TR1
ACPM-7311-BLK
No. of Devices
1000
100
Container
7”Tape and Reel
BULK
Features
• Excellent Linearity
• Low quiescent current
• High Efficiency
PAE at 28dBm: 40.3%
PAE at 16dBm: 15.3%
PAE at 8dBm: 5.6%
• 10-pin surface mounting package
4mmx4mmx1.1mm(typ)
• Internal 50ohm matching networks for both RF input
and output
• RoHS Compliant
Applications
• WCDMA Handset (HSDPA)
Functional Block Diagram
Ven
Vmode0
Vmode1
TR Switch
MODULE
Vcc1
Bias Circuit & Control Logic
RF Input
Input
Match
MMI
DA
Inter
Stage
PA
Match
Vcc2
Output
Match
RF Output
1 page  
Characteristics Data (WCDMA, Vcc=3.4V, Ven=2.6V, T=25°C, Zin/Zout=50ohm)
500 35
450
400
824MHz
350
837MHz
300 849MHz
250
30
824MHz
25 837MHz
849MHz
20
200
150 15
100 10
50
0
-10 -5 0 5 10 15 20 25 30
5
-10 -5 0 5 10 15 20 25 30
Pout (dBm)
Pout (dBm)
Figure 1. Total Current vs. Output Power
Figure 2. Gain vs. Output Power
45
40
35 824MHz
837MHz
30 849MHz
25
20
15
10
5
-30
824MHz
-35 837MHz
849MHz
-40
-45
-50
-55
0
-10 -5
0
5 10 15 20 25 30
Pout (dBm)
-60
-10
-5
0
5 10 15 20 25 30
Pout (dBm)
Figure 3. Power Added Efficiency vs. Output Power
Figure 4. Adjacent Channel Leakage Ratio 1 vs. Output Power
-40
824MHz
-45 837MHz
849MHz
-50
-55
-60
-65
-70
-10
-5
0
5 10 15 20 25
Pout (dBm)
Figure 5. Adjacent Channel Leakage Ratio 2 vs. Output Power
30
5 Page 
PCB Design Guidelines
The recommended ACPM-7311 PCB land pattern is shown
in Figure 18 and Figure 19. The substrate is coated with
solder mask between the I/O and conductive paddle to
protect the gold pads from short circuit that is caused by
solder bleeding/bridging.
0.4
0.6
0.1
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 20. Reducing the stencil opening can po-
tentially generate more voids. On the other hand, stencil
openings larger than 100% will lead to excessive solder
paste smear or bridging across the I/O pads or conduc-
tive paddle to adjacent I/O pads. Considering the fact
that solder paste thickness will directly affect the quality
of the solder joint, a good choice is to use laser cut stencil
composed of 0.10mm(4mils)or 0.127mm(5mils) thick
stainless steel which is capable of producing the required
fine stencil outline.
0.85
0.25
Figure 18. Metallization
0.7
0.5
0.5
Ø 0.3mm
on 0.6mm pitch
0.55
1.8
0.85
2.4
Figure 19. Solder Mask Opening
0.6
0.4
0.5
1.6
0.85
2.0
Figure 20. Solder Paste Stencil Aperture
11
11 Page | ||
| Páginas | Total 18 Páginas | |
| PDF Descargar | [ Datasheet ACPM-7311-BLK.PDF ] | |
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