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PDF VLMG31K1L2-GS08 Data sheet ( Hoja de datos )

Número de pieza VLMG31K1L2-GS08
Descripción Standard SMD LED PLCC-2
Fabricantes Vishay 
Logotipo Vishay Logotipo



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VLMG31..
Vishay Semiconductors
Standard SMD LED PLCC-2
948553
DESCRIPTION
These devices have been designed to meet the increasing
demand for surface mounting technology.
The package of the VLMG31-series is the PLCC-2.
It consists of a lead frame which is embedded in a white
thermoplast. The reflector inside this package is filled up
with clear epoxy.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: SMD PLCC-2
• Product series: standard
• Angle of half intensity: ± 60°
FEATURES
• SMD LEDs with exceptional brightness
• Luminous intensity categorized
• EIA and ICE standard package
• Available in 8 mm tape
• Low power consumption
• Low profile package
• Compatible with IR reflow, vapor phase and
wave solder processes according to
CECC 00802 and J-STD-020
• Compatible with automatic placement
equipment
• Non-diffused lens: excellent for coupling to light pipes and
backlighting
• Luminous intensity ratio in one packaging
IVmax./IVmin. 1.6
• Preconditioning according to JEDEC® level 2a
unit
• ESD-withstand voltage: up to 2 kV according to
JESD22-A114-B
• AEC-Q101 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Automotive: backlighting in dashboards and switches
• Telecommunication: indicator and backlighting in
telephone and fax
• Indicator and backlight for audio and video equipment
• Indicator and backlight in office equipment
• Flat backlight for LCDs, switches, and symbols
• General use
PARTS TABLE
PART
LUMINOUS INTENSITY
WAVELENGTH
FORWARD VOLTAGE
COLOR
(mcd)
at IF
(mA)
(nm)
at IF
(mA)
(V)
at IF
(mA)
TECHNOLOGY
MIN. TYP. MAX.
MIN. TYP. MAX.
MIN. TYP. MAX.
VLMG31K1L2-GS08 Green 7.1 12 18 10 562 572 575 10 - 2.2 2.8 20 GaP on GaP
VLMG31K1L2-GS18 Green 7.1 12 18 10 562 572 575 10 - 2.2 2.8 20 GaP on GaP
VLMG31K1M2-GS08 Green 7.1 12 28 10 562 572 575 10 - 2.2 2.8 20 GaP on GaP
VLMG31K1M2-GS18 Green 7.1 12 28 10 562 572 575 10 - 2.2 2.8 20 GaP on GaP
VLMG31L1M2-GS08 Green 11.2 13.7 28 10 562 572 575 10 -
2.2 2.8 20 GaP on GaP
VLMG31L1M2-GS18 Green 11.2 13.7 28 10 562 572 575 10 -
2.2 2.8 20 GaP on GaP
Rev. 1.6, 03-Nov-15
1 Document Number: 81323
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

1 page




VLMG31K1L2-GS08 pdf
www.vishay.com
VLMG31..
Vishay Semiconductors
METHOD OF TAPING / POLARITY AND TAPE AND REEL
SMD LED (VLM3-SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with
DIN IEC 40 (CO) 564) for automatic component insertion.
The blister tape is a plastic strip with impressed component
cavities, covered by a top tape.
Adhesive tape
Blister tape
Component cavity
TAPING OF VLM.3..
3.5
3.1
94 8670
2.2
2.0
5.75
5.25
3.6 8.3
3.4 7.7
4.0
3.6
1.85
1.65
1.6 4.1
1.4 3.9
4.1
3.9
0.25
2.05
1.95
94 8668
Fig. 8 - Tape Dimensions in mm for PLCC-2
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
120°
10.0
9.0
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
4.5
3.5
2.5
1.5
13.00
12.75
63.5
60.5
180 14.4 max.
178
94 8665
Fig. 9 - Reel Dimensions - GS08
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED
120°
10.4
8.4
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
4.5
3.5
2.5
1.5
13.00
12.75
62.5
60.0
321 14.4 max.
329
18857
Fig. 10 - Reel Dimensions - GS18
SOLDERING PROFILE
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
Preconditioning acc. to JEDEC level 2a
300
250
255 °C
240 °C
217 °C
200
150
100
max. 120 s
max. 260 °C
245 °C
max. 30 s
max. 100 s
50 max. ramp up 3 °C/s
max. ramp down 6 °C/s
0
0
19885
50
100 150 200 250 300
Time (s)
max. 2 cycles allowed
Fig. 11 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020)
TTW Soldering (acc. to CECC00802)
300
5s
lead temperature
250 235 °C
to 260 °C
first wave
200
second
wave full line: typical
dotted line: process limits
ca. 200 K/s
150 100 °C
to 130 °C
100
ca. 2 K/s
50
0
0
948626-1
2 K/s
forced cooling
ca. 5 K/s
50 100 150 200 250
Time (s)
Fig. 12 - Double Wave Soldering of Opto Devices (all Packages)
Rev. 1.6, 03-Nov-15
5 Document Number: 81323
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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