|
|
PDF TH4 Data sheet ( Hoja de datos )
| Número de pieza | TH4 | |
| Descripción | Solid Tantalum Surface Mount Chip Capacitors | |
| Fabricantes | Vishay | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de TH4 (archivo pdf) en la parte inferior de esta página. Total 15 Páginas | ||
|
No Preview Available !
www.vishay.com
TH4
Vishay Sprague
Solid Tantalum Surface Mount Chip Capacitors
TANTAMOUNT™ Molded Case, HI-TMP®
High Temperature 175 °C, Automotive Grade
PERFORMANCE / ELECTRICAL
CHARACTERISTICS
www.vishay.com/doc?40215
Operating Temperature: -55 °C to +175 °C
Capacitance Range: 10 μF to 100 μF
Capacitance Tolerance: ± 10 %, ± 20 %
Voltage Range: 6.3 VDC to 35 VDC
FEATURES
• Operating temperature up to 175 °C with 50 %
voltage derating
• AEC-Q200 qualified
• 100 % surge current tested
• RoHS-compliant terminations available:
matte tin (all cases), gold (D case)
• Standard EIA 535BAAC case sizes
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Automotive
• Industrial
• High temperature
ORDERING INFORMATION
TH4 C
226
TYPE
CASE
CODE
CAPACITANCE
K
CAPACITANCE
TOLERANCE
016
DC VOLTAGE
RATING AT +85 °C
C
TERMINATION AND
PACKAGING
1000
ESR
See
Ratings
and Case
Codes
table
This is expressed in
picofarads. The first
two digits are the
significant figures.
The third is the
number of zeros to
follow.
K = ± 10 %
M = ± 20 %
This is expressed in V.
To complete the
three-digit block, zeros
precede the voltage
rating. A decimal point
is indicated by an “R”
(6R3 = 6.3 V)
Matte tin
C = 7" (178 mm) reel
D = 13" (330 mm) reel
V = 7" (178 mm) reel,
dry pack
U = 13" (330 mm) reel,
dry pack
Maximum
100 kHz ESR
0500 = 500 m
5000 = 5.0
10R0 = 10.0
Notes
• We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size. Voltage
substitutions will be marked with the higher voltage rating.
• Dry pack as specified in J-STD-033 for MSL3. Applicable for D and E cases only.
DIMENSIONS in inches [millimeters]
L
TH (MIN.)
Glue Pad
HW
TW
Glue Pad
P
CASE CODE
EIA SIZE
L
W
H
P
B
3528-21
0.138 ± 0.008 0.110 ± 0.008 0.075 ± 0.008 0.031 ± 0.012
[3.5 ± 0.20]
[2.8 ± 0.20]
[1.9 ± 0.20]
[0.80 ± 0.30]
C
6032-28
0.236 ± 0.012 0.126 ± 0.012 0.098 ± 0.012 0.051 ± 0.012
[6.0 ± 0.30]
[3.2 ± 0.30]
[2.5 ± 0.30]
[1.3 ± 0.30]
D
7343-31
0.287 ± 0.012 0.169 ± 0.012 0.110 ± 0.012 0.051 ± 0.012
[7.3 ± 0.30]
[4.3 ± 0.30]
[2.8 ± 0.30]
[1.3 ± 0.30]
E
7343-43
0.287 ± 0.012 0.169 ± 0.012 0.157 ± 0.012 0.051 ± 0.012
[7.3 ± 0.30]
[4.3 ± 0.30]
[4.0 ± 0.30]
[1.3 ± 0.30]
Note
• Glue pad (non-conductive, part of molded case) is dedicated for glue attachment (as user option).
TW
0.087 ± 0.004
[2.2 ± 0.10]
0.087 ± 0.004
[2.2 ± 0.10]
0.094 ± 0.004
[2.4 ± 0.10]
0.094 ± 0.004
[2.4 ± 0.10]
TH (MIN.)
0.028
[0.70]
0.039
[1.0]
0.039
[1.0]
0.039
[1.0]
Revision: 06-Dec-16
1 Document Number: 40152
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
1 page  
www.vishay.com
Molded Guide
Vishay Sprague
Guide for Molded Tantalum Capacitors
INTRODUCTION
Tantalum electrolytic capacitors are the preferred choice in
applications where volumetric efficiency, stable electrical
parameters, high reliability, and long service life are primary
considerations. The stability and resistance to elevated
temperatures of the tantalum / tantalum oxide / manganese
dioxide system make solid tantalum capacitors an
appropriate choice for today's surface mount assembly
technology.
Vishay Sprague has been a pioneer and leader in this field,
producing a large variety of tantalum capacitor types for
consumer, industrial, automotive, military, and aerospace
electronic applications.
Tantalum is not found in its pure state. Rather, it is
commonly found in a number of oxide minerals, often in
combination with Columbium ore. This combination is
known as “tantalite” when its contents are more than
one-half tantalum. Important sources of tantalite include
Australia, Brazil, Canada, China, and several African
countries. Synthetic tantalite concentrates produced from
tin slags in Thailand, Malaysia, and Brazil are also a
significant raw material for tantalum production.
Electronic applications, and particularly capacitors,
consume the largest share of world tantalum production.
Other important applications for tantalum include cutting
tools (tantalum carbide), high temperature super alloys,
chemical processing equipment, medical implants, and
military ordnance.
Vishay Sprague is a major user of tantalum materials in the
form of powder and wire for capacitor elements and rod and
sheet for high temperature vacuum processing.
THE BASICS OF TANTALUM CAPACITORS
Most metals form crystalline oxides which are
non-protecting, such as rust on iron or black oxide on
copper. A few metals form dense, stable, tightly adhering,
electrically insulating oxides. These are the so-called
“valve”metals and include titanium, zirconium, niobium,
tantalum, hafnium, and aluminum. Only a few of these
permit the accurate control of oxide thickness by
electrochemical means. Of these, the most valuable for the
electronics industry are aluminum and tantalum.
Capacitors are basic to all kinds of electrical equipment,
from radios and television sets to missile controls and
automobile ignitions. Their function is to store an electrical
charge for later use.
Capacitors consist of two conducting surfaces, usually
metal plates, whose function is to conduct electricity. They
are separated by an insulating material or dielectric. The
dielectric used in all tantalum electrolytic capacitors is
tantalum pentoxide.
Tantalum pentoxide compound possesses high-dielectric
strength and a high-dielectric constant. As capacitors are
being manufactured, a film of tantalum pentoxide is applied
to their electrodes by means of an electrolytic process. The
film is applied in various thicknesses and at various voltages
and although transparent to begin with, it takes on different
colors as light refracts through it. This coloring occurs on the
tantalum electrodes of all types of tantalum capacitors.
Rating for rating, tantalum capacitors tend to have as much
as three times better capacitance / volume efficiency than
aluminum electrolytic capacitors. An approximation of the
capacitance / volume efficiency of other types of capacitors
may be inferred from the following table, which shows the
dielectric constant ranges of the various materials used in
each type. Note that tantalum pentoxide has a dielectric
constant of 26, some three times greater than that of
aluminum oxide. This, in addition to the fact that extremely
thin films can be deposited during the electrolytic process
mentioned earlier, makes the tantalum capacitor extremely
efficient with respect to the number of microfarads available
per unit volume. The capacitance of any capacitor is
determined by the surface area of the two conducting
plates, the distance between the plates, and the dielectric
constant of the insulating material between the plates.
COMPARISON OF CAPACITOR
DIELECTRIC CONSTANTS
DIELECTRIC
Air or vacuum
Paper
Plastic
Mineral oil
Silicone oil
Quartz
Glass
Porcelain
Mica
Aluminum oxide
Tantalum pentoxide
Ceramic
e
DIELECTRIC CONSTANT
1.0
2.0 to 6.0
2.1 to 6.0
2.2 to 2.3
2.7 to 2.8
3.8 to 4.4
4.8 to 8.0
5.1 to 5.9
5.4 to 8.7
8.4
26
12 to 400K
In the tantalum electrolytic capacitor, the distance between
the plates is very small since it is only the thickness of the
tantalum pentoxide film. As the dielectric constant of the
tantalum pentoxide is high, the capacitance of a tantalum
capacitor is high if the area of the plates is large:
C = e---t-A--
where
C = capacitance
e = dielectric constant
A = surface area of the dielectric
t = thickness of the dielectric
Tantalum capacitors contain either liquid or solid
electrolytes. In solid electrolyte capacitors, a dry material
(manganese dioxide) forms the cathode plate. A tantalum
lead is embedded in or welded to the pellet, which is in turn
connected to a termination or lead wire. The drawings show
the construction details of the surface mount types of
tantalum capacitors shown in this catalog.
Revision: 25-Nov-16
1 Document Number: 40074
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
5 Page 
www.vishay.com
Molded Guide
Vishay Sprague
GUIDE TO APPLICATION
1. AC Ripple Current: the maximum allowable ripple
current shall be determined from the formula:
IRMS = -R----EP---S--R--
where,
P = power dissipation in W at +25 °C as given in
the tables in the product datasheets (Power
Dissipation).
RESR = the capacitor equivalent series resistance at
the specified frequency
2. AC Ripple Voltage: the maximum allowable ripple
voltage shall be determined from the formula:
VRMS
=
I
RMS
x
Z
or, from the formula:
VRMS = Z -R----EP---S--R--
where,
P = power dissipation in W at +25 °C as given in
the tables in the product datasheets (Power
Dissipation).
RESR = the capacitor equivalent series resistance at
the specified frequency
Z = the capacitor impedance at the specified
frequency
2.1 The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
2.2 The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at
+25 °C.
3. Reverse Voltage: solid tantalum capacitors are not
intended for use with reverse voltage applied.
However, they have been shown to be capable of
withstanding momentary reverse voltage peaks of up
to 10 % of the DC rating at 25 °C and 5 % of the DC
rating at +85 °C.
4. Temperature Derating: if these capacitors are to be
operated at temperatures above +25 °C, the
permissible RMS ripple current shall be calculated
using the derating factors as shown:
TEMPERATURE (°C)
+25
+85
+125
+150 (1)
+175 (1)
+200 (1)
DERATING FACTOR
1.0
0.9
0.4
0.3
0.2
0.1
Note
(1)Applicable for dedicated high temperature product series
5. Power Dissipation: power dissipation will be
affected by the heat sinking capability of the
mounting surface. Non-sinusoidal ripple current may
produce heating effects which differ from those
shown. It is important that the equivalent IRMS value
be established when calculating permissible
operating levels. (Power dissipation calculated using
+25 °C temperature rise).
6. Printed Circuit Board Materials: molded capacitors
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
7. Attachment:
7.1 Solder Paste: the recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat. In
practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
7.2 Soldering: capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering,
and hot plate methods. The soldering profile charts
show recommended time / temperature conditions
for soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per s.
Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
7.2.1 Backward and Forward Compatibility: capacitors
with SnPb or 100 % tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
8. Cleaning (Flux Removal) After Soldering: molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC / ODS products are not used in the production
of these devices and are not recommended.
Solvents containing methylene chloride or other
epoxy solvents should be avoided since these will
attack the epoxy encapsulation material.
8.1 When using ultrasonic cleaning, the board may
resonate if the output power is too high. This
vibration can cause cracking or a decrease in the
adherence of the termination. DO NOT EXCEED 9W/l
at 40 kHz for 2 min.
9. Recommended Mounting Pad Geometries: proper
mounting pad geometries are essential for
successful solder connections. These dimensions
are highly process sensitive and should be designed
to minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and /
or circuit board design.
Revision: 25-Nov-16
7 Document Number: 40074
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet TH4.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| TH-37PA40E | (TH-xxPAx0E) Progressive Wide Plasma Television |  Panasonic |
| TH-37PA50E | (TH-xxPAx0E) Progressive Wide Plasma Television | Panasonic |
| TH-37PH9 | (TH-xxPH9) High Definition Plasma Display | Panasonic |
| TH-37PX60U | (TH-xxPX60x) Digital High Definition Plasma Television Manual | Panasonic |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |