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PDF ICS-40720 Data sheet ( Hoja de datos )
| Número de pieza | ICS-40720 | |
| Descripción | Ultra-Low Noise Microphone | |
| Fabricantes | InvenSense | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de ICS-40720 (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
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ICS‐40720
Ultra‐Low Noise Microphone with Differential Output
GENERAL DESCRIPTION
The ICS‐40720 is an ultra‐low noise, differential analog
output, bottom‐ported MEMS microphone. The ICS‐40720
includes a MEMS microphone element, an impedance
converter, a differential output amplifier and an enhanced RF
package. The ICS‐40720’s 70 dB SNR and ±2 dB sensitivity
tolerance make it an excellent choice for microphone arrays
and far field voice control applications.
The ICS‐40720 has a linear response up to 124 dB SPL with a
differential output sensitivity specification of −32 dBV. It can
be used in a single‐ended mode with −38 dBV sensi vity and
the same high SNR.
The ICS‐40720 is available in a small 4.00 mm × 3.00 mm ×
1.20 mm surface‐mount package.
APPLICATIONS
Smartphones
Tablet Computers
Teleconferencing Systems
Digital Still and Video Cameras
Bluetooth Headsets
Security and Surveillance
Microphone Arrays
Voice Control and Activation
FEATURES
Ultra‐High 70 dBA SNR
−32 dBV Differential Sensitivity, −38 dBV Single‐
Ended Sensitivity
±2 dB Sensitivity Tolerance
Small 4 × 3 × 1.2 mm Surface‐Mount Package
Non‐Inverted Signal Output
Extended Frequency Response from 75 Hz to 20 kHz
Enhanced RF Performance
285 µA Current Consumption
124 dB SPL Acoustic Overload Point
−77 dBV PSR
Compatible with Sn/Pb and Pb‐Free Solder Processes
RoHS/WEEE Compliant
FUNCTIONAL BLOCK DIAGRAM
OUTPUT
AMPLIFIER
ICS-40720
POWER
VDD GND
OUTPUT+
OUTPUT−
ORDERING INFORMATION
PART
TEMP RANGE
ICS‐40720
−40°C to +85°C
EV_ICS‐40720‐FX
—
PACKAGING
13” Tape and Reel
—
InvenSense reserves the right to change the detail
specifications as may be required to permit improvements
in the design of its products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: DS‐000045
Revision: 1.3
Rev Date: 1/20/16
1 page  
ICS‐40720
SOLDERING PROFILE
TP
TL TSMAX
TSMIN
RAMP-UP
tP
CRITICAL ZONE
TL TO TP
tL
tS
PREHEAT
RAMP-DOWN
t25°C TO PEAK TEMPERATURE
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Sn63/Pb37
Average Ramp Rate (TL to TP)
1.25°C/sec max
Pb‐Free
1.25°C/sec max
Minimum Temperature
Preheat
(TSMIN)
Minimum Temperature
(TSMIN)
Time (TSMIN to TSMAX), tS
Ramp‐Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
100°C
150°C
60 sec to 75 sec
1.25°C/sec
45 sec to 75 sec
183°C
215°C +3°C/−3°C
100°C
200°C
60 sec to 75 sec
1.25°C/sec
~50 sec
217°C
260°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
Ramp‐Down Rate
20 sec to 30 sec
3°C/sec max
20 sec to 30 sec
3°C/sec max
Time +25°C (t25°C) to Peak Temperature 5 min max
5 min max
*Note: The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All
microphones are also compatible with the J‐STD‐020 profile
Document Number: DS‐000045
Revision: 1.3
Page 5 of 16
5 Page 
ICS‐40720
PCB DESIGN AND LAND PATTERN LAYOUT
Lay out the PCB land pattern for the ICS‐40720 at a 1:1 ratio to the solder pads on the microphone package (see Figure 10.) Take
care to avoid applying solder paste to the sound hole in the PCB. Figure 11 shows a suggested solder paste stencil pattern layout.
The response of the ICS‐40720 is not affected by the PCB hole size, as long as the hole is not smaller than the sound port of the micro‐
phone (0.75 mm, or 0.0295 inch, in diameter). A 1 mm (0.040 inch) diameter for the hole is recommended.
Align the hole in the microphone package with the hole in the PCB. The exact degree of the alignment does not affect the
performance of the microphone as long as the holes are not partially or completely blocked.
Figure 10. Suggested PCB Land Pattern Layout
Document Number: DS‐000045
Revision: 1.3
Figure 11. Suggested Solder Paste Stencil Pattern Layout
Page 11 of 16
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet ICS-40720.PDF ] | |
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