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PDF ZSSC3026 Data sheet ( Hoja de datos )

Número de pieza ZSSC3026
Descripción High Resolution 16-Bit Sensor Signal Conditioner
Fabricantes IDT 
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Low Power, High Resolution 16-Bit
Sensor Signal Conditioner
ZSSC3026
Datasheet
Brief Description
The ZSSC3026 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Developed for correction of resistive bridge
sensors and optimized for high-resolution altimeter
module applications, the ZSSC3026 can perform
offset, span, and 1st and 2nd order temperature com-
pensation of the measured signal. It can also provide
a corrected temperature output measured with an
internal sensor. The corrected measurement values
are provided at the digital output pins, which can be
configured as I2C™* (3.4MHz) or SPI (20MHz).
Digital compensation of the signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP) run-
ning a correction algorithm. Calibration coefficients
are stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Prog-
ramming the ZSSC3026 is simple via the serial
interface. An internal charge pump provides the
programming voltage. The interface is used for the
PC-controlled calibration procedure, which programs
the calibration coefficients in memory. The digital
mating is fast and precise, eliminating the overhead
normally associated with trimming external com-
ponents and multi-pass calibration routines.
Features
Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing two-
segment analog-to-digital converter (ADC)
Fully programmable gain amplifier for optimizing
sensor signals: gain range 14 to 72 (linear)
Internal auto-compensated temperature sensor
Digital compensation of individual sensor offset;
1st and 2nd order compensation of sensor gain
Digital compensation of 1st and 2nd order tem-
perature gain and offset drift
Intelligent power management unit
Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
Typical sensor elements can achieve accuracy of
better than ±0.10% FSO @ -40 to 85°C
* I2C™ is a registered trademark of NXP.
Benefits
Excellent for low-voltage and low-power battery
applications
Integrated 18-bit calibration math DSP
Costs minimized via one-pass calibration
No external trimming components required
Highly integrated CMOS design
Physical Characteristics
Supply voltage range: 1.8 to 3.6V
Current consumption: 900µA (operating mode)
Sleep State current: 50nA (typical)
Temperature resolution: <0.003K/LSB
Operation temperatures depending on part
number: –40°C to +85°C
Small die size
Delivery options: die for wafer bonding, bumped
die for Flip Chip, PQFN24
Typical Applications
The ZSSC3026 is designed for operation in cali-
brated resistive (e.g., pressure) sensor modules:
Barometric altitude measurement for portable
navigation
Altitude measurement for emergency call
systems and car navigation
Inside hard disk pressure measurement
Weather forecast
Fan control
ZSSC3026 Application Example
© 2016 Integrated Device Technology, Inc.
1
March 28, 2016

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ZSSC3026 pdf
ZSSC3026
List of Tables
Table 1.1
Table 1.2
Table 1.3
Table 1.4
Table 2.1
Table 2.2
Table 2.3
Table 2.4
Table 2.5
Table 2.6
Table 2.7
Table 2.8
Table 3.1
Table 3.2
Table 3.3
Table 3.4
Table 3.5
Table 3.6
Table 3.7
Table 3.8
Table 4.1
Table 4.2
Table 4.3
Maximum Ratings ............................................................................................................................... 6
Operating Conditions .......................................................................................................................... 6
Constraints for VDD Power-On Reset ................................................................................................ 7
Electrical Parameters.......................................................................................................................... 7
Amplifier Gain: Stage 1..................................................................................................................... 12
Amplifier Gain: Stage 2..................................................................................................................... 13
Gain Polarity ..................................................................................................................................... 13
MSB/LSB Settings ............................................................................................................................ 14
MSB/LSB Segmentation Settings for Temperature Measurement................................................... 14
ADC Conversion Time for a Single A2D Conversion ....................................................................... 15
Typical Conversion Time vs. Noise Performance for 16-Bit Fully Conditioned Signal Results
(AZBM, BM, AZTM, TM, and Digital SSC Correction)...................................................................... 16
ADC Offset Settings.......................................................................................................................... 17
SPI/I2C Commands .......................................................................................................................... 23
Get_Raw Commands ....................................................................................................................... 25
General Status Byte.......................................................................................................................... 26
Status Byte for Read Operations ...................................................................................................... 26
Status Byte for Write Operations ...................................................................................................... 26
Mode Status...................................................................................................................................... 26
Memory Status Word ........................................................................................................................ 33
MTP Memory Content Assignments ................................................................................................. 34
Die Pad Assignments ....................................................................................................................... 46
Physical Package Dimensions.......................................................................................................... 47
Pin Assignments PQFN24 ................................................................................................................ 48
© 2016 Integrated Device Technology, Inc.
5
March 28, 2016

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ZSSC3026 arduino
ZSSC3026
2 Circuit Description
2.1. Brief Description
The ZSSC3026 provides a highly accurate amplification of bridge sensor signals. The compensation of sensor
offset, sensitivity, temperature drift, and non-linearity is accomplished via an 18-bit DSP core running a correction
algorithm with calibration coefficients stored in an MTP memory. The ZSSC3026 can be configured for a wide
range of resistive bridge sensor types. A digital interface (SPI or I2C™) enables communication. The ZSSC3026
supports two operational modes: Normal Mode and Command Mode. Normal Mode is the standard operating
mode. Typically in Normal Mode, the ZSSC3026 wakes up from a Sleep State (low power), runs a measurement
in Active State, and automatically returns to the Sleep State. (See section 3.3 for details on operational modes.)
2.2. Signal Flow and Block Diagram
See Figure 2.1 for the ZSSC3026 block diagram. The sensor bridge supply VDDB and the power supply for analog
circuitry are provided by a voltage regulator, which is optimized for power supply disturbance rejection (PSRR).
See section 1.4 for a graph of PSRR versus frequency. To improve noise suppression, the digital blocks are
powered by a separate voltage regulator. A power supervision circuit monitors all supply voltages and generates
appropriate reset signals for initializing the digital blocks.
The state machine controls the analog circuitry to perform the three measurement types: bridge, temperature, and
offset measurement. The multiplexer selects the signal input to the amplifier, which can be the external signals
from the input pins INP and INN, the internal temperature reference sensor signals, or an input short for
measuring offset. A full measurement request will trigger an automatic sequence of all measurement types and all
input signals, respectively. The Temperature Reference Sensor block is based on a resistive sensing element.
Figure 2.1 ZSSC3026 Functional Block Diagram
VDDB
VTP Temperature
Reference
VTN Sensor
AGND / CM
Generator
Vreg int
Bias Current
Generator
Voltage
Regulator
Power Ctr.
ZSSC3026
VDD
VSS
Sensor
Bridge
INP
INN
VSSB
Power-On
Reset
Pre-
Amplifier
Clock
Generator Ring
Oscillator
A
D
16 Bit
System
Control
Unit
DSP Core
(Calculations,
Communication)
EOC
MTP
ROM
SPI
I²C
SCLK/SCL
SS
MOSI/SDA
MISO
SEL
© 2016 Integrated Device Technology, Inc.
11
March 28, 2016

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