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PDF ZSSC3016 Data sheet ( Hoja de datos )
| Número de pieza | ZSSC3016 | |
| Descripción | 16-Bit Sensor Signal Conditioner | |
| Fabricantes | IDT | |
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Low Power, High Resolution
16-Bit Sensor Signal Conditioner
ZSSC3016
Datasheet
Brief Description
The ZSSC3016 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Designed for high-resolution altimeter module
applications, the ZSSC3016 can perform offset,
span, and 1st and 2nd order temperature compensa-
tion of the measured signal. Developed for correc-
tion of resistive bridge sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
The measured and corrected bridge values are
provided at the digital output pins, which can be
configured as I2C™* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP)
running a correction algorithm. Calibration coeffici-
ents are stored on-chip in a highly reliable, non-
volatile, multiple-time programmable (MTP) memory.
Programming the ZSSC3016 is simple via the serial
interface and the PC-controlled calibration software
provided in the IDT Development Kit. The interface
is used for the PC-controlled calibration procedure,
which programs the set of calibration coefficients in
memory. The digital mating is fast and precise,
eliminating the overhead normally associated with
trimming external components and multi-pass
calibration routines.
Features
• Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing, two-
segment analog-to-digital converter (ADC)
• Fully programmable gain amplifier for optimizing
sensor signals: gain range 14 to 72 (linear factor)
• Internal auto-compensated temperature sensor
• Digital compensation of individual sensor offset;
1st and 2nd order digital compensation of sensor
gain
• Digital compensation of 1st and 2nd order temper-
ature gain and offset drift
• Intelligent power management unit
• Typical sensor elements can achieve accuracy of
better than ±0.10% FSO @ -40 to 85 °C
Benefits
• Integrated 18-bit calibration math DSP
• Fully corrected signal at digital output
• Minimize calibration costs through the one-pass
calibration concept
• No external trimming components required
• Highly integrated CMOS design
• Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
• Excellent for low-voltage and low-power battery
applications
Support
• Evaluation Kit
Physical Characteristics
• Supply voltage range: 1.8 to 3.6V
• Current consumption: 1mA (operating mode)
• Sleep State current: 70nA (25°C)
• Temperature resolution: <0.003K/LSB
• Operation temperature: –40°C to +85 °C
• Small die size
• Delivery options: die for wafer bonding
ZSSC3016 Application Example
VSS
VDD
EOC
Sensor Module
Sensor
Bridge
4
3
2
1
VDD
VSS
ZSSC3016
VSSB
EOC
SEL
SS
INN
VDDB
INP
VPP
MISO
MOSI
SDA
SCLK
SCL
VSS
VDD
SEL
SS
MISO
MOSI_SDA
SCLK_SCL
VPP
6.75V … programming
voltage for setup & calibration
* I2C™ is a trademark of NXP.
Battery
Microcontroller
© 2016 Integrated Device Technology, Inc.
1
January 25, 2016
1 page  
ZSSC3016 Datasheet
Table 2.5
Table 2.6
Table 2.7
Table 3.1
Table 3.2
Table 3.3
Table 3.4
Table 3.5
Table 3.6
Table 3.7
Table 3.8
Table 4.1
ADC Conversion Times for a Single A2D Conversion...................................................................... 14
Conversion Times vs. Noise Performance for 16-Bit Fully Signal Conditioned Results (AZBM,
BM, AZTM, TM and Digital SSC Correction) .................................................................................... 14
ADC Offset Settings.......................................................................................................................... 16
SPI/I2C™ Commands ....................................................................................................................... 21
Get_Raw Commands ....................................................................................................................... 23
General Status Byte.......................................................................................................................... 24
Status Byte for Read Operations ...................................................................................................... 24
Status Byte for Write Operations ...................................................................................................... 24
Mode Status...................................................................................................................................... 24
Memory Status Word ........................................................................................................................ 30
MTP Memory Content Assignments. ................................................................................................ 31
Pad Assignments .............................................................................................................................. 42
© 2016 Integrated Device Technology, Inc.
5
January 25, 2016
5 Page 
ZSSC3016 Datasheet
The amplifier consists of two stages with programmable gain values. The 1/f noise and inherent offset are
suppressed by auto-zero and chopper stabilizer techniques. This auto-zero sequence is performed before each
bridge sensor and temperature measurement to compensate for the inherent offset of the amplifier.
The ZSSC3016 employs a charge-balancing analog-to-digital converter (ADC) based on switched-capacitor
technique with inherit low-pass behavior and noise suppression. The programmable resolution from 10 to 16 bit
provides flexibility for adapting the conversion characteristics. To improve power supply noise suppression, the
ADC uses the bridge supply VDDB as its reference voltage.
The remaining IC-internal and the sensor element offset i.e., the overall system offset (amplifier and ADC) can be
canceled by an offset and auto-zero measurement, respectively.
The DSP accomplishes the auto-zero, span, and 1st and 2nd order temperature compensation of the measured
bridge signal. The correction coefficients are stored in the MTP memory.
The ZSSC3016 supports SPI and I2C™ interface communication for controlling, configuration and measurement
result output.
2.3. Analog Front End
2.3.1. Amplifier
The amplifier has a differential architecture and consists of two stages. The amplification of each stage and the
sensor bridge gain polarity are programmable via settings in the Measurement Configuration Register
(BM_config) in the MTP memory (see section 2.4.2).
The first five bits of BM_config are the programmable gain settings Gain_stage1 and Gain_stage2. The options
for the programmable gain settings are listed in Table 2.1 and Table 2.2.
Table 2.1 Amplifier Gain: Stage 1
Gain_stage1
Bit G1
Bit G0
Stage 1 Gain Setting
00
12
01
20
10
30
11
40
© 2016 Integrated Device Technology, Inc.
11
January 25, 2016
11 Page | ||
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