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PDF ADP160 Data sheet ( Hoja de datos )

Número de pieza ADP160
Descripción CMOS Linear Regulators
Fabricantes Analog Devices 
Logotipo Analog Devices Logotipo



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Data Sheet
Ultralow Quiescent Current,
150 mA, CMOS Linear Regulators
ADP160/ADP161/ADP162/ADP163
FEATURES
Ultralow quiescent current
IQ = 560 nA with 0 µA load
IQ = 860 nA with 1 µA load
Stable with 1 µF ceramic input and output capacitors
Maximum output current: 150 mA
Input voltage range: 2.2 V to 5.5 V
Low shutdown current: <50 nA typical
Low dropout voltage: 195 mV at 150 mA load
Initial accuracy: ±1%
Accuracy over line, load, and temperature: ±3.5%
15 fixed output voltage options: 1.2 V to 4.2 V
Adjustable output available
PSRR performance of 72 dB at 100 Hz
Current limit and thermal overload protection
Logic-control enable
Integrated output discharge resistor
5-lead TSOT package
4-ball, 0.5 mm pitch WLCSP
APPLICATIONS
Mobile phones
Digital cameras and audio devices
Portable and battery-powered equipment
Post dc-to-dc regulation
Portable medical devices
TYPICAL APPLICATION CIRCUITS
VIN = 2.3V
1µF
ADP160/ADP162
VOUT = 1.8V
1 VIN VOUT 5
2 GND
1µF
ON
OFF
3 EN
NC 4
NC = NO CONNECT
Figure 1. 5-Lead TSOT ADP160/ADP162 with Fixed Output Voltage, 1.8 V
VIN = 4.2V
1µF
ON
OFF
ADP161/ADP163
VOUT = 3.2V
1 VIN VOUT 5
2 GND
1µF
R1
3 EN
ADJ 4
R2
Figure 2. 5-Lead TSOT ADP161/ADP163 with Adjustable Output Voltage, 3.2 V
VIN = 3.3V
1µF
ON
OFF
ADP160/ADP162
12
VOUT = 2.8V
A VIN
VOUT
TOP VIEW
1µF
(Not to Scale)
B EN
GND
Figure 3. 4-Ball WLCSP ADP160/ADP162 with Fixed Output Voltage, 2.8 V
GENERAL DESCRIPTION
The ADP160/ADP161/ADP162/ADP163 are ultralow quiescent
current, low dropout, linear regulators that operate from 2.2 V
to 5.5 V and provide up to 150 mA of output current. The low
195 mV dropout voltage at 150 mA load improves efficiency and
allows operation over a wide input voltage range.
The ADP16x are specifically designed for stable operation with a
tiny 1 µF ± 30% ceramic input and output capacitors to meet
the requirements of high performance, space-constrained
applications.
The ADP160 is available in 15 fixed output voltage options,
ranging from 1.2 V to 4.2 V. The ADP160/ADP161 also include
a switched resistor to discharge the output automatically when
the LDO is disabled. The ADP162 is identical to the ADP160
but does not include the output discharge function.
The ADP161 and ADP163 are available as adjustable output voltage
regulators. They are only available in a 5-lead TSOT package.
The ADP163 is identical to the ADP161 but does not include
the output discharge function.
Short-circuit and thermal overload protection circuits prevent
damage in adverse conditions. The ADP160 and ADP162 are
available in a tiny 5-lead TSOT and a 4-ball, 0.5 mm pitch
WLCSP package for the smallest footprint solution to meet a
variety of portable power applications.
Rev. H
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2010–2013 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com

1 page




ADP160 pdf
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VIN to GND
VOUT to GND
EN to GND
ADJ to GND
NC to GND
Storage Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Soldering Conditions
Rating
−0.3 V to +6.5 V
−0.3 V to VIN
−0.3 V to VIN
−0.3 V to VIN
−0.3 V to VIN
−65°C to +150°C
−40°C to +125°C
−40°C to +125°C
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings only apply individually; they do not
apply in combination. The ADP16x can be damaged when the
junction temperature limits are exceeded. Monitoring ambient
temperature does not guarantee that TJ is within the specified
temperature limits. In applications with high power dissipation
and poor thermal resistance, the maximum ambient temperature
may have to be derated.
In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (TJ) of
the device is dependent on the ambient temperature (TA), the
power dissipation of the device (PD), and the junction-to-ambient
thermal resistance of the package (θJA).
Maximum junction temperature (TJ) is calculated from the ambient
temperature (TA) and power dissipation (PD) using the formula
TJ = TA + (PD × θJA)
ADP160/ADP161/ADP162/ADP163
Junction-to-ambient thermal resistance (θJA) of the package is
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on the
application and board layout. In applications where high maximum
power dissipation exists, close attention to thermal board design
is required. The value of θJA may vary, depending on PCB material,
layout, and environmental conditions. The specified values of
θJA are based on a 4-layer, 4 inches × 3 inches, circuit board. Refer
to JESD 51-7 and JESD 51-9 for detailed information on the
board construction. For additional information, see the AN-617
Application Note, MicroCSP™ Wafer Level Chip Scale Package.
ΨJB is the junction to board thermal characterization parameter
with units of °C/W. ΨJB of the package is based on modeling and
calculation using a 4-layer board. The JESD51-12, Guidelines for
Reporting and Using Electronic Package Thermal Information,
states that thermal characterization parameters are not the same
as thermal resistances. ΨJB measures the component power flowing
through multiple thermal paths rather than a single path as in
thermal resistance, θJB. Therefore, ΨJB thermal paths include
convection from the top of the package as well as radiation from
the package, factors that make ΨJB more useful in real-world
applications. Maximum junction temperature (TJ) is calculated
from the board temperature (TB) and power dissipation (PD)
using the formula
TJ = TB + (PD × ΨJB)
Refer to JESD51-8 and JESD51-12 for more detailed information
about ΨJB.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA ΨJB Unit
5-Lead TSOT
170 43
°C/W
4-Ball, 0.4 mm Pitch WLCSP 260
58
°C/W
ESD CAUTION
Rev. H | Page 5 of 24

5 Page





ADP160 arduino
Data Sheet
10
1
VOUT = 1.2V
VOUT = 3.3V
VOUT = 2.5V
0.1
10
100 1k 10k
FREQUENCY (Hz)
100k
Figure 25. Output Noise Spectral Density, VIN = 5 V, ILOAD = 10 mA, COUT = 1 μF
T
1
LOAD CURRENT
ADP160/ADP161/ADP162/ADP163
T
VIN
VOUT
2
1
CH1 1V
CH2 20mV
M200µs
T 10.20%
A CH1 4.34V
Figure 28. Line Transient Response, VIN = 4 V to 5 V, CIN = COUT = 1 μF,
ILOAD = 150 mA, CH1 = VIN, CH2 = VOUT
T
VIN
2
VOUT
CH1 100mA CH2 200mV M200µs
T 10.40%
A CH1 62mA
Figure 26. Load Transient Response, CIN, COUT = 1 μF, ILOAD = 1 mA to 150 mA,
200 ns Rise Time, CH1 = Load Current, CH2 = VOUT
T LOAD CURRENT
1
2 VOUT
1
CH1 1V
CH2 20mV
M200µs
T 10.20%
A CH1 4.56V
Figure 29. Line Transient Response, VIN = 4 V to 5 V, CIN, = 1 μF, COUT = 10 μF,
ILOAD = 150 mA, CH1 = VIN, CH2 = VOUT
2 VOUT
CH1 20mA CH2 5mV
M200µs
T 10.40%
A CH1 24mA
Figure 27. Load Transient Response, CIN, COUT = 1 μF, ILOAD = 1 mA to 50 mA,
200 ns Rise Time, CH1 = Load Current, CH2 = VOUT
Rev. H | Page 11 of 24

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