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PDF EE-SX4340 Data sheet ( Hoja de datos )
| Número de pieza | EE-SX4340 | |
| Descripción | Photomicrosensor | |
| Fabricantes | Omron | |
| Logotipo |  |
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Photomicrosensor (Transmissive)
EE-SX3340/EE-SX4340
Compact Slot / SMD Type (Slot width: 4 mm)
• Unique 4 mm Slot width.
• PCB surface mounting type.
• High resolution with a 0.5-mm-wide aperture.
• Choice of 2 types of Photo-IC output (EE-SX3340: Dark ON,
EE-SX4340: Light ON).
Be sure to read Safety Precautions on page 3.
Ordering Information
Photomicrosensor
Appearance
Sensing
method
Connecting
method
Sensing distance
Aperture size (H × W)
(mm)
Output type
5.5
8
Transmissive
(slot type)
4
SMT
4 mm (Slot width)
Emitter 1.04 × 1.4
Detector 1.4 × 0.5
Photo IC
Model
EE-SX3340
(Dark-ON)
EE-SX4340
(Light-ON)
Ratings, Characteristics and Exterior Specifications
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Rated value
Unit Remarks
Emitter
Forward current
Reverse voltage
IF
VR
30 mA --- *1
4 V ---
Detector
Power supply
voltage
VCC
16 V ---
Output voltage
VOUT
28
V ---
Output current
IOUT
16 mA ---
Permissible
output
dissipation
POUT
80 mW --- *1
Operating
temperature
Topr
-30 to +85
°C --- *1
Storage
temperature
Tstg
-40 to +100
°C --- *1
Reflow soldering
temperature
Tsol
255
°C
10 sec.
max. *2
*1. Continuous Forward Current and Collector Power Dissipation
must be derated complying. The product should be used without
freezing or condensation.
*2. In case of reflow soldering, conditions which are shown at the
temperature profile should be kept.
Exterior Specifications
Connecting method
SMT
Weight (g)
0.2
Material
Case
PPS
Electrical and Optical Characteristics (Ta = 25°C)
Item
Emitter
Forward voltage
Reverse current
Peak emission
wavelength
Detector
Power supply
voltage
Low-level output
voltage
High-level output
voltage
Current
consumption
Peak spectral
sensitivity
wavelength
LED current when
output is OFF
(EE-SX3340)
LED current when
output is ON
(EE-SX4340)
Hysteresis
Response frequency
Response delay time
Response delay time
Value
Symbol
Unit
MIN. TYP. MAX.
Condition
VF --- 1.2 1.5 V IF = 20 mA
IR --- 0.01 10 μA VR = 4 V
λP --- 940 --- nm IF = 20 mA
VCC 4.5 --- 16 V
---
VCC = 4.5 to 16 V
IF = 0 mA
VOL
--- 0.12 0.4
V
(EE-SX3340)
IF = 10 mA
(EE-SX4340)
IOL=16 mA
VCC = 4.5 to 16 V
IF = 10 mA
IOH
---
---
100
μA
(EE-SX3340)
IF = 0 mA
(EE-SX4340)
VOH = 28 V
ICC --- 4 10 mA VCC = 4.5 to 16 V
λP --- 870 --- nm VCC = 4.5 to 16 V
IFT --- --- 8 mA VCC = 4.5 to 16 V
UH --- 15 --- % VCC = 4.5 to 16 V *1
VCC = 4.5 to 16 V
f 3 --- --- kHz IF = 20 mA
IOL = 16 mA *2
tPLH
(tPHL)
---
6
VCC = 4.5 to 16 V
--- μs IF = 20 mA
IOL = 16 mA *3
tPHL
(tPLH)
---
10
VCC = 4.5 to 16 V
--- μs IF = 20 mA
IOL=16 mA *3
1
1 page  
Soldering Information
Reflow soldering : Temperature profile
1. The reflow soldering can be implemented in two times complying
with the following diagram.All the temperatures in the product must
be within the diagram.
2. The recommended thickness of the metal mask for screen printing
is between 0.2 and 0.25 mm.
260°C max.
255°C
1 to 4°C/s
230°C
1 to 4°C/s
150 to 180°C max.
120 sec max.
10 sec max.
40 sec max.
1 to 4°C/sec
EE-SX3340/EE-SX4340
Manual soldering
The manual soldering should not be applied to the products,
otherwise the housing may be deformed and/or the Au plating may be
peeled off by heat.
Other notes
The use of infrared lamp causes the temperature at the resin to rise
particularly too high.
All the temperatures in the product must be within the above diagram.
Do not immerse the resin part into the solder. Even if within the above
temperature diagram, there is a possibility that the gold wire in the
products is broken in case that the deformation of PC board gives
stress to the products.
Please confirm the conditions (including material and method of flux
and cleaning) of the reflow soldering fully by actual solder reflow
machine prior to the mass production use.
Time (s)
Storage
Storage conditions
To protect the product from the effects of humidity until the package
is opened, dry-box storage is recommended. If this is not possible,
store the product under the following conditions:
Temperature: 10 to 30 °C
Humidity: 60% RH max.
Baking
In case that it could not carry out the above treatment, it is able to
mount by the following baking treatment. However baking treatment
shall be limited only 1 time.
Recommended conditions: 60°C for 24 to 48 hours (reeled one)
100°C for 8 to 24 hours (loose one)
Treatment after open
1. Reflow soldering must be done within 48 hours stored at the
conditions of humidity 60% RH or less and temperature 10 to
30°C.
2. If the product must be stored after it is unpacked, store it in a dry
box or reseal it in a moisture-proof package with desiccant at a
temperature of 10 to 30°C and a humidity of 60% RH or less. Even
then, mount the product within one week.
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet EE-SX4340.PDF ] | |
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