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PDF GS7169 Data sheet ( Hoja de datos )
| Número de pieza | GS7169 | |
| Descripción | 3A Ultra Low Dropout Linear Regulator | |
| Fabricantes | GStek | |
| Logotipo |  |
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3A Ultra Low Dropout Linear Regulator
GS7169
Features
Maximum 3A Low-Dropout Voltage Regulator
Ultra Low Dropout Voltage
Typically 240mV at 3A Output Current
High Output Accuracy over Line, Load and
Temperature
Build-In Soft-Start
Excellent startup under load from 0 to 3A
Power-On-Reset Monitoring on Both VDD and
VIN Pins
Power-OK Output function
Foldback over Current Protection and
Thermal shutdown
0.1μA (typ) Shutdown Supply Current
Low ESR Output Capacitor(Multi-layer Chip
Capacitors (MLCC)) Applicable
Vout Pull Low Resistance when Disable
TDFN8-2x2
Green Product (RoHS, Lead-Free,
Halogen-Free Compliant)
Applications
Notebook PC Applications
Motherboard Applications
Low Voltage Logic Supplies
Microprocessor and Chipset Supplies
Graphic Cards
Cordless phones
General Description
The GS7169 can deliver up to 3A of output
current with a typical dropout voltage of only
240mV using internal n-channel MOSFETs. The
linear regulator uses a separate VDD supply to
power the control circuitry and drive the Internal
n-channel MOSFETs. The output voltage is
adjustable from 0.8V to the voltage that is very
close to VIN.
The GS7169 allows the use of low-ESR ceramic
capacitor as low as 10uF. Moreover the IC
provides good performance on both line transient
response and load transient response.
The GS7169 provides foldback over current limit
and thermal shutdown to prevent the linear
regulator from damage. Built-in soft-start
minimizes stress on the input power source by
reducing capacitive inrush current on start-up.
During start-up, POK remain low until the output
reaches 92% of its rating value.
The GS7169 is available in TDFN8-2x2 package.
This document is GStek's confidential information. Anyone having confidential obligation to GStek shall keep this document confidential. Any unauthorized
disclosure or use beyond authorized purpose will be considered as violation of confidentiality and criminal and civil liability will be asserted.
Green Solution Technology Co.,LTD.
1
Rev.:0.2(Preliminary Specification)
1
Jun-14
1 page  
3A Ultra Low Dropout Linear Regulator
GS7169
Recommend Operating Condition (Note 4)
Parameter
Symbol
Supply Voltage
Control Voltage (Note 5)
Junction Temperature
Ambient Temperature
VIN
VDD
TJ
TA
Limits
1.0 < VIN< min{5.2V,VDD}
3.0 < VDD< 5.5
- 40 ~ 125
-40 ~ 85
Units
V
V
°C
°C
Electrical Characteristics
(VIN= VOUT+0.5V, VEN=VDD=5V, CIN=COUT=10uF, TA=TJ=-40~125°C)
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Supply Voltage Section
VDD Operation Voltage
Range
VIN Operation Voltage
Range
Quiescent current
VDD
VIN
IQ
VDD Input current
Control Input Current in
Shutdown
VDD POR Threshold
VDD POR Hysteresis
VIN POR Threshold
VIN POR Hysteresis
IVDD
IVDD_SD
VDDRTH
VINRTH
VDD Input Range, VOUT=VREF
VIN Input Range, VOUT=VREF
VDD=VIN=VEN=5V,IOUT=0A,
VOUT=VREF
VDD=VIN=VEN=5V, IOUT=0A,
VOUT=VREF
VDD=VIN=5.0V, IOUT=0A, VEN=0V
Output Voltage
Reference Voltage
Output Voltage
Accuracy
Line Regulation (VDD)
Line Regulation (VIN)
Load Regulation
(Note 6)
VOUT Pull Low
Resistance
VREF
IOUT=1mA, VOUT=VREF
△ VLINE_VDD
△ VLINE_IN
VDD=4V to 5V, IOUT=1mA,
VOUT=VREF, VIN=2V
VIN=1.2V to 5V, IOUT=1mA,
VOUT=VREF
△ VLOAD
IOUT=1mA to 3 A, VOUT=VREF
VDD=VIN=5.0V, VEN=0V
3.0
1.0
2.4
0.15
0.55
0.13
0.784
-2.0
5.5
min{5.2
V,VDD}
1.0 1.5
1.0 1.5
0.1 12
2.7 3
0.2
0.75 0.95
0.20
0.8 0.816
+2.0
0.03 0.2
0.01 0.1
0.1 1.5
130
V
V
mA
mA
uA
V
V
V
V
V
%
%
%
%
Ω
Green Solution Technology Co.,LTD.
Rev.:0.2(Preliminary Specification)
1
5
Jun-14
5 Page 
3A Ultra Low Dropout Linear Regulator
GS7169
VOUT
R1(R2=10KΩ)
COPTION
0.8V ~ 1.6V
0 ~ 10 KΩ
470pF~1nF
1.6V ~ 2.4V 10 KΩ ~ 20 KΩ 100pF~500pF
2.4V ~ 3.6V 20 KΩ ~ 30 KΩ 20pF~300pF
Table 2. R2=10KΩ
Vout
FB
R1
R2
Vout
Coption
Cout
Figure 4 Feedback Network
Input Capacitor selection
Bypass VIN to ground with a 10uF or greater
capacitor. Bypass VDD to ground with a 1uF
capacitor for normal operation in most appli-
cations. Ceramic, tantalum or aluminum elec-
trolytic capacitors may be selected for input
capacitor. However ceramic capacitors are
recommended due to their significant cost and
space savings. Place the capacitors physically as
close as possible to the device with wide and
direct PCB traces.
Power Dissipation and Layout Considerations
Although internal thermal limiting function is
integrated in GS7169, continuously keeping the
junction near the thermal shutdown temperature
may possibly affect device reliability. For
continuous operation, it is highly recommended to
keep the junction temperature below the
maximum operation junction temperature 125°C
for maximum reliability.
The power dissipation definition in device is:
PD = (VIN − VOUT) x IOUT + VDD x IQ
The maximum power dissipation can
be
calculated as:
PD(MAX) = ( TJ(MAX) − TA ) / θJA
Where TJ(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient
temperature and the θJA is the junction to ambient
thermal resistance.
The thermal resistance θJA for TDFN8-2x2
package is 121.6°C/W on the standard JEDEC
51-7 (4 layers, 2S2P) thermal test board. The
copper thickness is 2oz. The maximum power
dissipation at TA = 25°C can be calculated by
following formula:
PD(MAX) = (125°C − 25°C) / (121.6°C/W) = 0.822W
(TDFN8-2x2 Exposed Pad on the minimum
layout)
The thermal resistance θJA of TDFN8-2x2 is
determined by the package design and the PCB
design. Copper plane under the exposed pad is
an effective heat sink and is useful for improving
thermal conductivity. As shown in Figure 5, the
amount of copper area to which the TDFN8-2x2 is
mounted affects thermal performance. When
mounted to the standard TDFN8-2x2 pad (Figure
5.a), θJA is 121.6°C/W. Increasing copper area of
pad under the TDFN8-2x2 can reduce the θJA.
Figure 5. Minimum Footprint, JA =121.6C/W
Green Solution Technology Co.,LTD.
Rev.:0.2(Preliminary Specification)
1
11
Jun-14
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet GS7169.PDF ] | |
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