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PDF FPF1039 Data sheet ( Hoja de datos )
| Número de pieza | FPF1039 | |
| Descripción | Slew-Rate-Controlled Load Switch | |
| Fabricantes | Fairchild Semiconductor | |
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April 2015
FPF1039
Low On-Resistance, Slew-Rate-Controlled Load Switch
Features
1.2 V to 5.5 V Input Voltage Operating Range
Typical RON:
20 mΩ at VIN=5.5 V
21 mΩ at VIN=4.5 V
37 mΩ at VIN=1.8 V
75 mΩ at VIN=1.2 V
Slew Rate / Inrush Control with tR: 2.7 ms (Typical)
3.5 A Maximum Continuous Current Capability
Output Capacitor Discharge Function
Low <1 µA Shutdown Current
ESD Protected: Above 8 kV HBM, 1.5 kV CDM
GPIO / CMOS-Compatible Enable Circuitry
Applications
HDD, Storage, and Solid-State Memory Devices
Portable Media Devices, UMPC, Tablets, MIDs
Wireless LAN Cards and Modules
SLR Digital Cameras
Portable Medical Devices
GPS and Navigation Equipment
Industrial Handheld and Enterprise Equipment
Description
The FPF1039 advanced load-management switch target
applications requiring a highly integrated solution for
disconnecting loads powered from DC power rail (<6 V)
with stringent shutdown current targets and high load
capacitances (up to 200 µF). The FPF1039 consists of
slew-rate controlled low-impedance MOSFET switch
(21 mΩ typical) and other integrated analog features.
The slew-rate controlled turn-on characteristic prevents
inrush current and the resulting excessive voltage droop
on power rails.
This device has exceptionally low shutdown current
drain (<1 µA maximum) that facilitates compliance in
low standby power applications. The input voltage range
operates from 1.2 V to 5.5 V DC to support a wide range
of applications in consumer, optical, medical, storage,
portable, and industrial device power management.
Switch control is managed by a logic input (active HIGH)
capable of interfacing directly with low-voltage control
signal / GPIO with no external pull-up required. The
device is packaged in advanced fully “green” 1mm
x1.5 mm Wafer-Level Chip-Scale Packaging (WLCSP);
providing excellent thermal conductivity, small footprint,
and low electrical resistance for wider application usage.
Ordering Information
Part Number
Top
Mark
Switch
RON
(Typical)
at 4.5 VIN
FPF1039UCX QF
21 mΩ
FPF1039BUCX QF
21 mΩ
Input
Buffer
CMOS
CMOS
Output ON Pin
Discharge Activity
tR
Package
65Ω
Active HIGH
2.7 ms
6-Bump, WLCSP, 1.0 mm
x 1.5 mm, 0.5 mm Pitch
6-Bump, WLCSP with
65Ω
Active HIGH
2.7 ms
Backside Laminate,
1.0 mm x 1.5 mm,
0.5 mm Pitch
© 2010 Fairchild Semiconductor Corporation
FPF1039 • Rev. 1.5
www.fairchildsemi.com
1 page  
Electrical Characteristics
Unless otherwise noted, VIN=1.2 to 5.5V and TA=-40 to +85°C; typical values are at VIN=4.5V and TA=25°C.
Symbol
Parameters
Conditions
Min. Typ. Max. Units
Basic Operation
VIN Input Voltage
1.2
IQ(OFF) Off Supply Current
VON=GND, VOUT=Open
ISD Shutdown Current
VON=GND, VOUT=GND
IQ Quiescent Current
IOUT=0 mA
VIN=5.5 V, IOUT=1 A(3)
RON On Resistance
VIN=4.5 V, IOUT=1 A, TA=25°C
VIN=3.3 V, IOUT=500 mA(3)
VIN=2.5 V, IOUT=500 mA(3)
VIN=1.8 V, IOUT=250 mA(3)
VIN=1.2 V, IOUT=250 mA, TA=25°C
RPD
Output Discharge RPULL DOWN
VIN=4.5 V, VON=0 V, IFORCE=20 mA,
TA=25°C
VIH On Input Logic HIGH Voltage
1.0
VIL On Input Logic LOW Voltage
ION On Input Leakage
Dynamic Characteristics
tDON
tR
tON
tDOFF
tF
tOFF
Turn-On Delay(4)
VOUT Rise Time(4)
Turn-On Time(6)
Turn-Off Delay(4,5)
VOUT Fall Time(4,5)
Turn-Off (5,7)
VIN=4.5 V, RL=5 Ω, CL=100 µF,
TA=25°C
VIN=4.5 V, RL=150 Ω, CL=100 µF,
TA=25°C (5)
Notes:
3. This parameter is guaranteed by design and characterization; not production tested.
4. tDON/tDOFF/tR/tF are defined in Figure 32.
5. Output discharge enabled during off-state.
6. tON=tR + tDON
7. tOFF=tF + tDOFF
0.2
5.5
20
21
24
28
37
75
65
1.7
2.7
4.4
0.5
10.0
10.5
5.5
1.0
1.0
8.0
24
25
29
35
45
100
85
0.4
1.5
V
μA
μA
μA
mΩ
Ω
V
V
μA
ms
ms
ms
ms
ms
ms
© 2010 Fairchild Semiconductor Corporation
FPF1039 • Rev. 1.5
5
www.fairchildsemi.com
5 Page 
Application Information
Input Capacitor
This IntelliMAX™ switch doesn’t require an input
capacitor. To reduce device inrush current, a 0.1 µF
ceramic capacitor, CIN, is recommended close to the
VIN pin. A higher value of CIN can be used to reduce the
voltage drop experienced as the switch is turned on into
a large capacitive load.
Output Capacitor
While this switch works without an output capacitor: if
parasitic board inductance forces VOUT below GND
when switching off; a 0.1 µF capacitor, COUT, should be
placed between VOUT and GND.
Fall Time
Device output fall time can be calculated based on RC
constant of the external components as follows:
tF RL CL 2.2
(1)
where tF is 90% to 10% fall time, RL is output load,
and CL is output capacitor.
The same equation works for a device with a pull-down
output resistor. RL is replaced by a parallel connected
pull-down and an external output resistor combination as:
tF
RL
RL
RPD
RPD
CL
2.2
(2)
where tF is 90% to 10% fall time, RL is output load,
RPD=65 is output pull-down resistor, and CL is the
output capacitor.
Resistive Output Load
If resistive output load is missing, the IntelliMAX switch
without a pull-down output resistor does not discharge
the output voltage. Output voltage drop depends, in that
case, mainly on external device leaks.
Application Specifics
At maximum operational voltage (VIN=5.5 V), device
inrush current might be higher than expected. Spike
current should be taken into account if VIN>5 V and the
output capacitor is much larger than the input capacitor.
Input current can be calculated as:
IIN(t)
VOUT (t)
RLOAD
(CLOAD
CIN
)
dVOUT
dt
(t)
(3)
where switch and wire resistances are neglected and
capacitors are assumed ideal.
Estimating VOUT(t)=VIN/10 and using experimental
formula for slew rate (dVOUT(t)/dt), spike current can be
written as:
max IIN
VIN
10RLOAD
CLOAD
CIN0.05VIN
0.255
(4)
where supply voltage VIN is in volts, capacitances are
in micro farads, and resistance is in ohms.
Example: If VIN=5.5V, CLOAD=100 µF, CIN=10 µF, and
RLOAD=50 ; calculate the spike current by:
max(
IIN)
5.5
1050
(100
10)(0.055.5
0.255 )A
1.8A
(5)
Maximum spike current is 1.8 A, while average ramp-
up current is:
IIN(t)
VOUT (t)
RLOAD
(CLOAD
CIN )
dVIN(t)
dt
2.75 / 50 100 0.0022 0.275 A
(6)
Output Discharge
FPF1039 contains a 65 Ω on-chip pull-down resistor for
quick output discharge. The resistor is activated when
the switch is turned off.
Recommended Layout
For best thermal performance and minimal inductance
and parasitic effects, it is recommended to keep input
and output traces short and capacitors as close to the
device as possible. Figure 34 is a recommended layout
for this device to achieve optimum performance.
Vin Vout
VIN FPF1039
CIN OFF ON ON
GND
+
CLOAD
RLOAD
Figure 33. Device Setup
© 2010 Fairchild Semiconductor Corporation
FPF1039 • Rev. 1.5
Figure 34. Recommended Land Pattern, Layout
www.fairchildsemi.com
11
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet FPF1039.PDF ] | |
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