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Número de pieza | VIPER01 | |
Descripción | Energy saving off-line high voltage converter | |
Fabricantes | STMicroelectronics | |
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Energy saving off-line high voltage converter
Datasheet - production data
Figure 1: Basic application schematic
Features
800 V avalanche-rugged power MOSFET
allowing ultra wide VAC input range to be
covered
Embedded HV startup and sense-FET
Current mode PWM controller
Drain current limit protection (OCP)
Wide supply voltage range: 4.5 V to 30 V
Self-supply option allows the auxiliary
winding or bias components to be removed
Minimized system input power consumption:
Less than 10 mW @ 230 VAC in no-load
condition
Less than 400 mW @ 230 VAC with
250 mW load
Jittered switching frequency reduces the
EMI filter cost:
30 kHz ± 7% (type X)
60 kHz ± 7% (type L)
120 kHz ± 7% (type H)
Embedded E/A with 1.2 V reference
Protections with automatic restart:
overload/short-circuit (OLP), line or output
OVP, max. duty cycle counter, VCC clamp
Pulse-skip protection to prevent
flux-runaway
Embedded thermal shutdown
Built-in soft-start for improved system
reliability
Applications
Low power SMPS for home appliances,
building and home control, small industrial,
consumers, lighting, motion control
Low power adapters
Description
The device is a high voltage converter smartly
integrating an 800 V avalanche-rugged power
MOSFET with PWM current mode control. The
power MOSFET with 800 V breakdown voltage
allows the extended input voltage range to be
applied, as well as the size of the DRAIN snubber
circuit to be reduced. This IC meets the most
stringent energy-saving standards as it has very
low consumption and operates in pulse frequency
modulation under light load. The design of
flyback, buck and buck boost converters is
supported. The integrated HV startup, sense-
FET, error amplifier and oscillator with jitter allow
a complete application to be designed with the
minimum number of components.
March 2016
DocID028751 Rev 1
This is information on a product in full production.
1/36
www.st.com
1 page VIPer01
1 Pin setting
Figure 2: Connection diagram
Pin setting
Table 1: Pin description
SSOP10 Name
Function
Ground and MOSFET source. Connection of source of the internal MOSFET
1
GND
and the return of the bias current of the device. All groundings of bias
components must be tied to a trace going to this pin and kept separate from the
pulsed current return.
Controller supply. An external storage capacitor has to be connected across
this pin and GND. The pin, internally connected to the high voltage current
2
VCC
source, provides the VCC capacitor charging current at startup and during
steady-state operation, if the self-supply mode is selected. A small bypass
capacitor (0.1 μF typ.) in parallel, placed as close as possible to the IC, is also
recommended, for noise filtering purpose.
Disable. If its voltage exceeds the internal threshold VDIS_th (1.2 V typ.) for more
than tDEB time (1 ms, typ.), the PWM is disabled in auto-restart mode. An input
overvoltage protection can be built by connecting a voltage divider between DIS
3 DIS pin and the rectified mains. In case of non-isolated topologies, with the same
principle an output overvoltage protection can be implemented. If the disable
function is not required, DIS pin must be soldered to GND, which excludes the
function.
Direct feedback. It is the inverting input of the internal transconductance E/A,
which is internally referenced to 1.2 V with respect to GND. In case of non-
4 FB isolated converter, the output voltage information is directly fed into the pin
through a voltage divider. In case of primary regulation, the FB voltage divider is
connected to the VCC. The E/A is disabled soldering FB to GND.
Compensation. It is the output of the internal E/A. A compensation network is
placed between this pin and GND to achieve stability and good dynamic
5 COMP performance of the control loop. In case of secondary feedback, the internal E/A
must be disabled and the COMP directly driven by the optocoupler to control the
DRAIN peak current setpoint.
6 to 10
DRAIN
MOSFET drain. The internal high voltage current source sinks current from this
pin to charge the VCC capacitor at startup and during steady-state operation.
These pins are mechanically connected to the internal metal PAD of the
MOSFET in order to facilitate heat dissipation. On the PCB, copper area must
be placed under these pins in order to decrease the total junction-to-ambient
thermal resistance thus facilitating the power dissipation.
DocID028751 Rev 1
5/36
5 Page VIPer01
Symbol
Oscillator
Parameter
FOSC
Switching frequency
FOSC_MIN
Minimum switching
frequency
FD Modulation depth
FM Modulation frequency
DMAX
Max. duty cycle
Thermal shutdown
TSD
Thermal shutdown
temperature
Test conditions
TJ = 25 °C
VIPer01*X
TJ = 25 °C
VIPer01*L
TJ = 25 °C
VIPer01*H
TJ = 25 °C (2)
(3)
(3)
(3)
(3)
Notes:
(1) See Section 5.10: "Pulse frequency modulation".
(2) See Section 5.7: "Pulse-skipping".
(3) Parameter assured by design and characterization.
Electrical and thermal ratings
Min. Typ. Max. Unit
27
54
108
13.5
70
30
60
120
15
±7
FOSC
260
33
66
132
16.5
80
kHz
kHz
%
Hz
%
150 160
°C
DocID028751 Rev 1
11/36
11 Page |
Páginas | Total 30 Páginas | |
PDF Descargar | [ Datasheet VIPER01.PDF ] |
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