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PDF IRFR3707ZPbF Data sheet ( Hoja de datos )
| Número de pieza | IRFR3707ZPbF | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | Infineon | |
| Logotipo |  |
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Applications
High Frequency Synchronous Buck
Converters for Computer Processor Power
High Frequency Isolated DC-DC
Converters with Synchronous Rectification
for Telecom and Industrial Use
Benefits
Very Low RDS(on) at 4.5V VGS
Ultra - Low Gate Impedance
Fully Characterized Avalanche Voltage and Current
Lead-Free
IRFR3707ZPbF
IRFU3707ZPbF
HEXFET® Power MOSFET
VDSS
30V
RDS(on) max
9.5m
Qg 9.6nC
D
D
S
G
D- Pak
IRFR3707ZPbF
S
GD
I- Pak
IRFU3707ZPbF
G
Gate
D
Drain
S
Source
Base part number
IRFU3707ZPbF
IRFR3707ZPbF
Package Type
I-Pak
D-Pak
Standard Pack
Form
Tube
Tube
Tape and Reel Left
Quantity
75
75
3000
Orderable Part Number
IRFU3707ZPbF
IRFR3707ZPbF
IRFR3707ZTRLPbF
Absolute Maximum Ratings
Symbol
Parameter
VDS Drain -to-Source Voltage
VGS Gate-to-Source Voltage
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
ID @ TC = 100°C
IDM
PD @TC = 25°C
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
Maximum Power Dissipation
PD @TC = 100°C Maximum Power Dissipation
Linear Derating Factor
TJ
TSTG
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case)
Thermal Resistance
Symbol
Parameter
RJC Junction-to-Case
RJA Junction-to-Ambient ( PCB Mount)
RJA Junction-to-Ambient
Notes through are on page 2.
Max.
30
± 20
56
39
220
50
25
0.33
-55 to + 175
300
Units
V
V
A
W
W
W/°C
°C
Typ.
–––
–––
–––
Max.
3.0
50
110
Units
°C/W
1 2016-5-31
1 page  
IRFR/U3707ZPbF
60
50 Limited By Package
40
30
20
10
0
25
50 75 100 125 150
TC , Case Temperature (°C)
175
Fig 9. Maximum Drain Current vs. Case Temperature
2.5
2.0
ID = 250µA
1.5
1.0
-75 -50 -25 0 25 50 75 100 125 150 175 200
TJ , Temperature ( °C )
Fig 10. Threshold Voltage vs. Temperature
10
D = 0.50
1
0.20
0.10
0.05
0.1 0.02
0.01
0.01
SINGLE PULSE
( THERMAL RESPONSE )
J J
1 1
R1R1
Ci= iRi
Ci= iRi
R2R2
2 2
0.001
1E-006
1E-005
0.0001
0.001
R3R3
3 3
CC
Ri (°C/W)
0.823
1.698
i (sec)
0.000128
0.000845
0.481
0.016503
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.01 0.1
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
5 2016-5-31
5 Page 
IRFR/U3707ZPbF
D-Pak (TO-252AA) Tape & Reel Information Dimensions are shown in millimeters (inches)
TR
16.3 ( .641 )
15.7 ( .619 )
TRR TRL
16.3 ( .641 )
15.7 ( .619 )
12.1 ( .476 )
11.9 ( .469 )
FEED DIRECTION
8.1 ( .318 )
7.9 ( .312 )
NOTES :
1. CONTROLLING DIMENSION : MILLIMETER.
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.
FEED DIRECTION
13 INCH
NOTES :
1. OUTLINE CONFORMS TO EIA-481.
16 mm
Note: For the most current drawing please refer to Infineon’s web site www.infineon.com
11
2016-5-31
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet IRFR3707ZPbF.PDF ] | |
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