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PDF P11NK50Z Data sheet ( Hoja de datos )

Número de pieza P11NK50Z
Descripción STP11NK50Z
Fabricantes STMicroelectronics 
Logotipo STMicroelectronics Logotipo



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STB11NK50Z - STP11NK50ZFP
STP11NK50Z
N-channel 500 V, 0.48 , 10 A TO-220, TO-220FP, D2PAK
Zener-protected SuperMESHTM Power MOSFET
Features
Type
STB11NK50Z
STP11NK50ZFP
STP11NK50Z
VDSS
500 V
500 V
500 V
RDS(on)
max
ID
Pw
< 0.52 10 A 125 W
< 0.52 10 A 30 W
< 0.52 10 A 125 W
Extremely high dv/dt capability
100% avalanche tested
Gate charge minimized
Very low intrinsic capacitances
Application
Switching applications
Description
The SuperMESH™ series is obtained through an
extreme optimization of ST’s well established
strip-based PowerMESH™ layout. In addition to
pushing on-resistance significantly down, special
care is taken to ensure a very good dv/dt
capability for the most demanding applications.
3
2
1
TO-220
3
1
D2PAK
3
2
1
TO-220FP
Figure 1. Internal schematic diagram
Table 1. Device summary
Order codes
Marking
STB11NK50ZT4
STP11NK50ZFP
STP11NK50Z
B11NK50Z
P11NK50ZFP
P11NK50Z
Package
D²PAK
TO-220FP
TO-220
Packaging
Tape and reel
Tube
Tube
May 2008
Rev 6
1/16
www.st.com
16

1 page




P11NK50Z pdf
STB11NK50Z - STP11NK50ZFP - STP11NK50Z
Electrical characteristics
Table 7. Switching times
Symbol
Parameter
td(on)
tr
Turn-on delay time
Rise time
td(off)
tf
Turn-off delay time
Fall time
tr(Voff)
tf
tc
Off-voltage rise time
Fall time
Cross-over time
Test conditions
VDD= 250 V, ID=5.5 A,
RG= 4.7 Ω, VGS=10 V
(see Figure 19)
VDD = 250 V, ID=5.5 A,
RG = 4.7 Ω, VGS=10 V
(see Figure 19)
VDD=400 V, ID=11.4 A,
RG=4.7 Ω, VGS=10 V
(see Figure 19)
Min. Typ. Max. Unit
14.5 ns
18 ns
41 ns
15 ns
11.5 ns
12 ns
27 ns
Table 8. Source drain diode
Symbol
Parameter
Test conditions
ISD Source-drain current
ISDM(1) Source-drain current (pulsed)
VSD(2) Forward on voltage
ISD=10 A, VGS=0
trr
Qrr
IRRM
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD=10 A,
di/dt = 100 A/µs,
VDD=45 V, Tj=150 °C
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration=300µs, duty cycle 1.5%
Min Typ. Max Unit
10 A
40 A
1.6 V
308 ns
2.4 µC
16 A
Table 9. Gate-source Zener diode
Symbol
Parameter
Test conditions
Min. Typ. Max. Unit
BVGSO(1) Gate-source breakdown voltage Igs=±1mA (open drain) 30
V
1. The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the
usage of external components.
5/16

5 Page





P11NK50Z arduino
STB11NK50Z - STP11NK50ZFP - STP11NK50Z
Package mechanical data
TO-220 mechanical data
mm inch
Dim
Min Typ Max Min Typ Max
A 4.40
4.60
0.173
0.181
b 0.61
0.88
0.024
0.034
b1 1.14
1.70
0.044
0.066
c 0.48
0.70
0.019
0.027
D 15.25
15.75
0.6
0.62
D1 1.27
0.050
E 10
10.40
0.393
0.409
e 2.40
2.70
0.094
0.106
e1 4.95
F 1.23
5.15
1.32
0.194
0.048
0.202
0.051
H1 6.20
6.60
0.244
0.256
J1 2.40
2.72
0.094
0.107
L 13
14 0.511
0.551
L1 3.50
3.93
0.137
0.154
L20 16.40
0.645
L30 28.90
1.137
P 3.75
3.85
0.147
0.151
Q 2.65
2.95
0.104
0.116
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