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PDF NLU1GT50 Data sheet ( Hoja de datos )
| Número de pieza | NLU1GT50 | |
| Descripción | Single Buffer | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NLU1GT50
Single Buffer,
Non-Inverting, TTL Level
TTL−Compatible Inputs
The NLU1GT50 MiniGatet is an advanced CMOS high−speed
non−inverting buffer in ultra−small footprint.
The device input is compatible with TTL−type input thresholds and
the output has a full 5.0 V CMOS level output swing.
The NLU1GT50 input and output structures provide protection
when voltages up to 7.0 V are applied, regardless of the supply
voltage.
Features
• Designed for 1.65 to 5.5 V VCC Operation
• High Speed: tPD = 3.5 ns (Typ) @ VCC = 5.0 V
• Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
• TTL−Compatible Input: VIL = 0.8 V; VIH = 2.0 V, VCC = 5.0 V
• CMOS−Compatible Output:
VOH > 0.8 VCC; VOL < 0.1 VCC @ Load
• Power Down Protection Provided on inputs
• Balanced Propagation Delays
• Ultra−Small Packages
• These are Pb−Free Devices
NC 1
6 VCC
IN A 2
5 NC
GND 3
4 OUT Y
Figure 1. Pinout (Top View)
IN A 1 OUT Y
Figure 2. Logic Symbol
FUNCTION TABLE
AY
LL
HH
PIN ASSIGNMENT
1 NC
2 IN A
3 GND
4 OUT Y
5 NC
6 VCC
www.onsemi.com
MARKING
DIAGRAMS
UDFN6
MU SUFFIX
LM
CASE 517AA
1
ULLGA6
1.0 x 1.0
LM
1 CASE 613AD
ULLGA6
1.45 x 1.0
LM
CASE 613AF
1
UDFN6
1.0 x 1.0
CASE 517BX
VM
1
UDFN6
1.45 x 1.0
CASE 517AQ
RM
1
L = Device Marking
M = Date Code
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 5
1
Publication Order Number:
NLU1GT50/D
1 page  
NLU1GT50
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
DA
B
PIN ONE
ÉÉÉÉÉÉREFERENCE
0.10 C
TOP VIEW
0.10 C
E
0.05 C
DETAIL B
A
LL
L1
DETAIL A
OPTIONAL
CONSTRUCTIONS
ÉÉÉÉEXPOSED Cu
MOLD CMPD
DETAIL B
OPTIONAL
CONSTRUCTIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A2 0.07 REF
b 0.20 0.30
D 1.45 BSC
E 1.00 BSC
e 0.50 BSC
L 0.30 0.40
L1 −−− 0.15
6X 0.05 C
A1
SIDE VIEW
A2
C
SEATING
PLANE
MOUNTING FOOTPRINT
PACKAGE
OUTLINE
6X
0.30
e
6X L
13
1.24
DETAIL A
64
BOTTOM VIEW
6X b
0.10 C A B
0.05 C NOTE 3
6X
0.53
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet NLU1GT50.PDF ] | |
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