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PDF NLU1GT14 Data sheet ( Hoja de datos )

Número de pieza NLU1GT14
Descripción Single Schmitt-Trigger Inverter
Fabricantes ON Semiconductor 
Logotipo ON Semiconductor Logotipo



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NLU1GT14
Single Schmitt-Trigger
Inverter, TTL Level
LSTTLCompatible Inputs
The NLU1GT14 MiniGatet is an advanced highspeed CMOS
Schmitttrigger inverter in ultrasmall footprint.
The device input is compatible with TTLtype input thresholds and
the output has a full 5 V CMOS level output swing.
The NLU1GT14 input and output structures provide protection
when voltages up to 7 V are applied, regardless of the supply voltage.
The NLU1GT14 can be used to enhance noise immunity or to
square up slowly changing waveforms.
Features
High Speed: tPD = 4.5 ns (Typ) @ VCC = 5.0 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
TTLCompatible Input: VIL = 0.8 V; VIH = 2.0 V
CMOSCompatible Output:
VOH > 0.8 VCC; VOL < 0.1 VCC @ Load
Power Down Protection Provided on inputs
Balanced Propagation Delays
Overvoltage Tolerant (OVT) Input and Output Pins
UltraSmall Packages
These are PbFree Devices
NC 1
6 VCC
www.onsemi.com
MARKING
DIAGRAMS
UDFN6
MU SUFFIX
MM
CASE 517AA
1
UDFN6
1.0 x 1.0
CASE 517BX
TM
1
UDFN6
1.45 x 1.0
CASE 517AQ
QM
1
M = Device Marking
M = Date Code
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
IN A 2
5 NC
GND 3
4 OUT Y
Figure 1. Pinout (Top View)
IN A 1 OUT Y
Figure 2. Logic Symbol
FUNCTION TABLE
AY
LH
HL
PIN ASSIGNMENT
1 NC
2 IN A
3 GND
4 OUT Y
5 NC
6 VCC
© Semiconductor Components Industries, LLC, 2016
June, 2016 Rev. 5
1
Publication Order Number:
NLU1GT14/D

1 page




NLU1GT14 pdf
NLU1GT14
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
DA
B
PIN ONE
ÉÉÉÉÉÉREFERENCE
0.10 C
TOP VIEW
0.10 C
E
0.05 C
DETAIL B
A
LL
L1
DETAIL A
OPTIONAL
CONSTRUCTIONS
ÉÉÉÉEXPOSED Cu
MOLD CMPD
DETAIL B
OPTIONAL
CONSTRUCTIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A2 0.07 REF
b 0.20 0.30
D 1.45 BSC
E 1.00 BSC
e 0.50 BSC
L 0.30 0.40
L1 −−− 0.15
6X 0.05 C
A1
SIDE VIEW
A2
C
SEATING
PLANE
MOUNTING FOOTPRINT
PACKAGE
OUTLINE
6X
0.30
e
6X L
13
1.24
DETAIL A
64
BOTTOM VIEW
6X b
0.10 C A B
0.05 C NOTE 3
6X
0.53
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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