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Número de pieza | NLU1G07 | |
Descripción | Single Non-Inverting Buffer | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de NLU1G07 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
No Preview Available ! NLU1G07
Single Non-Inverting Buffer
with Open Drain Output
The NLU1G07 MiniGatet is an advanced high−speed CMOS
non−inverting buffer with open drain output in ultra−small footprint.
The NLU1G07 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
Features
• High Speed: tPD = 3.8 ns (Typ) @ VCC = 5.0 V
• Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
• Power Down Protection Provided on inputs
• Balanced Propagation Delays
• Overvoltage Tolerant (OVT) Input and Output Pins
• Ultra−Small Packages
• These are Pb−Free Devices
NC 1
IN A 2
OVT
6 VCC
5 NC
www.onsemi.com
MARKING
DIAGRAMS
UDFN6
MU SUFFIX
JM
CASE 517AA
1
UDFN6
1.0 x 1.0
CASE 517BX
XM
1
UDFN6
1.45 x 1.0
CASE 517AQ
XM
1
J = Device Marking
M = Date Code
GND 3
4 OUT Y
Figure 1. Pinout (Top View)
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
IN A 1 OUT Y
Figure 2. Logic Symbol
PIN ASSIGNMENT
1 NC
2 IN A
3 GND
4 OUT Y
5 NC
6 VCC
FUNCTION TABLE
AY
LL
HZ
© Semiconductor Components Industries, LLC, 2016
August, 2016 − Rev. 4
1
Publication Order Number:
NLU1G07/D
1 page NLU1G07
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
DA
B
PIN ONE
ÉÉÉÉÉÉREFERENCE
0.10 C
TOP VIEW
0.10 C
E
0.05 C
DETAIL B
A
LL
L1
DETAIL A
OPTIONAL
CONSTRUCTIONS
ÉÉÉÉEXPOSED Cu
MOLD CMPD
DETAIL B
OPTIONAL
CONSTRUCTIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A2 0.07 REF
b 0.20 0.30
D 1.45 BSC
E 1.00 BSC
e 0.50 BSC
L 0.30 0.40
L1 −−− 0.15
6X 0.05 C
A1
SIDE VIEW
A2
C
SEATING
PLANE
MOUNTING FOOTPRINT
PACKAGE
OUTLINE
6X
0.30
e
6X L
13
1.24
DETAIL A
64
BOTTOM VIEW
6X b
0.10 C A B
0.05 C NOTE 3
6X
0.53
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5
5 Page |
Páginas | Total 7 Páginas | |
PDF Descargar | [ Datasheet NLU1G07.PDF ] |
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