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Número de pieza | BD6981FVM | |
Descripción | Standard Single-phase Full wave Fan Motor Driver | |
Fabricantes | ROHM Semiconductor | |
Logotipo | ||
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No Preview Available ! Datasheet
DC Brushless Motor Drivers for Fans
Standard Single-phase Full wave
Fan Motor Driver
BD6981FVM
Description
This is the summary of application for BD6981FVM. BD6981FVM can drive FAN motor silently by BTL soft switching.
Features
Small package (MSOP8)
BTL soft switching drive
Constant voltage output for hall element
Lock protection and auto restart
(without external capacitor)
Rotating speed pulse signal (FG) output
Applications
PC, PC peripheral component
(Power supply, VGA card, case FAN etc.)
BD player, Projector etc.
Package
MSOP8
W(Typ) x D(Typ) x H(Max)
2.90mm x 4.00mm x 0.90mm
MSOP8
Absolute Maximum Ratings
Parameter
Symbol
Rating
Supply Voltage
Power Dissipation
VCC
Pd
18
0.58(Note 1)
Operating Temperature
Topr
-40 to +105
Storage Temperature Tstg -55 to +150
Junction Temperature
Tjmax
150
Output Voltage
VOMAX
18
Output Current
IOMAX
800(Note 2)
Hall Input Voltage
VH
7
FG Signal Output Voltage
VFG
18
FG Signal Output Current
IFG
10
HB Output Current
IHB
10
(Note 1) Reduce by 4.68mW/°C over 25°C. (On 70.0mm×70.0mm×1.6mm glass epoxy board)
(Note 2) This value is not to exceed Pd.
Unit
V
W
°C
°C
°C
V
mA
V
V
mA
mA
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
○Product structure:Silicon monolithic integrated circuit
.www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product has no designed protection against radioactive rays
1/14
TSZ02201-0H1H0B100030-1-2
20.May 2015 Rev.003
1 page BD6981FVM
1.0
0.8
0.6
0.4
0.2
0.0
0
1.0
0.8
2.8V
12V
16V
0.6
0.4
0.2
246
FG Current, IFG [mA]
Figure 9. FG Output Voltage
(Voltage Characteristics)
0.0
80
105°C
25°C
-40°C
246
FG Current, IFG [mA]
Figure 10. FG Output Voltage
(Temperature Characteristics)
8
1.0
0.8
0.6 -40°C
25°C
105°C
0.4
0.2
0.0
0
Operating Range
3 6 9 12 15
Supply Voltage, VCC [V]
18
Figure 11. Lock Detection ON Time
6.0
5.0
4.0
-40°C
3.0 25°C
105°C
2.0
1.0
0.0
0
Operating Range
3 6 9 12 15
Supply Voltage, VCC [V]
18
Figure 12. Lock Detection OFF Time
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/14
TSZ02201-0H1H0B100030-1-2
20.May 2015 Rev.003
5 Page BD6981FVM
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/14
TSZ02201-0H1H0B100030-1-2
20.May 2015 Rev.003
11 Page |
Páginas | Total 18 Páginas | |
PDF Descargar | [ Datasheet BD6981FVM.PDF ] |
Número de pieza | Descripción | Fabricantes |
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