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PDF CS840A8H Data sheet ( Hoja de datos )

Número de pieza CS840A8H
Descripción Silicon N-Channel Power MOSFET
Fabricantes Huajing Microelectronics 
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No Preview Available ! CS840A8H Hoja de datos, Descripción, Manual

Silicon N-Channel Power MOSFET
CS840 A8H
R
General Description
CS840 A8H, the silicon N-channel Enhanced VDMOSFETs,
is obtained by the self-aligned planar Technology which reduce
the conduction loss, improve switching performance and
VDSS
ID
PD (TC=25)
RDS(ON)Typ
500
8
110
0.57
enhance the avalanche energy. The transistor can be used in
various power switching circuit for system miniaturization and
higher efficiency. The package form is TO-220AB, which accords
with the RoHS standard.
Features
l Fast Switching
l Low ON Resistance(Rdson0.75)
l Low Gate Charge (Typical Data:28nC)
l Low Reverse transfer capacitances(Typical:18pF)
l 100% Single Pulse avalanche energy Test
Applications
Power switch circuit of adaptor and charger.
AbsoluteTc= 25unless otherwise specified):
Symbol Parameter
Rating
VDSS
ID
IDMa1
VGS
EAS a2
EAR a1
IAR a1
dv/dt a3
PD
TJTstg
TL
Drain-to-Source Voltage
Continuous Drain Current
Continuous Drain Current TC = 100 °C
Pulsed Drain Current
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Energy ,Repetitive
Avalanche Current
Peak Diode Recovery dv/dt
Power Dissipation
Derating Factor above 25°C
Operating Junction and Storage Temperature Range
Maximum Temperature for Soldering
500
8
6.2
32
±30
620
60
3.5
5
110
0.88
15055 to 150
300
V
A
W
Units
V
A
A
A
V
mJ
mJ
A
V/ns
W
W/
WUXI CHI NA RESOURCES HUAJ I NG M I CROELECTRONI CS C O., LTD. Pag e 1 of 10 201 5V01

1 page




CS840A8H pdf
CS840 A8H
R
100
10
TRANSCONDUCTANCE MAY LIMIT
CURRENT IN THIS REGION
FOR TEMPERATURES
ABOVE 25DERATE PEAK
CURRENT AS FOLLOWS:
I = I 25
150 TC
125
VGS=10V
1
1.00E-05
16
12
8
1.00E-04
1.00E-03
1.00E-02
1.00E-01
t Pulse Width , Seconds
Figure 6 Maximun Peak Current Capability
3
2.5
VDS=25V
2
1.5
1.00E+00
1.00E+01
ID= 8A
PULSE DURATION = 10μs
DUTY FACTOR = 0.5%MAX
Tc =25
ID= 4A
ID= 2A
1
4
0.5
0
02468
Vgs,Gate to source Voltage,Volts
Figure 7 Typical Transfer Characteristics
1.2
0
10 4 6 8 10 12
Vgs , Gate to Source VoltageVolts
Figure 8 Typical Drain to Source ON Resistance vs Gate Voltage
and Drain Current
2.5
1
VGS=10V
0.8
2 VGS=10V
ID=4.0A
1.5
0.6 1
0.4 0.5
0.2
0
Figure
2468
Id , Drain Current(A)
9 Typical Drain to Source ON Resistance
vs Drain Current
10
0
-100
-50
Figure
0 50 100 150 200
Tj,Junction Temperature.C
10 Typical Drian to Source on Resistance
vs Junction Temperature
WUXI CHI NA RESOURCES HUAJ I NG M I CROELECTRONI CS C O., LTD. Pag e 5 of 10 201 5V01

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