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PDF BD9B500MUV Data sheet ( Hoja de datos )

Número de pieza BD9B500MUV
Descripción Single Synchronous Buck DC/DC Converter
Fabricantes ROHM Semiconductor 
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Datasheet
2.7V to 5.5V Input, 5.0A Integrated MOSFET
Single Synchronous Buck DC/DC Converter
BD9B500MUV
General Description
BD9B500MUV is a synchronous buck switching
regulator with built-in low on-resistance power MOSFETs.
This IC, which is capable of providing current up to 5A,
features fast transient response by employing constant
on-time control system. It offers high oscillating
frequency at low inductance. With its original constant
on-time control method which operates low consumption
at light load, this product is ideal for equipment and
devices that demand minimal standby power
consumption.
Features
Synchronous single DC/DC Converter
Constant on-time control suitable to Deep-SLLM
Over Current Protection
Short Circuit Protection
Thermal Shutdown Protection
Under Voltage Lockout Protection
Adjustable Soft Start
Power Good Output
VQFN016V3030 Package
(backside heat dissipation)
Key Specifications
Input Voltage Range:
2.7V to 5.5V
Output Voltage Range: 0.8 V to VPVIN x 0.8 V
Maximum Operating Current:
5A (Max)
Switching Frequency:
2MHz/1MHz (Typ)
High-Side MOSFET ON Resistance: 30mΩ (Typ)
Low-Side MOSFET ON Resistance: 30mΩ (Typ)
Standby Current:
0μA (Typ)
Package(s)
VQFN016V3030
W (Typ) x D (Typ) x H (Max)
3.00 mm x 3.00 mm x 1.00 mm
Applications
Step-down Power Supply for DSPs, FPGAs,
Microprocessors, etc.
Laptop PCs/Tablet PCs/Servers
LCD TVs
Storage Devices (HDDs/SSDs)
Printers, OA Equipment
Entertainment Devices
Distributed Power Supply, Secondary Power Supply
VQFN016V3030
Typical Application Circuit
VIN
22µF
Enable
0.1µF
BD9B500MUV
PVIN
PGD
AVIN
EN
BOOT
AGND
SW
0.1µF
1.0µH
PGD
VOUT
PGND
SS
R1
CFB 22µF×2
MODE
CSS
FREQ
FB
R2
Figure 1. Application Circuit
Product structure : Silicon monolithic integrated circuit
.www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 14 001
This product has no designed protection against radioactive rays
1/30
TSZ02201-0J3J0AJ01280-1-2
25.May.2016 Rev.001

1 page




BD9B500MUV pdf
BD9B500MUV
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
Supply Voltage
VPVIN, VAVIN
-0.3 to +7
V
EN Terminal Voltage
VEN
-0.3 to +7
V
MODE Terminal Voltage
VMODE
-0.3 to +7
V
FREQ Terminal Voltage
VFREQ
-0.3 to +7
V
PGD Terminal Voltage
VPGD
-0.3 to +7
V
Voltage from GND to BOOT
Voltage from SW to BOOT
VBOOT
VBOOT
-0.3 to +14
-0.3 to +7
V
V
FB Terminal Voltage
VFB
-0.3 to +7
V
SW Terminal Voltage
VSW
-0.3 to VPVIN + 0.3
V
Output Current
IOUT
5.5 A
Operating Temperature Range
Topr
-40 to 85
C
Storage Temperature Range
Tstg
-55 to 150
C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 3)
2s2p(Note 4)
Unit
VQFN016V3030
Junction to Ambient
θJA 189.0
57.5 °C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT 23
10 °C/W
(Note 1)Based on JESD51-2A(Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Footprints and Traces
Thickness
70μm
(Note 4)Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
4 Layers
FR-4
Board Size
114.3mm x 76.2mm x 1.6mmt
Top 2 Internal Layers
Copper Pattern
Footprints and Traces
Thickness
70μm
Copper Pattern
74.2mm x 74.2mm
Thickness
35μm
(Note 5) This thermal via connects with the copper pattern of all layers..
Thermal Via(NOTE 5)
Pitch
Diameter
1.20mm
Φ0.30mm
Bottom
Copper Pattern
74.2mm x 74.2mm
Thickness
70μm
Recommended Operating Conditions (Ta= -40°C to +85°C)
Parameter
Symbol
Min
Supply Voltage
Output Current
Output Voltage Range
VPVIN, VAVIN
IOUT
VRANGE
2.7
-
0.8
Typ
-
-
-
Max
5.5
5.0
VPVIN × 0.8
Unit
V
A
V
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
5/30
TSZ02201-0J3J0AJ01280-1-2
25.May.2016 Rev.001

5 Page





BD9B500MUV arduino
BD9B500MUV
Typical Performance Curves - continued
85
RISING
80
75
70
FALLING
65
60
-40
-20
0 20 40 60
Temperature [°C]
80
Figure 20. PGD Threshold vs Temperature
120
110
100
VIN=3.3V
90
80
VIN=5V
70
60
-40 -20
0 20 40 60
Temperature [°C]
80
Figure 21. PGD ON-Resistance vs Temperature
2.0
1.5
VIN=3.3V
1.0 VIN=5V
0.5
0.0
-40
-20
0 20 40 60
Temperature [°C]
80
Figure 22. Soft Start Time vs Temperature
3.0
2.5
2.0
1.5
VIN=5V
1.0
VIN=3.3V
0.5
0.0
-40
-20
0 20 40 60
Temperature [°C]
80
Figure 23. SS Terminal Current vs Temperature
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
11/30
TSZ02201-0J3J0AJ01280-1-2
25.May.2016 Rev.001

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