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PDF BD42500G-C Data sheet ( Hoja de datos )

Número de pieza BD42500G-C
Descripción 50 mA Output Voltage Tracker
Fabricantes ROHM Semiconductor 
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Datasheet
Voltage Tracker
50 mA Output Voltage Tracker
BD42500G-C
General Description
The BD42500G-C is low quiescent regulators featuring
45 V absolute maximum voltage, and output voltage
tracking accuracy of ±15 mV, 50 mA output current and
40 µA (Typ) current consumption.
This tracker is therefore ideal for applications requiring a
direct connection to the battery and a low current
consumption.
Ceramic capacitors can be used for compensation of the
output capacitor phase. Furthermore, this IC also feature
overcurrent protection to protect the device from damage
caused by short-circuiting and an integrated thermal
shutdown to protect the device from overheating at
overload conditions.
Features
AEC-Q100 Qualified (Note 1)
Qualified for Automotive Applications
Wide Temperature Range (Tj): -40 °C to +150 °C
Wide Operating Input Range:
3 V to 42 V
Low Quiescent Current:
40 µA (Typ)
Output Voltage Tracking Accuracy:
±15 mV
Over Current Protection (OCP)
Thermal Shutdown Protection (TSD)
(Note 1: Grade 1)
Package
G: SSOP5
W (Typ) x D (Typ) x H (Max)
2.90 mm x 2.80 mm x 1.25 mm
Applications
Automotive
(Engine-ECU, Body, Air-Conditioner etc.)
Typical Application Circuits
Components externally connected: 1 µF ≤ CIN, 1 µF ≤ CO (Min)
Electrolytic, tantalum and ceramic capacitors can be used.
5.GND
4.VO
BD42500G-C
1.ADJ / EN 2.GND
3.VCC
CO
CIN
Product structure : Silicon monolithic integrated circuit
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 14 001
This product has no designed protection against radioactive rays
1/22
TSZ02201-0G7G0AN00580-1-2
2.Jun.2016 Rev.001

1 page




BD42500G-C pdf
BD42500G-C
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 3)
2s2p(Note 4)
Unit
SSOP5
Junction to Ambient
θJA 376.5
185.4
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT 40
30 °C/W
(Note 1)Based on JESD51-2A(Still-Air)
(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Footprints and Traces
Thickness
70μm
(Note 4)Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
4 Layers
FR-4
Top
Copper Pattern
Footprints and Traces
Thickness
70μm
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Copper Pattern
74.2mm x 74.2mm
Thickness
35μm
Bottom
Copper Pattern
74.2mm x 74.2mm
Thickness
70μm
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
5/22
TSZ02201-0G7G0AN00580-1-2
2.Jun.2016 Rev.001

5 Page





BD42500G-C arduino
BD42500G-C
Measurement Circuit
5.GND
4.VO
BD42500G-C
1.ADJ / EN 2.GND
3.VCC
1µF
V
A
1µF
Measurement Setup for
Figure 1, 3, 10
5.GND
4.VO
BD42500G-C
1µF Io
V
1.ADJ / EN 2.GND
3.VCC
1µF
Measurement Setup for
Figure 2, 9
5.GND
4.VO
BD42500G-C
1.ADJ / EN 2.GND
3.VCC
1µF Io
1µF
A
Measurement Setup for
Figure 4
5.GND
4.VO
BD42500G-C
1µF
1.ADJ / EN 2.GND
3.VCC
V
1µF
Measurement Setup for
Figure 5, 6, 12
5.GND
4.4V.OVO
BD42500G-C
1.ADJ / EN 2.GND
3.3V.CVCC
V
A
1µF
Io
1µF
Measurement Setup for
Figure 7
5.GND
4.VO
BD42500G-C
1µF
1.ADJ / EN 2.GND
3.VCC
IO M
1Vrms
1µF
Measurement Setup for
Figure 8
5.GND
4.VO
BD42500G-C
1.ADJ / EN 2.GND
3.VCC
1µF
A
V
IO
5.GND
4.VO
BD42500G-C
1.ADJ / EN 2.GND
3.VCC
1µF
1µF
Measurement Setup for
Figure 11
A
1µF
Measurement Setup for
Figure 13, 14
5.GND
4.VO
BD42500G-C
1µF
1.ADJ / EN 2.GND
3.VCC
V
A
1µF
Measurement Setup for
Figure 15, 16
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111 15 001
11/22
TSZ02201-0G7G0AN00580-1-2
2.Jun.2016 Rev.001

11 Page







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