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PDF BD2606MVV Datasheet ( Hoja de datos )

Número de pieza BD2606MVV
Descripción 6-Channel Charge Pump White LED Driver
Fabricantes ROHM 
Logotipo ROHM Logotipo
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BD2606MVV datasheet

1 Page

BD2606MVV pdf
BD2606MVV
Typical Performance Curves - continued
100
90 Ta=-30°C
80
70 Ta=25°C
60
50 Ta=85°C
40
30
20
10
0
2.5 3 3.5 4 4.5 5 5.5 6 6.5 7
InpIuntpuVtovlotaltgaeg:eV: VINin[V[V] ]
Figure 5. Efficiency vs Input Voltage
(10mA x 6 Lights)
100
90 Ta=-30°C
80 Ta=25°C
70
60
50 Ta=85°C
40
30
20
10
0
2.5 3 3.5 4 4.5 5 5.5 6 6.5 7
InIpnpuut tVvoollttaagee:: VIiNn[[VV]]
Figure 6. Efficiency vs Input Voltage
(20mA x 6 Lights)
20.0
Ta=25°C
17.5
15.0
12.5
Ta=85°C
10.0
Ta=-30°C
7.5
5.0
2.5
0.0
0.0 0.4 0.8 1.2 1.6
LED Control VolVtaLEgDe[V: ]VLED [V]
2.0
Figure 7. LED Current Characteristics vs
LED Control Voltage
(LED Current 16.5mA)
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
-1.5
-2.0
0
Ta=25°C
Ta=-30°C
Ta=85°C
10 20 30 40 50
STATE[DEC]
60
Figure 8. LED Current Characteristics
(Differential Linearity Error)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
5/16
TSZ02201-0G3G0C200400-1-2
10.Dec.2015 Rev.002

5 Page

BD2606MVV arduino
BD2606MVV
2. Recommended PCB Layout
In PCB design, wire the power supply line in a way that the PCB impedance goes low and provide a bypass capacitor if
needed. Heat radiation of back side PAD is used for improving the efficiency of IC heat radiation. Solder PAD to GND pin.
Moreover, connect ground plane of board using via as shown in the patterns of below page.
The efficiency of heat radiation improves according to the area of ground plane.
SDA
SCL
EN
GND
To substrate
GND
C1
To substrate
VCC
Figure 15. Application Layout Image (Top View)
SDA
SCL
EN
OUT
C1
Rear-side GND
VCC
Figure 16. Front (Top View)
3. Application Parts Selection Method
Capacitor (Use a ceramic capacitor with good frequency and temperature characteristics)
Symbol
Recommended Value
Recommended Parts
COUT,CIN,C1,C2
1μF GRM188B11A105KA61B(MURATA)
Type
Ceramic capacitor
Connect an input bypass capacitor CIN between IN and GND pin and an output capacitor between OUT and GND pin in
proximity. Place both C1P-C1N and C2P-C2N capacitors in proximity to the chip. Furthermore, select a ceramic
capacitor with a sufficient rating for the voltage to be applied.
When other than these parts are used, the equivalent parts must be used.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ2211115001
11/16
TSZ02201-0G3G0C200400-1-2
10.Dec.2015 Rev.002

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