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PDF BM81810MUV-M Data sheet ( Hoja de datos )
| Número de pieza | BM81810MUV-M | |
| Descripción | Automotive Panel Power Management IC | |
| Fabricantes | ROHM Semiconductor | |
| Logotipo |  |
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Datasheet
Power Supply IC Series for TFT-LCD Panels
Automotive Panel Power Management IC
BM81810MUV-M
●General Description
BM81810MUV-M is a power management IC for
TFT-LCD panels which are used in car navigation,
in-vehicle center panel, and instrument cluster.
This IC incorporates VCOM amplifier, Gate Pulse
Modulation (GPM) in addition to the power supply for
panel driver (SOURCE, GATE, and LOGIC power
supplies). Moreover, this IC has a built-in EEPROM for
sequence and output voltage setting retention.
●Key Specifications
Input voltage range:
2.6V to 5.5V
AVDD Output voltage range:
5.0V to 17.0V
VGH Output voltage range:
8.0V to 35.0V
VGL Output voltage range:
-4.0V to -14.0V
VDD Output voltage range:
0.9V to 3.4V
VCOM Output current:
200 mA (Typ.)
Switching Frequency: 525KHz, 1.05MHz, 2.1MHz
Operating temperature range:
-40℃ to +105℃
Standby current:
2.0 uA (Typ.)
●Special Characteristics
AVDD output voltage accuracy:
Oscillator Frequency:
±2%
±10%
●Applications
TFT-LCD Panels which are used in car navigation,
in-vehicle center panel, and instrument cluster.
●Features
AEC-Q100 Qualified(Note 1)
Alternative Synchronous Buck DC/DC converter or LDO
for VDD output
Synchronous Boost DC/DC converter for AVDD output
with integrated load switch.
VCOM amplifier with 7bit calibrator
Positive charge pump (Integrated diode, x2/x3) for VGH
output
Negative charge pump for VGL output
VGH and VCOM temperature compensation
Gate Pulse Modulation(GPM)
I2C Interface Output Voltage Setting Control Function
(Integrated EEPROM)
Switching frequency switching function
(525KHz, 1.05MHz, 2.1MHz)
Protection circuits
Under-Voltage Lockout
Thermal Shut Down
Over-Current Protection
Over-Voltage Protection
Under Voltage Protection (Timer Latch type)
Input tolerant (SCL, SDA, EN, WPN)
(Note1: Grade 2)
●Package
QFN 32pin
W(Typ.) x D(Typ.) x H(Max.)
5.0mm x 5.0mm x 1.0mm
●Typical Application Circuit (TOP VIEW)
WPN
R_NTC3
R_NTC2
R_NTC1
R_FLT
VIN
VIN
R_PG
Θ
FAULT
PG / LDSW
R_RE
CPP2
C_DRP2
VIN
R_RST
VDD
C_VDD
L_SWB
GSIN
SDA
SCL
RST
SWB
EN
C_VCP
VCP
CPP1
DRP
DRN
C_DRP1
C_DRN
12345678
AVDD
C_VCOM
C_VINB
C_REG
VIN
C_VIN
(D_SW)
C_AVD
GSOUT
C_VGH
VGH
D_VGL
VGL
VCOM
C_VGL
AVDD
C_LSO
Figure 1. Application Circuit
○Product structure：Silicon monolithic integrated circuit
.www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product has no designed protection against radioactive rays
1/75
TSZ02201-0313AAF00730-1-2
25.July.2016 Rev.001
1 page  
BM81810MUV-M
●Thermal Resistance (Note 2)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 4)
2s2p(Note 5)
UNIT
VQFN32SV5050
Junction to Ambient
θJA
138.9
39.1 ℃/W
Junction to Top Characterization Parameter(Note 3)
ΨJT
11
5 ℃/W
(Note 2)Based on JESD51-2A(Still-Air).
(Note 3)The thermal characterization parameter to report the difference between junction temperature and the
temperature at the top center of the outside surface of the component package.
(Note 4)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces 70µm
(Note 5)Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.3mm x 76.2mm x 1.6mmt
Thermal Via(Note 6)
Pitch
Diameter
1.20mm
Φ0.30mm
Top
Copper Pattern
Thickness
2 Internal Layers
Copper Pattern Thickness
Bottom
Copper Pattern Thickness
Footprints and Traces 70µm 74.2mm x 74.2mm 35µm 74.2mm x 74.2mm
(Note 6) This thermal via connects with the copper pattern of all layers.
70µm
●Recommended Operating Ratings(TA=-40℃ to +105℃)
PARAMETER
Power Supply Voltage
SWB Current
SW Current
Functional Pin Voltage
2 Line Serial Pin Voltage
2 Line Serial Frequency
Operating Ambient Temperature
Operating Junction Temperature
SYMBOL
VIN,VINB
ISWB
ISW
EN,GSIN,WPN
SDA, SCL
FCLK
TA
TJ
MIN
TYP
MAX
Unit
2.6 － 5.5 V
－ － 1.0 A
－ － 2.0 A
-0.1 －
5.5 V
-0.1 －
5.5 V
－ － 400 kHz
-40 － 105 ℃
-40 － 125 ℃
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/75
TSZ02201-0313AAF00730-1-2
25.July.2016 Rev.001
5 Page 
BM81810MUV-M
●Typical Performance Curves②
(Unless otherwise specified VIN=3.3V, VDD=2.5V, AVDD=10.5V, VGH=18V, VGL=-6.0V, VCOM=5.25V and Ta=25℃)
3.0
2.5
2.0
Ta=105℃
1.5
Ta=25℃
1.0
0.5 Ta=-40℃
0.0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
EN [V]
Figure 7. H/L threshold voltage
(control signals)
EN(4V/div.)
VGH(4V/div.)
PAVDD(4V/div.)
AVDD(4V/div.)
VCOM(4V/div.)
VDD(4V/div.)
GSOUT(4V/div.)
VGL(4V/div.)
10msec/div.
Figure 8. Power on waveform
(when operated by EN control, Function select = PG)
EN(4V/div.)
VGH(4V/div.)
PAVDD(4V/div.)
AVDD(4V/div.)
VCOM(4V/div.)
VDD(4V/div.)
GSOUT(4V/div.)
VGL(4V/div.)
10msec/div.
Figure 9. Power off waveform
(when operated by EN control, Function select = PG)
VIN, EN
(4V/div.)
VGH(4V/div.)
PAVDD(4V/div.)
AVDD(4V/div.)
VCOM(4V/div.)
VDD(4V/div.)
GSOUT(4V/div.)
VGL(4V/div.)
10msec/div.
Figure 10. Power on waveform
(when operated with EN=VCC, Function select = PG)
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/75
TSZ02201-0313AAF00730-1-2
25.July.2016 Rev.001
11 Page | ||
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