|
|
PDF RN41 Data sheet ( Hoja de datos )
| Número de pieza | RN41 | |
| Descripción | Class 1 Bluetooth Module | |
| Fabricantes | Microchip | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de RN41 (archivo pdf) en la parte inferior de esta página. Total 28 Páginas | ||
|
No Preview Available !
RN41/RN41N
Class 1 Bluetooth® Module with EDR Support
Features
• Fully qualified Bluetooth® version 2.1 module,
supports version 2.1 + Enhanced Data Rate
(EDR)
• ASCII command interface over UART
• Postage-stamp sized form factor:
- RN41: 13.4 x 25.8 x 2 mm
- RN41N: 13.4 x 20 x 2 mm
• Low-power (30 mA connected, < 10 mA sniff
mode)
• UART (SPP or HCI) and USB (HCI only) data
connection interfaces
• Sustained SPP data rates: 240 Kbps (Slave
mode), 300 Kbps (Master mode)
• HCI data rates: 1.5 Mbps sustained, 3.0 Mbps
burst in HCI mode
• Embedded Bluetooth stack profiles include: GAP,
SDP, RFCOMM, L2CAP protocols, with SPP, HID,
and DUN profile support (does not require any
host stack).
• Bluetooth SIG qualified, end product listing
• Castellated SMT pads for easy and reliable PCB
mounting
• Class 1 high-power amplifier with on-board
ceramic chip antenna (RN41) or external antenna
(RN41N)
• Compliance:
- Modular Certified for the United States (FCC)
and Canada (IC)
- European R&TTE Directive Assessed Radio
Module
- Australia/New Zealand/Korea/Taiwan/Japan
- Bluetooth SIG QDID
• Integrated Crystal, Internal Voltage Regulator,
Matching Circuitry, Power Amplifier, Low Noise,
Memory Amplifier and PCB Antenna
• Easy Integration into Final Product - Minimize
Product Development, Quicker Time to Market
• Compatible with Microchip Microcontroller Fami-
lies (PIC16F, PIC18F, PIC24F/H, dsPIC33 and
PIC32)
• Up to 100 meter range
Applications
• Cable replacement
• Barcode scanners
• Measurement and monitoring systems
• Industrial sensors and controls
• Medical devices
2014 Microchip Technology Inc.
DS50002280A-page 1
1 page  
RN41/RN41N
TABLE 1-3: MODULE DIMENSIONS
Parameter
RN41
Size
Weight
13.4 x 25.8 x 2
0.045
RN41N
13.4 x 20 x 2
0.040
Units
mm
oz.
TABLE 1-4: RADIO CHARACTERISTICS
Parameter
Frequency
(GHz)
Min.
Typ.
Max.
Bluetooth
Specification
Units
Sensitivity at 0.1% BER
RF Transmit Power(1)
RN41
RF Transmit Power(1)
RN41N
Initial Carrier Frequency Tolerance
20-dB Bandwidth for Modulated Carrier
Drift (Five Slots Packet)
Drift Rate
∆f1avg Maximum Modulation
∆f2avg Minimum Modulation
2.402
2.441
2.480
2.402
2.441
2.480
2.402
2.441
2.480
2.402
2.441
2.480
—
—
—
2.402
2.441
2.480
2.402
2.441
2.480
— -80 -86
— -80 -86
— -80 -86
— 16.3 —
— 17.0 —
— 18.4 —
— 11.9 —
— 10.9 —
— 9.9 —
— 5 75
— 5 75
— 5 75
— 900 1000
— 15 —
— 13 —
140 165 175
140 165 175
140 165 175
140 190
—
140 190
—
140 190
—
≤ -70
75
≤ 1000
40
20
> 140
115
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
kHz
TABLE 1-5: DIGITAL I/O CHARACTERISTICS
3.0 V ≤ VDD ≤ 3.3 V
Input Logic Level Low
Input Logic Level High
Output Logic Level Low
Output Logic Level High
All I/O pins (Except reset) Default to Weak Pull Down
Min.
Typ.
Max.
Units
-0.4 — +0.8
0.7 VDD
— VDD + 0.4
— — 0.2
VDD - 0.2
—
—
+0.2 +1.0 +5.0
V
V
V
V
A
2014 Microchip Technology Inc.
DS50002280A-page 5
5 Page 
Microchip offers HCI mode in two hardware interfaces:
• HCI over UART (RN41HCI-I/RM)
• HCI over USB (RN41U-I/RM)
2.6.1 HCI OVER UART
In this mode, the hardware interface between the host
processor and the Bluetooth module is the UART con-
figured at 115.2 Kbps. You must interface the flow con-
trol signals between the host processor and the
Bluetooth module for the HCI interface to work. Failure
to do so can cause the host processor and the Blue-
tooth module to become out of sync and break the
Bluetooth link.
2.6.2 HCI OVER USB
In this mode, the hardware interface between the host
processor and the Bluetooth module is the USB. In this
architecture, the Bluetooth module is the USB slave
and the host processor is the USB host.
Using the USB interface offers the advantage of a
faster data link between the Bluetooth module and the
host processor. With this architecture, it is possible to
achieve Bluetooth’s theoretical maximum throughput of
3 Mpbs.
2.7 Soldering Recommendations
The RN41/RN41N wireless module was assembled
using standard lead-free reflow profile IPC/JEDEC J-
STD-020.
The module can be soldered to the host PCB using
standard leaded and lead-free solder reflow profiles.
To avoid damaging the module, the following recom-
mendations are given:
• Microchip Technology Application Note,” AN233
Solder Reflow Recommendation” (DS00233) pro-
vides solder reflow recommendations
• Do not exceed peak temperature (Tp) of 250 C°
• Refer to the solder paste data sheet for specific
reflow profile recommendations
• Use no-clean flux solder paste
• Do not wash as moisture can be trapped under
the shield
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
2.8 SPI Interface
The SPI Interface is primarily used for factory test and
diagnostics. Although not required, the SPI interface is
useful for restoring a corrupted flash image or enabling
test modes required for certification testing.
When module is installed in a final product that requires
European type approval, see Section 3.3 “Europe”, it
is recommended that the SPI interface should be
accessible via 6-pin header as shown in Figure 2-6.
2014 Microchip Technology Inc.
RN41/RN41N
FIGURE 2-6:
OPTIONAL SPI
INTERFACE
2.9 Bluetooth SIG QDID
The RN41 has a QDID registered with the Bluetooth
SIG. The manufacturer using the RN41 module in their
end product can reference this QDID when filing an
EPL (end product listing) to use Bluetooth® brand and
logo. Please visit the Bluetooth SIG at
www.bluetooth.org for more information.
Declaration ID: B013180
QDID: 7786
DS50002280A-page 11
11 Page | ||
| Páginas | Total 28 Páginas | |
| PDF Descargar | [ Datasheet RN41.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| RN4020 | Bluetooth Low Energy Module | Microchip |
| RN41 | Class 1 Bluetooth Module | Microchip |
| RN41N | Class 1 Bluetooth Module | Microchip |
| RN42 | Class 2 Bluetooth Module | Microchip |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |