|
|
PDF KAI-16000 Data sheet ( Hoja de datos )
| Número de pieza | KAI-16000 | |
| Descripción | Interline CCD Image Sensor | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de KAI-16000 (archivo pdf) en la parte inferior de esta página. Total 28 Páginas | ||
|
No Preview Available !
KAI-16000
4872 (H) x 3248 (V)
Interline CCD Image Sensor
Description
The KAI−16000 is an interline transfer CCD offering 16 million
pixels at up to 3 frames per second through 2 outputs. This image
sensor is organized into an array of 4,872 (H) x 3,248 (V) with
7.4 micron square pixels and full 35 mm optical format. As an
interline transfer CCD, the KAI−16000 includes additional features
such as progressive scan readout, electronic shutter, low noise, high
dynamic range, and blooming suppression. These features make the
KAI−16000 the perfect sensor for applications in Industrial, Aerial,
Security, and Scientific markets.
Table 1. GENERAL SPECIFICATIONS
Parameter
Typical Value
Architecture
Interline CCD; Progressive Scan
Total Number of Pixels
Number of Effective Pixels
Number of Active Pixels
4960 (H) x 3324 (V) = 16.6M
4904 (H) x 3280 (V) = 16.1M
4872 (H) x 3248 (V) = 15.8M
Pixel Size
Active Image Size
7.4 mm (H) x 7.4 mm (V)
36.1 mm (H) x 24.0 mm (V)
43.3 mm (diagonal),
35 mm Optical Format
Aspect Ratio
Number of Outputs
3:2
1 or 2
Saturation Signal
Output Sensitivity
Quantum Efficiency
KAI−16000−AXA
KAI−16000−CXA (RGB)
KAI−16000−FXA (RGB)
30,000 electrons
30 mV/e−
47%
29%, 38%, 44%
31%, 39%, 45%
Read Noise (f = 30 MHz)
Dark Current
16 electrons
< 0.5 nA/cm2
Dark Current Doubling Temperature
Dynamic Range
Charge Transfer Efficiency
7°C
65 dB
0.99999
Blooming Suppression
Smear
Image Lag
> 100 X
< −80 dB
< 10 electrons
Maximum Data Rate
30 MHz per channel
Package
Cover Glass
40 pin Grid Array
AR coated, 2 sides
or Clear Glass
NOTE: All parameters are specified at T = 40°C unless otherwise noted.
www.onsemi.com
Figure 1. KAI−16000 CCD Image Sensor
Features
• 16 Million Pixel Resolution
• Electronic Shutter
• 35 mm Optical Format
• Progressive Scan Readout
• High Sensitivity
• Fast Frame Rate
• > 60 dB Dynamic Range
Applications
• Industrial
• Aerial Photography
• Security
• Scientific
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2016
February, 2016 − Rev. 6
1
Publication Order Number:
KAI−16000/D
1 page  
PHYSICAL DESCRIPTION
Pin Description and Device Orientation
KAI−16000
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
Pixel 1,1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Figure 3. Package Pin Designations − Top View
Table 3. PINOUT
Pin Name
Description
1 VOUTL Video Output, Left
2
VDDL
VDD, Left
3
GND
Ground
4 RESETL Reset Gate, Left
5 HLASTL Horizontal Clock, Last Stage, Left
6
H2BL
Horizontal Clock, Phase 2, Barrier, Left
7
H1BL
Horizontal Clock, Phase 1, Barrier, Left
8
H1SL
Horizontal Clock, Phase 1, Storage, Left
9
H2SL
Horizontal Clock, Phase 2, Storage, Left
10 ESD ESD Protection Disable
11 GND Ground
12 H2SR Horizontal Clock, Phase 2, Storage, Right
13 H1SR Horizontal Clock, Phase 1, Storage, Right
14 H1BR Horizontal Clock, Phase 1, Barrier, Right
15 H2BR Horizontal Clock, Phase 2, Barrier, Right
16 HLASTR Horizontal Clock, Last Stage, Right
17 RESETR Reset Gate, Right
18 GND Ground
19 VDDR VDD, Right
20 VOUTR Video Output, Right
Pin Name
Description
40 FDGL Fast Line Dump Gate, Left
39 RDL Reset Drain, Left
38 SUB Substrate
37 GND Ground
36 V1 VCCD Gate 1, Phase 2
35 V5 VCCD Gate 5, Phase 2
34 V9 VCCD Gate 9, Phase 2
33 V3 VCCD Gate 3, Phase 2
32 V7 VCCD Gate 7, Phase 2
31 V11 VCCD Gate 11, Phase 2
30 V2 VCCD Gate 2, Phase 1
29 V6 VCCD Gate 6, Phase 1
28 V10 VCCD Gate 10, Phase 1
27 V4 VCCD Gate 4, Phase 1
26 V8 VCCD Gate 8, Phase 1
25 V12 VCCD Gate 12, Phase 1
24 GND Ground
23 SUB Substrate
22 RDR Reset Drain, Right
21 FDGR Fast Line Dump Gate, Right
www.onsemi.com
5
5 Page 
KAI−16000
DEFECT DEFINITIONS
Operational Conditions
All defect tests performed at tint = tframe = 908 msec
Table 10. SPECIFICATIONS
Description
Major dark field defective
bright pixel
Definition
Defect ≥ 245 mV
Class X Monochrome
with Microlens Only
150
Class 1
150
Class 2
Monochrome
300
Class 2
Color
300
Notes
2
Major bright field defective Defect ≥ 15%
dark pixel
Minor dark field defective
bright pixel
Defect ≥ 126 mV
1500
1500
3000
3000
3
Cluster defect
A group of 2 to “N”
contiguous major
defective pixels, but no
more than “W”
adjacent defects
horizontally.
0
30
N = 20
W=4
30
N = 20
W=4
30
N = 20
W=4
1, 2
Column defect
A group of more than
10 contiguous major
defective pixels along
a single column
0
0 4 15 1, 2
1. Column and cluster defects are separated by no less than two (2) pixels in any direction (excluding single pixel defects).
2. Tested at 27°C and 40°C.
3. Tested at 40°C.
NOTE: Class X sensors are offered strictly “as available”. ON Semiconductor cannot guarantee delivery dates. Please call for availability.
Defect Map
The defect map supplied with each sensor is based upon
testing at an ambient (27°C) temperature. Minor point
defects are not included in the defect map. All defective
pixels are reference to pixel 1, 1 in the defect maps.
www.onsemi.com
11
11 Page | ||
| Páginas | Total 28 Páginas | |
| PDF Descargar | [ Datasheet KAI-16000.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| KAI-16000 | Interline CCD Image Sensor | ON Semiconductor |
| KAI-16000 | Image Sensor |  Truesense |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |