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PDF XHF-153-D Data sheet ( Hoja de datos )

Número de pieza XHF-153-D
Descripción REFLECTIONLESS FILTER DICE
Fabricantes Mini-Circuits 
Logotipo Mini-Circuits Logotipo



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No Preview Available ! XHF-153-D Hoja de datos, Descripción, Manual

MMIC, HIGH PASS
REFLECTIONLESS FILTER DICE
50DC to 40 GHz
The Big Deal
• Patented design eliminates in band spurs
• Pass band cut-off up to 18.3 GHz
• Usable to 40 GHz
• Excellent repeatability through IPD* process
• Unpackaged Die Form
XHF-Series
Product Overview
Mini-Circuits’ XHF-Series reflectionless filters employ a novel filter topology which absorbs and terminates
stop band signals internally rather than reflecting them back to the source. This new capability enables
unique applications for filter circuits beyond those suited to traditional approaches. Traditional filters are
reflective in the stop band, sending signals back to the source at 100% of the power level which interact
with neighboring components and often result in intermodulation and other interferences. Reflectionless
filters eliminate stop band reflections, allowing them to be paired with sensitive devices and used in ap-
plications that otherwise require circuits such as isolators, isolation amplifiers or attenuators.
Key Features
Advantages
Easy integration with sensitive reflective
components, e.g. mixers, multipliers
Enables stable integration of wideband
amplifiers
Cascadable
Excellent power handling in a tiny surface
mount device
Reflectionless filters absorb unwanted signals, preventing reflections back to the
source. This reduces generation of additional unwanted signals without the need
for extra components like attenuators, improving system dynamic range and sav-
ing board space.
Because reflectionless filters maintain good impedance in the stop band; they
can be integrated with high gain, wideband amplifiers without the risk of creating
instabilities in these out of band regions.
Reflectionless filters can be cascaded in multiple sections to provide sharper and
higher attenuation, while also preventing any standing waves that could affect
pass band signals.
High power handling extends the usability of these filters to the transmit path for
inter-stage filtering.
Excellent repeatability of RF performance
Through semiconductor IPD process, X-series filters are inherently repeatable for
large volume production.
Excellent stability over temperature
With ±0.3 dB variation over temperature ideal for use in wide temperature range
applications without the need for additional temperature compensation.
Unpackaged Die form
Enables direct integration into customer hybrids
*IPD – Integrated Passive Device, is a GaAs semiconductor process
Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected]
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XHF-153-D pdf
MMIC Reflectionless High Pass Filter Die
XHF-153-D+
Assembly and Handling Procedure
1. Storage
Dice should be stored in a dry nitrogen purged desiccators or equivalent.
2. ESD
MMIC Gallium Arsenide (GaAs) filter dice are susceptible to electrostatic and mechanical damage. Die are supplied in
antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static worksta
tion. Devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter
ESD damage to dice.
3. Die Attach
The die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat
DM6030Hk-PT/H579/H579 or Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy
fillet height and epoxy coverage around total die periphery. Parts shall be cured in a nitrogen filled atmosphere per manufac
turer’s cure condition. It is recommended to use antistatic die pick up tools only.
4. Wire Bonding
Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond
pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are
all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the die to
the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due
to undesirable series inductance.
Assembly Diagram
Recommended Wire Length, Typical
Wire
Wire Length (mm)
Wire Loop Height (mm)
All wires
1.0 0.15
RF Reference Plane
Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected]
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