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PDF IFX54441LDV50 Data sheet ( Hoja de datos )

Número de pieza IFX54441LDV50
Descripción Wide Input Range Low Noise 300mA 5V LDO
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IFX54441 V50
Wide Input Range Low Noise 300mA 5V LDO
IFX54441EJV50
IFX54441LDV50
Data Sheet
Rev. 1.1, 2014-10-30
Standard Power

1 page




IFX54441LDV50 pdf
3 Pin Configuration
3.1 Pin Assignment
IFX54441EJV50
IFX54441LDV50
Pin Configuration
OUT
SENSE
1
2
8 IN
7 NC
NC
BYP
36
9
4
5
IFX54441 EJ V50
GND
EN
Figure 2 Pin Configuration of IFX54441EJV50 in PG-DSO-8 Exposed Pad
OUT
OUT
NC
SENSE
BYP
1
2
3
4
5
10 IN
9 IN
8 NC
7 EN
6 GND
IFX54441LD V50
Figure 3 Pin Configuration of IFX54441LDV50 in PG-TSON10
Data Sheet
5 Rev. 1.1, 2014-10-30

5 Page





IFX54441LDV50 arduino
IFX54441EJV50
IFX54441LDV50
Electrical Characteristics
Table 4 Electrical Characteristics (cont’d)
-40 °C < Tj < 125 °C; all voltages with respect to ground; positive current defined flowing out of pin; unless
otherwise specified.
Parameter
Symbol
Values
Unit Note / Test Condition Number
Min. Typ. Max.
Input Reverse Leakage Current
Input Reverse Leakage
Reverse Output Current7)
Ileak,rev
–1
mA VIN = -20 V; VOUT = 0 V P_5.1.31
Reverse Output Current
Output Capacitor6)
IReverse
10 20
µA VOUT = VOUT,nom;
VIN < VOUT,nom;
TJ = 25°C
P_5.1.32
Output Capacitance
ESR
COUT 3.3 –
ESR 8)
3
µF CBYP = 0 nF
P_5.1.33
P_5.1.34
1) This parameter defines the minimum input voltage for which the device is powered up and provides the maximum nominal
output current of 300mA. Under this minimum input voltage condition the IFX54441 V50 starts to be in tracking mode and
the output voltage will typically be in the range of around 1 V while providing the 300 mA.
2) The operation conditions are limited by the maximum junction temperature. The regulated output voltage specification will
only apply for conditions where the limit of the maximum junction temperature is fulfilled. It will therefore not apply for all
possible combinations of input voltage and output current. When operating at maximum input voltage, the output current
must be limited for thermal reasons. The same holds true when operating at maximum output current where the input
voltage range must be limited for thermal reasons.
3) The dropout voltage is the minimum input to output voltage differential needed to maintain regulation at a specified output
current. In dropout, the output voltage will be equal to VIN - VDR.
4) GND-pin current is tested with VIN = VOUT,nom and a current source load. This means that this parameter is tested while being
in dropout condition and thus reflects a worst case condition. The GND-pin current will in most cases decrease slightly at
higher input voltages - please also refer to the corresponding typical performance graphs.
5) The EN pin current flows into EN pin.
6) Not subject to production test, specified by design.
7) Reverse output current is tested with the IN pin grounded and the OUT pin forced to the rated output voltage. This current
flows into the OUT pin and out of the GND pin.
8)
CBYP = 0 nF, COUT
applied capacitance
3.3 µF; please note that for cases where a bypass capacitor at BYP
of COUT and CBYP - a minimum requirement for ESR may apply. For
is used - depending on the actual
further details please also refer to
the corresponding typical performance graph.
Note: The listed characteristics are ensured over the operating range of the integrated circuit. Typical
characteristics specified mean values expected over the production spread. If not otherwise specified,
typical characteristics apply at TA = 25°C and the given supply voltage.
Data Sheet
11 Rev. 1.1, 2014-10-30

11 Page







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