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PDF BGS13S2N9 Data sheet ( Hoja de datos )
| Número de pieza | BGS13S2N9 | |
| Descripción | Wideband RF SP3T Switch | |
| Fabricantes | Infineon | |
| Logotipo |  |
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BGS13S2N9
Wideband RF SP3T Switch
Data Sheet
Revision 1.0 - 2016-02-02
Final
Power Management & Multimarket
1 page  
Confidential
BGS13S2N9 Wideband RF SP3T Switch
1 Features
• 3 high-linearity TRx paths with power handling capability of up to
30 dBm
• Low insertion loss
• Low harmonic generation
• High port-to-port-isolation
• Suitable for Edge / CDMA2000 / LTE / WCDMA applications
• 0.1 to 3.0 GHz coverage
• No decoupling capacitors required if no DC applied on RF lines
• On-chip control logic including ESD protection
• General Purpose Input-Output (GPIO) Interface
• Small form factor 1.1 mm x 1.1 mm x 0.375 mm
• No power supply blocking required
• High EMI robustness
• RoHS and WEEE compliant package
BGS13S2N9
2 Product Description
The BGS13S2N9 RF MOS switch is specifically designed for cell phone and mobile applications. Any of the 3 ports
can be used as termination of the diversity antenna handling up to 30 dBm.
This SP3T offers low insertion loss and high robustness against interferer signals at the antenna port and low
harmonic generation in termination mode. The on-chip controller integrates CMOS logic and level shifters, driven
by control inputs from 1.35 V to VDD . The BGS13S2N9 RF Switch is manufactured in Infineon’s patented MOS
technology, offering the performance of GaAs with the economy and integration of conventional CMOS including the
inherent higher ESD robustness. The device has a very small size of only 1.1 x 1.1 mm2 and a maximum height of
0.375 mm.
No decoupling capacitors are required in typical applications as long as no DC is applied to any RF port.
Table 1: Ordering Information
Type
BGS13S2N9
Package
TSNP-9-3
Data Sheet
5
Marking
R
Revision 1.0 - 2016-02-02
5 Page 
Confidential
Table 10: Mechanical Data
Parameter
X-Dimension
Y-Dimension
Size
Height
Pad-Pitch
Symbol
X
Y
Size
H
Value
1.1 ± 0.05
1.1 ± 0.05
1.21
0.375 ± 0.025
0.4
BGS13S2N9
Unit
mm
mm
mm2
mm
mm
Figure 3: Package Outline (bottom and side view)
0.4
0.25
0.4
0.25
Optionalksolderkmaskkdam
Copper Solderkmask
Figure 4: Land pattern and stencil mask
Stencilkapertures
TSNP-9-3-FPkV01
Data Sheet
11 Revision 1.0 - 2016-02-02
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet BGS13S2N9.PDF ] | |
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