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PDF NCV891334 Data sheet ( Hoja de datos )

Número de pieza NCV891334
Descripción Dual-Mode Step-Down Regulator
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No Preview Available ! NCV891334 Hoja de datos, Descripción, Manual

NCV891234, NCV891334
2 MHz Low-IQ Dual-Mode
Step-Down Regulator for
Automotive
The NCV891x34 is a Dual Mode regulator intended for Automotive,
battery−connected applications that must operate with up to a 45 V
input supply. Hybrid Low Power Mode allows the NCV891x34 to
operate either as a PWM Buck Converter or as a Low Drop−Out Linear
Regulator, and the NCV891x34 is suitable for systems with Low Noise
and Low Quiescent Current requirements often encountered in
automotive driver information systems. A reset (with fixed delay) and
a fault pin (flagging low input voltage and high temperature warnings)
simplify interfacing with a microcontroller.
Two pins are provided to synchronize switching to a clock, or to
another NCV891x34. The NCV891x34 also provides several protection
features expected in automotive power supply systems such as current
limit, short circuit protection, and thermal shutdown. In addition, the
high switching frequency produces low output voltage ripple even
when using small inductor values and an all−ceramic output filter
capacitor – forming a space−efficient switching regulator solution.
Features
40 mA Iq in Light Load Condition
2.0 A Maximum Output Current in PWM Mode in NCV891234
3.0 A Maximum Output Current in PWM Mode in NCV891334
Internal N−channel Power Switch
VIN Operating Range 3.7 V to 36 V, Withstands Load Dump to 45 V
Logic Level Enable Pin can be Tied to Battery
Fixed Output Voltage of 5.0 V or 3.3 V with ±2% Accuracy
2 MHz Free−running Switching Frequency
Input and Output Synchronization Pins
NCV Prefix for Automotive Requiring Site and Control Changes
Wettable Flanks DFN (pin edge plating)
These Devices are Pb−Free and are RoHS Compliant
Typical Applications
Safety−Vision Systems
Audio, Infotainment
Instrumentation
Telematics
VIN
CIN
CDRV
DBST
NCV891x34
VIN SW
CBST
VIN2
BST
L1
DFW
VOUT
COUT
SYNCO
RESET
DRV
SYNCO
RSTB
VOUT
EN
SYNCI
ENABLE
SYNCI
GND
FLTB
FAULT
Figure 1. Application Schematic
www.onsemi.com
1
DFN12
MW SUFFIX
CASE 506CE
MARKING DIAGRAM
891x34
XX
ALYWG
G
891x34XX = Specific Device Code
x = 2, 3
XX = 33, 50
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Device
(Note: Microdot may be in either location)
PIN CONNECTIONS
VIN
VIN2
DRV
SYNCO
RSTB
GND
1
(Top View)
SW
BST
VOUT
EN
SYNCI
FLTB
ORDERING INFORMATION
See detailed ordering and shipping information on page 10 of
this data sheet.
© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 0
1
Publication Order Number:
NCV891334/D

1 page




NCV891334 pdf
NCV891234, NCV891334
Table 3. ELECTRICAL CHARACTERISTICS
VIN = 4.5 to 28 V, VEN = 5 V, VBST = VSW + 3 V, CDRV = 0.1 mF, for typical values TJ = 25°C, min/max values are valid for TJ = −40°C to
150°C unless noted otherwise, and are guaranteed by test, design or statistical correlation (Notes 4, 5)
Parameter
Test Conditions
Symbol
Min Typ Max Unit
SLOPE COMPENSATION
Ramp Slope
(With respect to switch current)
LOW POWER LINEAR REGULATOR
4.5 < VIN < 18 V
20 V < VIN < 28V
Sramp
Sramp(HV)
1.45
0.65
2.0
1.0
2.8 A/ms
1.3
Line Regulation
Load Regulation
Power Supply Rejection
Current Limit
Output clamp current
SHORT CIRCUIT DETECTOR
IOUT = 5 mA, 6 V < VIN < 18 V
VREG(line)
5 25 mV
VIN = 13.2 V, 0.1 mA < IOUT < 50 mA VREG(load)
5 35 mV
VOUT(ripple) = 0.5 Vp−p, F = 100 Hz
PSRR
65 dB
ILIN(lim)
50
80 mA
VOUT = VOUTreg(typ) + 10%
ICL(OUT) 0.5 1.0 1.5 mA
Switching frequency in short−circuit condi-
tion Analog Foldback
Analog foldback – high VIN
Hiccup Mode
RESET
VOUT = 0 V, 4.5 V < VIN < 18 V
VOUT = 0 V, 20 V < VIN < 28 V
kHz
FSWAF
450 550 650
FSWAFHV 225 275 325
FSWHIC 24 32 40
Leakage current into RSTB pin
Output voltage threshold at which the RSTB
signal goes low
Hysteresis on RSTB threshold
Noise−filtering delay
VOUT decreasing
5.0 V option
3.3 V option
VOUT increasing
5.0 V option
3.3 V option
From VOUT < VRESET to
RSTB pin going low
VRESET
VREShys
tfilter
1
4.50 4.625 4.75
2.97 3.05 3.14
25 60 100
17 40 66
10 25
mA
V
mV
ms
Restart Delay time
From VOUT > VRESET + VREShys to
high RSTB
tdelay
14 16 18 ms
Low RSTB voltage
GATE VOLTAGE SUPPLY (DRV pin)
RRSTBpullup = VOUTreg/1 mA, VOUT > 1 V VRSTBlow
0.4 V
Output Voltage
DRV UVLO START Threshold
DRV UVLO STOP Threshold
DRV UVLO Hysteresis
DRV Current Limit
VIN OVERVOLTAGE SHUTDOWN MONITOR
VDRV = 0 V
VDRV
3.1 3.3 3.5 V
VDRVSTT 2.7 2.9 3.05 V
VDRVSTP
2.5
2.8
3.0
V
VDRVHYS
50
200 mV
IDRVLIM
21
50 mA
Overvoltage Stop Threshold
Overvoltage Start Threshold
Overvoltage Hysteresis
ENABLE (EN)
VIN increasing
VIN decreasing
VOVSTP
VOVSTT
VOVHY
36.5 37.7 39.0
36.0 37.3 38.8
0.25 0.40 0.50
V
V
V
Logic low threshold voltage
VENlow
0.8
V
Logic high threshold voltage
VENhigh
2V
EN pin input current
IENbias
0.2
1 mA
4. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
5. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25°C. Low
duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
www.onsemi.com
5

5 Page





NCV891334 arduino
NCV891234, NCV891334
PACKAGE DIMENSIONS
DFN12, 4x4, 0.65P
CASE 506CE
ISSUE O
D AB
LL
PIN ONE
REFERENCE
ÇÇÇÇÇÇ2X
0.15 C
ÇÇÇÇÇÇ2X
0.15 C TOP VIEW
0.10 C
DETAIL B
0.08 C
NOTE 4
(A3)
SIDE VIEW
L1
DETAIL A
E ALTERNATE TERMINAL
CONSTRUCTIONS
ÉÉÇÉÉÇEXPOSED Cu
MOLD CMPD
DETAIL B
A
ALTERNATE
CONSTRUCTION
A1
C
SEATING
PLANE
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMESNION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.25 0.35
D 4.00 BSC
D2 3.30 3.50
E 4.00 BSC
E2 2.40 2.60
e 0.65 BSC
K 0.20 −−−
L 0.30 0.50
L1 −−− 0.15
DETAIL A
K
0.10 M C A B
D2
16
0.10 M C A B
SOLDERING FOOTPRINT*
3.54
12X
0.63
E2
2.64 4.30
12X L
12 7
e
BOTTOM VIEW
12X b
0.10 C A B
0.05 C NOTE 3
0.65
PITCH
12X
0.36
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
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coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
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regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
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NCV891334/D

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