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PDF GS832132GE Data sheet ( Hoja de datos )

Número de pieza GS832132GE
Descripción 36Mb Sync Burst SRAMs
Fabricantes GSI Technology 
Logotipo GSI Technology Logotipo



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No Preview Available ! GS832132GE Hoja de datos, Descripción, Manual

GS832118/32/36E-250/225/200/166/150/133
165-Bump FP-BGA
Commercial Temp
Industrial Temp
2M x 18, 1M x 32, 1M x 36
36Mb Sync Burst SRAMs
250 MHz133 MHz
2.5 V or 3.3 V VDD
2.5 V or 3.3 V I/O
Features
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 165-bump FP-BGA package
• Pb-Free 165-bump BGA package available
Functional Description
Applications
The GS832118/32/36E is a 37,748,736-bit high performance
synchronous SRAM with a 2-bit burst address counter.
Although of a type originally developed for Level 2 Cache
applications supporting high performance CPUs, the device
now finds application in synchronous SRAM applications,
ranging from DSP main store to networking chip set support.
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV) and write control inputs (Bx,
BW, GW) are synchronous and are controlled by a positive-
edge-triggered clock input (CK). Output enable (G) and power
down control (ZZ) are asynchronous inputs. Burst cycles can
be initiated with either ADSP or ADSC inputs. In Burst mode,
subsequent burst addresses are generated internally and are
controlled by ADV. The burst address counter may be
configured to count in either linear or interleave order with the
Linear Burst Order (LBO) input. The Burst function need not
be used. New addresses can be loaded on every cycle with no
degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by
the user via the FT mode pin (Pin 14). Holding the FT mode
pin low places the RAM in Flow Through mode, causing
output data to bypass the Data Output Register. Holding FT
high places the RAM in Pipeline mode, activating the rising-
edge-triggered Data Output Register.
SCD Pipelined Reads
The GS832118/32/36E is a SCD (Single Cycle Deselect)
pipelined synchronous SRAM. DCD (Dual Cycle Deselect)
versions are also available. SCD SRAMs pipeline deselect
commands one stage less than read commands. SCD RAMs
begin turning off their outputs immediately after the deselect
command has been captured in the input registers.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Core and Interface Voltages
The GS832118/32/36E operates on a 2.5 V or 3.3 V power
supply. All input are 3.3 V and 2.5 V compatible. Separate
output power (VDDQ) pins are used to decouple output noise
from the internal circuits and are 3.3 V and 2.5 V compatible.
Parameter Synopsis
-250 -225 -200 -166 -150 -133 Unit
Pipeline
tKQ
tCycle
2.5 2.7 3.0 3.5 3.8 4.0 ns
4.0 4.4 5.0 6.0 6.6 7.5 ns
3-1-1-1 Curr (x18) 285 265 245 220 210 185 mA
Curr (x32/x36) 350 320 295 260 240 215 mA
Flow
Through
2-1-1-1
tKQ
tCycle
Curr (x18)
Curr (x32/x36)
6.5
6.5
205
235
7.0
7.0
195
225
7.5
7.5
185
210
8.0
8.0
175
200
8.5
8.5
165
190
8.5
8.5
155
175
ns
ns
mA
mA
Rev: 1.03 4/2005
1/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology

1 page




GS832132GE pdf
GS832118/32/36E-250/225/200/166/150/133
GS832118/32/36E 165-Bump BGA Pin Description
Symbol
A0, A1
A
DQA
DQB
DQC
DQD
BA, BB, BC, BD
NC
CK
BW
GW
E1
E3
E2
G
ADV
ADSC, ADSP
ZZ
FT
LBO
TMS
TDI
TDO
TCK
MCL
VDD
VSS
VDDQ
Type
I
I
I/O
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
O
I
I
I
I
Description
Address field LSBs and Address Counter Preset Inputs
Address Inputs
Data Input and Output pins
Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low
No Connect
Clock Input Signal; active high
Byte Write—Writes all enabled bytes; active low
Global Write Enable—Writes all bytes; active low
Chip Enable; active low
Chip Enable; active low
Chip Enable; active high
Output Enable; active low
Burst address counter advance enable; active l0w
Address Strobe (Processor, Cache Controller); active low
Sleep mode control; active high
Flow Through or Pipeline mode; active low
Linear Burst Order mode; active low
Scan Test Mode Select
Scan Test Data In
Scan Test Data Out
Scan Test Clock
Must Connect Low
Core power supply
I/O and Core Ground
Output driver power supply
Rev: 1.03 4/2005
5/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology

5 Page





GS832132GE arduino
GS832118/32/36E-250/225/200/166/150/133
Simplified State Diagram with G
X
Deselect
WR
WR
X
First Write
CW
R
CR
W First Read X
CW CR
W
X
R
Burst Write
CR
CW
R
W Burst Read X
CW
CR
Notes:
1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use of G.
2. Use of “Dummy Reads” (Read Cycles with G High) may be used to make the transition from read cycles to write cycles without passing
through a deselect cycle. Dummy read cycles increment the address counter just like normal read cycles.
3. Transitions shown in gray tone assume G has been pulsed high long enough to turn the RAM’s drivers off and for incoming data to meet
Data Input Set Up Time.
Rev: 1.03 4/2005
11/32
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology

11 Page







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