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PDF MASW-009276-000DIE Data sheet ( Hoja de datos )

Número de pieza MASW-009276-000DIE
Descripción Bumped GaAs SP3T Switch
Fabricantes MA-COM 
Logotipo MA-COM Logotipo



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MASW-009276-000DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Rev. V2
Features
802.11b/g and Bluetooth Applications
Low Insertion Loss:
0.5 dB 2.4 GHz to 2.5 GHz band
High Isolation: 32 dB Typical on RX
Low Harmonics: <-70 dBc @ 20 dBm
Flip-chip configuration
RoHS* Compliant
Description
The MASW-009276-000DIE is a bumped GaAs
pHEMT MMIC SP3T switch. Typical applications are
WLAN (802.11 b/g) and Bluetooth applications.
Die Bump Pad Layout (bump side up)
The MASW-009276-000DIE delivers high
isolation, low insertion loss, and high linearity at
2.4 - 2.5 GHz. This device is fabricated using a
0.5 micron gate length GaAs pHEMT process.
The process features full passivation for
performance and reliability. This die features
SnAg (2.5%) solder bumps for Wafer Level Chip
Scale Package (WLCSP) applications.
Ordering Information
Part Number
Package
MASW-009276-000D3K
Die in 3000 piece reel
MASW-009276-001SMB
Sample Board SP3T
Die Bump Pad Configuration
Name
VC1
BT
GND
RX
VC3
TX
VC2
RFC
Description
Voltage Control 1
Blue Tooth TX/RX Port
Ground
2.5 GHz RX Port
Voltage Control 3
2.5 GHz TX Port
Voltage Control 2
Antenna Port
Absolute Maximum Ratings 1,2
Parameter
Absolute Maximum
Input Power @ 3 V Control
+32 dBm
Input Power @ 5 V Control
+35 dBm
Operating Voltage
Operating Temperature
+8 volts
-40°C to +85°C
Storage Temperature
-65°C to +150°C
1. Exceeding any one or combination of these limits may cause
permanent damage to this device.
2. M/A-COM Technology does not recommend sustained
operation near these survivability limits.
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
India Tel: +91.80.43537383
China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.

1 page




MASW-009276-000DIE pdf
MASW-009276-000DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Die Dimensions (Top and Side Views)
PCB Top Metal / Solder Mask
Rev. V2
Die Bump Pad Layout - Top View
(bump side up)
Die Bump Pad Layout - Bottom View
(bump side down - as installed on board)
8. Orientation mark is only on material that is shipped in tape and
reel. The mark is not available on die shipped on grip ring.
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
India Tel: +91.80.43537383
China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.

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