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PDF MASW-009359 Data sheet ( Hoja de datos )

Número de pieza MASW-009359
Descripción GaAs Broadband High Power SP3T Switch
Fabricantes MA-COM 
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No Preview Available ! MASW-009359 Hoja de datos, Descripción, Manual

MASW-009359
GaAs Broadband High Power SP3T Switch
DC - 4.0 GHz
Features
CDMA Handset Switching Applications
Balanced (symmetrical) RF Ports
Low Cross Modulation
Low Insertion Loss: 0.55 dB @ 1 GHz
High Isolation: 27 dB @ 1 GHz
High Power: P0.1dB = 36 dBm @ 1 GHz
0.5 micron GaAs pHEMT Process
Lead-Free 2 mm 12-Lead STQFN with 0.4 mm
lead pitch package
Halogen-Free ―Green‖ Mold Compound
RoHS* Compliant and 260°C Reflow Compatible
Description
M/A-COM’s MASW-009359 is an industry leading
GaAs PHEMT MMIC single pole three throw (SP3T)
CDMA-GPS switch in a lead-free 2 mm 12-lead
STQFN package with 0.4 mm lead pitch. The
MASW-009359 is uniquely configured to enable
switching from a common antenna port to CDMA
cellular, CDMA PCS, or GPS ports. It is also ideal
for other applications where a compact, high
performance, symmetrical SP3T switch is required.
The design is symmetric and has been fully opti-
mized for excellent cross modulation performance in
all three paths while still maintaining excellent inser-
tion loss and isolation. The symmetrical design
allows the user to assign CDMA cellular, CDMA
PCS and GPS to ports RF1, RF2 or RF3 to optimize
the layout.
The MASW-009359 is fabricated using a 0.5 micron
gate length GaAs pHEMT process. The process
features full passivation for performance and
reliability.
Ordering Information1,2
Part Number
Package
MASW-009359-TR3000
3000 piece reel
MASW-009359-001SMB
Sample Board
0.05 - 4.0 GHz Tuning
1. Reference Application Note M513 for reel size information.
2. All sample boards include 5 loose parts.
Functional Schematic
GND RFC GND
12
V3 1
Rev. V1
V1
RF3 RF1
GND
GND
GND RF2
V2
Pin Configuration 3
Pin No.
Function
Description
1 V3
Control 3
2 RF3
RF Port 3
3 GND
Ground
4 GND
Ground
5 RF2
RF Port 2
6 V2
Control 2
7 GND
Ground
8 RF1
RF Port 1
9 V1
Control 1
10 GND
Ground
11 RFC
RF Common
12 GND
Ground
13 GND (paddle)
Ground
3. All package ground pins (P3,4,7,10, 12) and paddle ground
are no connection (N/C) electrically to the internal die. M/A-
COM recommends connecting all ground connections to
PCB ground to ensure a good thermal path.
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support

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MASW-009359 pdf
MASW-009359
GaAs Broadband High Power SP3T Switch
DC - 4.0 GHz
Application Schematic 10,11
VC3 VC1
12
1
V3
RF3
GND
V1
RF1
GND
VC2
Rev. V1
Qualification
Qualified to M/A-COM specification REL-201,
Process Flow 2.
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
Gallium Arsenide Integrated Circuits are sensitive
to electrostatic discharge (ESD) and can be
damaged by static electricity. Proper ESD control
techniques should be used when handling these
devices.
10. The exposed pad centered on the package bottom must be
connected to ground to ensure a good thermal path.
11. All blocking and decoupling capacitors = 1000 pF
Lead-Free 2 mm STQFN-12LD-0.4mm Pitch
Reference Application Note S2083 for lead-free solder reflow recommendations.
Meets JEDEC moisture sensitivity level 1 requirements.
Plating is Ni/Pd/Au over Copper.
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support

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