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Número de pieza | MA4SPS402 | |
Descripción | PIN Diode | |
Fabricantes | MA-COM | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de MA4SPS402 (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
No Preview Available ! MA4SPS402
SURMOUNTTM PIN Diode
RoHS Compliant
Features
Surface Mount
No Wire Bonding Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
Higher Average and Peak Power Handling
RoHS Compliant
Description
This device is a Silicon-Glass PIN diode chip
fabricated with M/A-COM Technology Solutions pat-
ented HMICTM process. This device features two
silicon pedestals embedded in a low loss, low dis-
persion glass. The diode is formed on the top of one
pedestal and connections to the backside of the de-
vice are facilitated by making the pedestal sidewalls
electrically conductive. Selective backside
metallization is applied producing a surface mount
device. This vertical conic topology provides for
exceptional heat transfer from the active area. The
topside is fully encapsulated with silicon nitride and
has an additional polymer layer for scratch and
impact protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and assembly.
Applications
These surmount devices are suitable for usage in
moderate incident power (5W C.W.) or higher
incident peak power (50W) series, shunt, or
series-shunt switches. Lower parasitic inductance,
0.45nH, and excellent RC constant (0.23pS), make
the devices ideal for higher frequency switch
elements compared to their plastic device
counterparts.
Rev V6
1. Backside metal: 0.1 µM thick.
2. Yellow hatched areas indicate backside ohmic gold
INCHES
MM
DIM
Min. Max. Min. Max.
A 0.046 0.051 1.170 1.290
B 0.017 0.021 0.432 0.533
C 0.004 0.006 0.102 0.203
D 0.015 0.017 0.381 0.432
E 0.014 0.016 0.356 0.406
Absolute Maximum Ratings @ TAMB = 25°C
(unless otherwise specified)
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated Power
( RF & DC )
Mounting Temperature
Absolute Maximum
250mA
-100V
-55°C to +125°C
-55 °C to +150°C
+175°C
1W
+280°C for 30 seconds
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1 page MA4SPS402
SURMOUNTTM PIN Diode
RoHS Compliant
RP as a Function of Reverse Voltage and Frequency
1.E+06
MA4SPS402 Rp vs V at 100 MHz and 1,000 MHz
1.E+05
Rp @ 100 MHz
Rp @ 1000 MHz
Rev V6
1.E+04
0.00
10.00
20.00
Reverse Voltage ( V )
30.00
40.00
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
5 Page |
Páginas | Total 8 Páginas | |
PDF Descargar | [ Datasheet MA4SPS402.PDF ] |
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