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PDF TGL2203 Data sheet ( Hoja de datos )
| Número de pieza | TGL2203 | |
| Descripción | Ka-Band 1 W VPIN Limiter | |
| Fabricantes | TriQuint Semiconductor | |
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Applications
• Receive Chain Protection
• Commercial and Military Radar
TGL2203
Ka-Band 1 W VPIN Limiter
Product Features
• Frequency Range: 30 - 38 GHz
• Insertion Loss: < 1 dB
• Peak Power Handling: 1 W
• Flat Leakage: ≤ 20 dBm at PIN < 30 dBm
• Spike Leakage: ≤ 20 dBm at PIN < 30 dBm
• Return Loss: > 12 dB
• Passive (no DC bias required)
• Integrated DC Block on input and output
• Chip Dimensions: 1.35 x 1.15 x 0.1 mm
Functional Block Diagram
General Description
The TriQuint TGL2203 is a wideband MMIC GaAs VPIN
limiter capable of protecting sensitive receive channel
components against high power incident signals. The
TGL2203 does not require DC bias and achieves a low
insertion loss all in a small form factor. These features
allow for simple integration with minimal impact to system
performance.
The TGL2203 operates from 30 to 38 GHz and achieves
low insertion loss of 1 dB and a return loss of >12 dB; it
can limit up to 1 W incident power with a low flat leakage
of 20 dBm. The TGL2203 is ideally suited to support both
commercial and defense related applications.
Lead-free and RoHS compliant.
Pin Configuration
Pin No.
Symbol
1 RFIN
2 RFOUT
Notes:
1. RF input and output ports are not interchangeable.
Ordering Information
Part
TGL2203
ECCN
EAR99
Description
Ka-Band 1 W VPIN
Limiter
Preliminary Datasheet: Rev A 08-26-16
© 2016 TriQuint
- 1 of 6 -
Disclaimer: Subject to change without notice
www.triquint.com
1 page  
TGL2203
Ka-Band 1 W VPIN Limiter
Assembly Notes
Component placement and adhesive attachment assembly notes:
• Vacuum pencils and/or vacuum collets are the preferred method of pick up.
• Air bridges must be avoided during placement.
• The force impact is critical during auto placement.
• Solder or Organic Adhesive attachment can be used for TGL2203.
• Curing should be done in a convection oven; proper exhaust is a safety concern.
Solder attachment reflow process assembly notes:
• Use AuSn (80/20) solder and limit exposure to temperatures above 300°C to 3 to 4 minutes, maximum.
• An alloy station or conveyor furnace with reducing atmosphere should be used.
• Do not use any kind of flux.
• Coefficient of thermal expansion matching is critical for long-term reliability.
• Devices must be stored in a dry nitrogen atmosphere.
Organic adhesive attachment assembly notes:
• The organics such as epoxy or polyimide can be used.
• Epoxies cure at temperatures of 100 to 200°C.
Interconnect process assembly notes:
• Thermosonic ball bonding is the preferred interconnect technique.
• Force, time, and ultrasonics are critical parameters.
• Aluminum wire should not be used.
• Devices with small pad sizes should be bonded with 0.0007-inch wire.
Preliminary Datasheet: Rev A 08-26-16
© 2016 TriQuint
- 5 of 6 -
Disclaimer: Subject to change without notice
www.triquint.com
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet TGL2203.PDF ] | |
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