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PDF TGL2927-SM Data sheet ( Hoja de datos )
| Número de pieza | TGL2927-SM | |
| Descripción | 200 Watt VPIN Limiter | |
| Fabricantes | TriQuint Semiconductor | |
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Applications
• Receive Chain Protection
• Commercial and Military Radar
• Communications
• Electronic Warfare
TGL2927-SM
2 – 4 GHz 200 Watt VPIN Limiter
Product Features
• Frequency Range: 2 to 4 GHz
• Insertion Loss: < 0.6 dB
• Peak Power Handling: 200 W (pulsed)
• Flat Leakage: < 18 dBm
• Passive (no DC bias required)
• Integrated DC Block on output
• Package Dimensions: 4.0 mm x 4.0 mm x 0.85 mm
Functional Block Diagram
General Description
The Qorvo TGL2927-SM is a high-power receive
protection circuit (limiter) operating from 2-4
GHz. Capable of withstanding up to 200 W incident
power levels, the TGL2927-SM allows < 18 dBm flat
leakage to pass through and contributes < 0. 6dB in
insertion loss.
Using Qorvo’s passive GaAs VPIN technology, the
TGL2927-SM does not require bias and is offered in a
small 4 x 4 (mm) plastic overmold package. This
simplifies system integration while maximizing
performance and protection.
The TGL2927-SM is ideal for commercial and military
radar applications where protecting sensitive receive
components from damage is critical.
Lead-free and RoHS compliant.
Evaluation Boards available on request.
Pad Configuration
Pad Number
Symbol
3 RF Input
14 RF Output
1, 2, 4-13, 15-20
No Connection
21 (slug)
GND
NOTE: the RF Input and Output ports are not
interchangeable.
Ordering Information
Part
TGL2927-SM
TGL2927-SM_EVB
ECCN
EAR99
EAR99
Description
200W S-Band VPIN
Limiter
200 W S-Band VPIN
Limiter Eval. Board
Datasheet: Rev - 06-26-15
© 2015 Qorvo
- 1 of 9 -
Disclaimer: Subject to change without notice
www.Qorvo.com
1 page  
Evaluation Board and Mounting Detail
TGL2927-SM
2 – 4 GHz 200 Watt VPIN Limiter
RF Layer is 0.010” thick Rogers Corp. RO4003C, εr = 3.38. Metal layers are 0.5 oz. copper. The microstrip line at the
connector interface is optimized for the Southwest Microwave end launch connector 1092-02A-5.
The trace pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The
PCB land pattern has been developed to accommodate lead tolerances. Since processes vary from company to
company, careful process development is recommended.
For pulsed applications only. Increased pulse width and/or duty cycle results in lower power handling capability of
the EVB.
Notes:
1. Ground / thermal vias under the DUT are critical for the proper performance of this device.
2. The EVB shown herein utilizes copper filled vias (10 mil diameter) under the DUT to maximize heat transfer
away from the DUT under large signal conditions.
3. Thermal dissipation is low for normal non-limiting operation.
Datasheet: Rev - 06-26-15
© 2015 Qorvo
- 5 of 9 -
Disclaimer: Subject to change without notice
www.Qorvo.com
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| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet TGL2927-SM.PDF ] | |
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