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PDF CBTL02042A Data sheet ( Hoja de datos )

Número de pieza CBTL02042A
Descripción 2 : 1 multiplexer/demultiplexer switch
Fabricantes NXP Semiconductors 
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CBTL02042A; CBTL02042B
3.3 V, 2 differential channel, 2 : 1 multiplexer/demultiplexer
switch for PCI Express Gen2
Rev. 1 — 10 March 2011
Product data sheet
1. General description
CBTL02042A/B is a 2 differential channel, 2-to-1 multiplexer/demultiplexer switch for PCI
Express Generation 2 (Gen2), and other high-speed serial interface applications. The
CBTL02042A/B can switch two differential signals to one of two locations. Using a unique
design technique, NXP has minimized the impedance of the switch such that the
attenuation observed through the switch is negligible, and also minimized the
channel-to-channel skew as well as channel-to-channel crosstalk, as required by the
high-speed serial interface. CBTL02042A/B allows expansion of existing high speed ports
for extremely low power.
The device's pinouts are optimized to match different application layouts. CBTL02042A
has input and output pins on the opposite of the package, and is suitable for edge
connector(s) with different signal sources on the motherboard. CBTL02042B has outputs
on both sides of the package, and the device can be placed between two connectors to
multiplex differential signals from a controller. Please refer to Section 8 for layout
examples.
2. Features and benefits
„ 2 bidirectional differential channel, 2 : 1 multiplexer/demultiplexer
„ High-speed signal switching for PCIe Gen2 5 Gbit/s
„ High bandwidth: 7 GHz at 3 dB
„ Low insertion loss:
‹ 0.5 dB at 100 MHz
‹ 1.2 dB at 2.5 GHz
„ Low intra-pair skew: 5 ps typical
„ Low inter-pair skew: 35 ps maximum
„ Low crosstalk: 30 dB at 2.5 GHz
„ Low off-state isolation: 25 dB at 2.5 GHz
„ Low return loss: 20 dB at 2.5 GHz
„ VDD operating range: 3.3 V ± 10 %
„ Shutdown pin (XSD) for power-saving mode
‹ Standby current less than 1 μA
„ ESD tolerance:
‹ 8 kV HBM
‹ 1 kV CDM
„ DHVQFN20 package

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CBTL02042A pdf
NXP Semiconductors
CBTL02042A; CBTL02042B
3.3 V, 2 differential channel, 2 : 1 MUX/deMUX switch for PCIe Gen2
8. Application design-in information
MINI CARD/
mSATA
CONNECTOR
CBTL02042A
eSATA
CONTROLLER
PCIe
CONTROLLER
eSATA/USB 3.0
COMBO
CONNECTOR
CBTL02042A
Fig 3. Applications using CBTL02042A
eSATA
CONTROLLER
USB 3.0
CONTROLLER
002aaf776
USB 3.0
CONTROLLER
CBTL02042B
USB 3.0
CONNECTOR
USB 3.0
CONNECTOR
Fig 4. Application using CBTL02042B
002aaf777
CBTL02042A_CBTL02042B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 March 2011
© NXP B.V. 2011. All rights reserved.
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CBTL02042A arduino
NXP Semiconductors
CBTL02042A; CBTL02042B
3.3 V, 2 differential channel, 2 : 1 MUX/deMUX switch for PCIe Gen2
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
CBTL02042A_CBTL02042B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 10 March 2011
© NXP B.V. 2011. All rights reserved.
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