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PDF IS31SE5000 Data sheet ( Hoja de datos )
| Número de pieza | IS31SE5000 | |
| Descripción | IR SENSOR | |
| Fabricantes | ISSI | |
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IS31SE5000
IR SENSOR FOR TOUCHLESS MOTION AND PROXIMITY
October 2012
GENERAL DESCRIPTION
The IS31SE5000 is a low-power, reflectance-based
infrared light sensor with advanced signal processing
and digital output. The sensor can detect making
touchless motion possible.
The IS31SE5000 uses one infrared LED and
2-channel receivers which pick up the reflectance
signal from the 2 photodiodes to perform touchless
motion detection. When horizontal motion or proximity
motion happen, the flag bits in status register will be
triggered and an interrupt signal is generated to
inform the master to read the flag bit through
I2Cinterface.
IS31SE5000 is available in UTQFN-12 (2mm × 2mm).
It operates from 2.7V to 5.5V over the temperature
range of -40°C to +85°C.
FEATURES
Supply voltage from 2.7V~5.5V
400kHz I2C compatible interface
1µA shutdown current
0.6mA low supply current
Detection range can be adjusted
Motion Mode and Proximity Mode
Integrated signal processing and digital output
Auto interrupt clear
Package in UTQFN-12 (2mm × 2mm)
APPLICATIONS
Smart phones/GPS/MID/PAD/MP3
Lighting/switch controller/
household electrical appliances
Toys/game machine
TYPICAL APPLICATION CIRCUIT
Micro
Controller
VBattery
10
VCC
1 F 0.1 F
11
IRLED
VDD
4.7k 4.7k 4.7k
100k
8
IS31SE5000 RX1
4
SDA
37
SCL RX2
2
INTB
1
SDB 12
GND
VBattery
IRLED
PD1
PD2
PD1 IRLED PD2
LCD
Figure 1 Typical Application Circuit (Motion Mode)
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 10/11/2012
1
1 page  
IS31SE5000
ABSOLUTE MAXIMUM RATINGS
Supply voltage, VCC
Voltage at any input pin
Maximum junction temperature, TJMAX
Operating temperature range, TA
-0.3V ~ +6.0V
-0.3V ~ VCC+0.3V
150°C
-40°C ~ +85°C
Storage temperature range, TSTG
-65°C ~ +150°C
Note:
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
TA = 25°C, VCC = 2.7V ~ 5.5V, unless otherwise noted. Typical value are TA = +25°C, VCC = 3.6V.
Symbol
Parameter
Condition
Min. Typ. Max.
VCC Supply voltage
ICC Quiescent current
ISD Shutdown current
IIR Average current of IRLED
IP Peak current of IRLED
VINT INTB pin output voltage low
L Maximum detect distance
VIH Input logic high voltage
VIL Input logic low voltage
VSDB = VCC
VSDB = 0V
VLED =3.6V(Note 1)
EC = “000” (Note 1,2)
IOL = 4mA
EC = “000” (Note 3)
VCC = 2.7V
VCC = 5.5V
2.7 5.5
0.6
13
0.8
400
0.2
9
0.4
1.4
Unit
V
mA
μA
mA
mA
V
cm
V
V
DIGITAL INPUT SWITCHING CHARACTERISTICS (Note 1)
Symbol
Parameter
Condition Min.
Typ.
Max. Unit
fSCL Serial-Clock frequency
tBUF
Bus free time between a STOP and a START
condition
1.3
400 kHz
μs
tHD, STA
tSU, STA
tSU, STO
tHD, DAT
tSU, DAT
tLOW
tHIGH
tR
Hold time (repeated) START condition
Repeated START condition setup time
STOP condition setup time
Data hold time
Data setup time
SCL clock low period
SCL clock high period
Rise time of both SDA and SCL signals,
receiving
(Note 4)
0.6
0.6
0.6
0.9
100
1.3
0.7
20+0.1Cb 300
μs
μs
μs
μs
ns
μs
μs
ns
tF
Fall time of both SDA and SCL signals,
receiving
(Note 4)
20+0.1Cb 300 ns
Note 1: Guaranteed by design.
Note 2: The EC bit is used to set the emitting current. Please refer to the detailed information in Page 8.
Note 3: Because of different IRLED, receive LED and material of cover, the detection distance will be different. The detail parameter should be
tested. IR11-21C/TR8 (for IRLED) and PD15-22C-R/TR8 (for PD) is recommended.
Note 4: Cb = total capacitance of one bus line in pF. ISINK ≤ 6mA. tR and tF measured between 0.3 × VCC and 0.7 × VCC.
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 10/11/2012
5
5 Page 
IS31SE5000
CLASSIFICATION REFLOW PROFILES
Profile Feature
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate (Tsmax to Tp)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (Tp)*
Time (tp)** within 5°C of the specified
classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to peak temperature
Pb-Free Assembly
150°C
200°C
60-120 seconds
3°C/second max.
217°C
60-150 seconds
Max 260°C
Max 30 seconds
6°C/second max.
8 minutes max.
Figure 9 Classification Profile
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 10/11/2012
11
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